Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20718738 | 0.88 | LMNA (0.46) | LMNA | |
| SCHEMBL5440519 | 0.83 | LMNA (0.57) | LMNATHRB | |
| SCHEMBL14920988 | 0.82 | MEN1 (0.41) | LMNA | |
| SCHEMBL3453066 | 0.81 | — | — | |
| SCHEMBL2928095 | 0.78 | LMNA (0.32) | LMNA | |
| SCHEMBL9459 | 0.78 | — | — | |
| SCHEMBL2094168 | 0.78 | LMNA (1.00) | LMNATHRB | |
| SCHEMBL4599059 | 0.77 | — | — | |
| SCHEMBL65109 | 0.77 | PIK3CD (0.30) | — | |
| SCHEMBL3504284 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1359 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260086457-A1 | RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-26 | — | — | US | disclosed |
| US-20260086458-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-26 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-20260079394-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND AND ACID DIFFUSION CONTROL AGENT | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-19 | — | — | US | disclosed |
| US-20260079395-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-19 | — | — | US | disclosed |
| US-12566376-B2 | Resist composition and resist pattern forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-20260050211-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND INTERMEDIATE THEREOF | TOKYO OHKA KOGYO CO LTD (JP) | 2026-02-19 | — | — | US | disclosed |
| US-20260003277-A1 | NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003282-A1 | PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20250390017-A1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND ACID GENERATION AGENT | TOKYO OHKA KOGYO CO LTD (JP) | 2025-12-25 | — | — | US | disclosed |
| US-6117621-A | APPLYING A CHEMICALLY AMPLIFIED POSITIVE RESIST OF A POLYMER WITH ACID LABILE GROUPS, A PHOTOACID GENERATOR AND A ORGANIC SOLVENT; RESOLUTION AND FOCAL DEPTH; EXPOSING, BAKING, AND DEVELOPING; CALIBRATION OF EXPOSURES AND DISSOLUTION RATES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-09-12 | — | — | US | disclosed |
| EP-1031879-A1 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-08-30 | — | — | EP | disclosed |
| EP-1004568-A2 | Novel ester compounds, polymers, resist compositions and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-05-31 | — | — | EP | disclosed |
| US-6066433-A | SILICONE POLYMER CONTAINING PHENOLIC HYDROXYL GROUPS HAVING HYDROGEN ATOMS OF SOME PHENOLIC HYDROXYL GROUPS REPLACED BY ACID LABILE GROUPS, CROSSLINKED AT SOME OF THE REMAINING PHENOLIC HYDROXYL GROUPS WITH GROUPS HAVING ETHER LINKAGES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-05-23 | — | — | US | disclosed |
| US-6048661-A | POLYMER WITH HYDROXY AND CARBOXY GROUPS AND ETHER ESTER GROUPS FOR PHOTORESISTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-04-11 | — | — | US | disclosed |
| US-6033828-A | POLYVINYLPHENOL DERIVATIVES | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2000-03-07 | — | — | US | disclosed |
| US-6027854-A | ACTINIC RADIATION-SENSITIVE, CROSSLINKED TERPOLYMER CONTAINING STYRENIC GROUPS RING-SUBSTITUTED WITH HYDROXYL, HYDROXYALKYLOXY, CARBOXYALKYLOXY MOIETIES AND ACID LABILE GROUPS; ETCHING AND HEAT RESISTANCE | SHIN-ETSU CHEMICAL CO., LTD. | 2000-02-22 | — | — | US | disclosed |
| US-5972560-A | A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-10-26 | — | — | US | disclosed |
| EP-0908473-A1 | Styrene polymers, chemically-amplified positive resist compositions, their preparation and use in a patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-04-14 | — | — | EP | disclosed |
| EP-0908783-A1 | Resist compositions, their preparation and use for patterning processes | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-04-14 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (10 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250390017-A1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, COMPOUND, AND ACID GENERATION AGENT | IGF1R, SLC11A2, ITGB1 | LMNA 498/4885THRB 136/4885 |
| US-20260086458-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND | RER1, ITGA1, AR | LMNA 1206/4885THRB 412/4885 |
| US-20260086457-A1 | RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD | CCND2, CCNA1, CCND1 | LMNA 370/4885THRB 2596/4885 |
| US-20260003282-A1 | PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM | H1-4, H1-10, H1-0 | LMNA 356/4885THRB 554/4885 |
| US-20260003277-A1 | NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM | H1-4, H1-10, H1-0 | LMNA 320/4885THRB 340/4885 |
| US-20260079395-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT | F9, AFF2, AFF1 | LMNA 1829/4885THRB 932/4885 |
| US-20260050211-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND INTERMEDIATE THEREOF | RARG, RXRG, IGF1R | LMNA 209/4885THRB 221/4885 |
| US-12566376-B2 | Resist composition and resist pattern forming method | RER1, REV1, GAR1 | LMNA 1466/4885THRB 400/4885 |
| US-20260079394-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND AND ACID DIFFUSION CONTROL AGENT | DRD1, DRD2, FANCD2 | LMNA 1237/4885THRB 3264/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | LMNA 2609/4885THRB 1669/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.