Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HMGB1 | P09429 | 1/20 | 0.31 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.31 |
| ▸ | ME2 | P23368 | 1/20 | 0.31 |
| ▸ | ME1 | P48163 | 1/20 | 0.31 |
| ▸ | ME3 | Q16798 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7727731 | 0.88 | KDM4E (0.32) | — | |
| SCHEMBL1376717 | 0.87 | HMGB1 (0.33) | HMGB1CXCL12 | |
| SCHEMBL11781831 | 0.87 | ALDH1A1 (0.33) | — | |
| SCHEMBL3069660 | 0.85 | HMGB1 (0.36) | HMGB1CXCL12ME2ME1ME3 | |
| SCHEMBL11781828 | 0.83 | KMT2A (0.35) | — | |
| SCHEMBL3077250 | 0.82 | PKM (0.35) | — | |
| SCHEMBL3076528 | 0.82 | HMGB1 (0.33) | HMGB1CXCL12ME2ME1ME3 | |
| SCHEMBL157782 | 0.81 | CYP1A2 (0.31) | — | |
| SCHEMBL1007226 | 0.81 | LDHA (0.33) | HMGB1CXCL12 | |
| SCHEMBL1644098 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107108482-B | Chemical blowing agent and thermally expandable thermoplastic composition | SIKA技术股份公司 | 2020-07-14 | — | — | CN | disclosed |
| WO-2004069896-A1 | PROCESS FOR PRODUCING NEOPENTYL-GLYCOL BASED POLYESTERS | SURFACE SPECIALTIES, S.A. (BE) | 2004-08-19 | — | — | WO | disclosed |
| CN-1159625-C | Photosensitive thermosetting composition | 联致科技股份有限公司 | 2004-07-28 | — | — | CN | disclosed |
| US-6555592-B2 | Epoxidized novolak phenolic resin modified with an unsaturated monobasic carboxylic acid, a dibasic acid, and an acid anhydride, a photopolymerizable monomer, photoinitiator and an epoxy novolak resin; use as solder mask | ADVANCE MATERIALS CORPORATION (TW) | 2003-04-29 | — | — | US | disclosed |