⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL68422 | 0.89 | MAOA (0.33) | — | |
| SCHEMBL2678990 | 0.84 | — | — | |
| SCHEMBL24206 | 0.78 | MAOA (0.46) | — | |
| SCHEMBL71211 | 0.74 | — | — | |
| SCHEMBL6038298 | 0.71 | — | — | |
| SCHEMBL24657 | 0.70 | MAOA (0.46) | — | |
| SCHEMBL27537566 | 0.68 | MAOA (0.67) | — | |
| SCHEMBL5556681 | 0.68 | — | — | |
| SCHEMBL2238415 | 0.67 | NPC1 (0.32) | — | |
| SCHEMBL27854841 | 0.66 | METAP2 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6773866-B2 | AROMATIC POLYIMIDE PRECURSOR, WHEREIN A 10 MU M THICK POLYIMIDE FILM MADE FROM THE RESIN AND DEPOSITED ON A SILICON SUBSTRATE HAS LIGHT TRANSMITTANCE AT A WAVELENGTH OF 365 NM OF AT LEAST 1% AND A RESIDUAL STRESS OF AT MOST 25 MPA. | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. | 2004-08-10 | — | — | US | disclosed |
| US-20020098444-A1 | Photosensitive resin composition, patterning method, and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. (US) | 2002-07-25 | — | — | US | disclosed |
| US-6342333-B1 | HEAT RESISTANT PHOTORESISTS; AROMATIC POLYIMIDE PRECURSORS HAVING AN INCREASED I-LINE TRANSPARENCY WHICH CAN BE IMIDIZED RESINS WITH LOW COEFFICIENT OF THERMAL EXPANSION AND LOW MECHANICAL STRESS ON SILICON WAFERS; HIGH RESOLUTION; AQUEOUS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, L.L.C. | 2002-01-29 | — | — | US | disclosed |
| EP-1087263-A2 | Photosensitive resin composition, pattering method, and electronic components | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2001-03-28 | — | — | EP | disclosed |