SCHEMBL6655044

SCHEMBL6655044

Cc1cc(C)c(-c2c(C(=O)O)cc(-c3ccccc3)c(C(F)(F)F)c2-c2ccccc2)c(C)c1

nearest known ligand 0.41

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ TTR P02766 1/20 0.41
▸ RXRA P19793 1/20 0.40
▸ RXRB P28702 1/20 0.40
▸ ACLY P53396 2/20 0.40
▸ SYK P43405 1/20 0.39
▸ GFER P55789 1/20 0.39
▸ PTPN1 P18031 1/20 0.38
▸ TAS2R14 Q9NYV8 2/20 0.38
▸ DHODH Q02127 4/20 0.37
▸ FABP4 P15090 2/20 0.37
▸ PLK1 P53350 1/20 0.37
▸ HNF4A P41235 1/20 0.37
▸ MAPT P10636 1/20 0.37
▸ NOTUM Q6P988 1/20 0.36
▸ PDK2 Q15119 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6027598 0.75 RXRA (0.55) RXRARXRBACLYTAS2R14FABP4
SCHEMBL27458636 0.72 TTR (0.59) TTRGFERDHODHFABP4HNF4A
SCHEMBL28696539 0.72 PTPN1 (0.46) RXRARXRBGFERPTPN1FABP4
SCHEMBL27968054 0.71 ACLY (0.47) RXRARXRBACLYGFERPTPN1
SCHEMBL11667831 0.69 FABP4 (0.49) TTRGFERDHODHFABP4HNF4A
SCHEMBL2805234 0.69 ACLY (0.46) RXRARXRBACLYSYKGFER
SCHEMBL6682318 0.68 TAS2R14 (0.50) RXRARXRBACLYGFERPTPN1
SCHEMBL8070699 0.68 TAS2R14 (0.47) RXRARXRBACLYGFERPTPN1
SCHEMBL8459682 0.68 HNF4A (0.50) TTRPTPN1FABP4HNF4A
SCHEMBL5702020 0.68 MYC (0.73) TTRHNF4A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1434091-A1 CHEMICAL-AMPLIFICATION-TYPE POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION Clariant International Ltd. (CH) 2004-06-30 — — EP disclosed
US-20040033438-A1 Chemical-amplication-type positive radiation-sensitive resin composition AZ ELECTRONIC MATERIALS USA CORP. 2004-02-19 — — US disclosed
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