SCHEMBL66141

SCHEMBL66141

CS(=O)(=O)ON1C(=O)c2ccccc2C1=O

nearest known ligand 0.61

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 10/20 0.61
ALDH1A1 P00352 10/20 0.61
MAPT P10636 8/20 0.61
KMT2A Q03164 7/20 0.61
HPGD P15428 7/20 0.61
VDR P11473 3/20 0.61
MEN1 O00255 4/20 0.56
F2 P00734 4/20 0.56
HTT P42858 3/20 0.56
XBP1 P17861 2/20 0.56
LMNA P02545 2/20 0.56
CYP1A2 P05177 1/20 0.56
CYP3A4 P08684 1/20 0.56
CYP2C19 P33261 1/20 0.56
NPSR1 Q6W5P4 1/20 0.56
SMN1; SMN2 Q16637 1/20 0.56
GAA P10253 1/20 0.46
CASP3 P42574 1/20 0.45
THRB P10828 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2238574 0.83 ALDH1A1 (0.65) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL3683874 0.83 KDM4E (0.44) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL29217852 0.83 ALDH1A1 (0.66) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL7776318 0.80 ALDH1A1 (0.59) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL11025467 0.79 ALDH1A1 (0.61) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL9064541 0.79 ALDH1A1 (0.61) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL9130722 0.79 PTGS2 (0.47) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL5370317 0.79 KDM4E (0.56) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL3823934 0.78 POLB (0.49) KDM4EALDH1A1MAPTKMT2AHPGD
SCHEMBL65319 0.77 MAPT (0.47) KDM4EALDH1A1MAPTKMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 848 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102768466-A Chemical amplification type positive photoresist, preparation method and application thereof in two-photon fine processing CHINESE ACAD TECH INST PHYSICS 2012-11-07 CN claimed
CN-102768467-A Sensitizer for chemical amplification type positive photoresist and application thereof in preparation of chemical amplification type positive photoresist CHINESE ACAD TECH INST PHYSICS 2012-11-07 CN claimed
US-6841332-B2 Photoresist compound and method for structuring a photoresist layer INFINEON TECHNOLOGY AG (DE) 2005-01-11 US claimed
US-6746827-B2 INCLUDING A FILM-FORMING POLYMER CONTAINING MOLECULE GROUPS CONVERTABLE INTO ALKALI-SOLUBLE GROUPS BY ACID-CATALYZED REACTION, A PHOTOACID GENERATOR AND A THERMOBASE GENERATOR; SEMICONDUCTORS; CROSSLINKING INHIBITION; ACCURACY; SMOOTHNESS INFINEON TECHNOLOGIES AG (DE) 2004-06-08 US claimed
US-20030022111-A1 Photoresist compound and method for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2003-01-30 US claimed
US-20020160315-A1 Process for structuring a photoresist layer POLARIS INNOVATIONS LIMITED (IE) 2002-10-31 US claimed
US-6096478-A Resist material for forming a chemically amplified negative type resist pattern and method of manufacturing a semiconductor device employing the resist pattern NEC CORPORATION (JP) 2000-08-01 US claimed
US-20260008932-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-08 US disclosed
EP-4675357-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-01-07 EP disclosed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
US-20250271751-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, LOWER LAYER FILM, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2025-08-28 US disclosed
US-20250189895-A1 METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
EP-0827970-A2 New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials Clariant AG (CH) 1998-03-11 EP disclosed
US-5449705-A Silicon-containing polyamic acid derivative and photosensitive resin composition using it CHISSO CORPORATION (JP) 1995-09-12 US disclosed
EP-0085024-B1 METHOD FOR PRODUCING IMAGES IN PHOTORESIST LAYERS CIBA-GEIGY AG (CH) 1987-07-15 EP disclosed
EP-0058638-B1 CURABLE COMPOSITIONS CONTAINING AN ACID-CURABLE RESIN, AND PROCESS FOR CURING THEM CIBA-GEIGY AG (CH) 1985-08-28 EP disclosed
US-4439517-A Process for the formation of images with epoxide resin CIBA-GEIGY CORPORATION (US) 1984-03-27 US disclosed
EP-0085024-A2 Method for producing images in photoresist layers CIBA-GEIGY AG (CH) 1983-08-03 EP disclosed
EP-0058638-A2 Curable compositions containing an acid-curable resin, and process for curing them CIBA-GEIGY AG (CH) 1982-08-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260008932-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS ASH2L, ALKBH2, ITGA1 KDM4E 402/4885ALDH1A1 841/4885MAPT 4120/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.