SCHEMBL6538622

SCHEMBL6538622

Nc1cc(-c2ccc(NC(=O)c3ccco3)c(N)c2)ccc1NC(=O)c1ccco1

nearest known ligand 0.63

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
GFER P55789 1/20 0.63
HDAC1 Q13547 1/20 0.60
PTPN2 P17706 1/20 0.58
PTPN1 P18031 1/20 0.58
PTPN6 P29350 1/20 0.58
PTPN11 Q06124 1/20 0.58
SMN1; SMN2 Q16637 4/20 0.57
PKM P14618 1/20 0.56
TSHR P16473 1/20 0.55
KMT2A Q03164 3/20 0.54
MEN1 O00255 2/20 0.54
MAPT P10636 2/20 0.54
ESR2 Q92731 1/20 0.54
GAA P10253 3/20 0.54
NPC1 O15118 3/20 0.52
KCNMA1 Q12791 1/20 0.52
TP53 P04637 1/20 0.52
RAB9A P51151 3/20 0.52
ATM Q13315 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10752115 0.81 ALDH1A1 (0.73) GFERSMN1; SMN2PKMKMT2AMEN1
SCHEMBL13219548 0.78 GFER (1.00) GFERSMN1; SMN2KMT2AMEN1MAPT
SCHEMBL22983097 0.78 PKM (0.66) GFERPTPN2PTPN1PTPN6PTPN11
SCHEMBL6538236 0.77 SMN1; SMN2 (0.77) HDAC1PTPN2PTPN1PTPN6PTPN11
SCHEMBL6815137 0.75 GFER (0.71) GFERHDAC1SMN1; SMN2PKMTSHR
SCHEMBL20163156 0.75 HDAC2 (0.60)
SCHEMBL14654842 0.74 LMNA (0.63) GFERSMN1; SMN2PKMTSHRKMT2A
SCHEMBL2272656 0.74 HDAC1 (0.74) HDAC1PTPN2PTPN1PTPN6PTPN11
SCHEMBL13219529 0.74 KCNMA1 (0.68) GFERSMN1; SMN2TSHRKMT2AMAPT
SCHEMBL12838359 0.73 NPC1 (0.70) SMN1; SMN2TSHRKMT2AMEN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6709804-B2 Printed wiring board and semiconductor device and processes to prepare the same RIKEN (JP) 2004-03-23 US disclosed
US-20030194621-A1 Polyamic acid or a polyimide which has substituents having a cis-diene structure at the side chains, e.g., cyclopentadiene-, furan- or thiophene-groups RIKEN (JP) 2003-10-16 US disclosed
US-6528231-B1 Photosensitive resin composition can form a resin layer having excellent heat resistance RIKEN (JP) 2003-03-04 US disclosed