SCHEMBL6743140

SCHEMBL6743140

O=C1C=CC(=O)N1OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.38

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA2 P00918 14/20 0.38
CA1 P00915 13/20 0.38
MMP1 P03956 3/20 0.33
MMP2 P08253 3/20 0.33
MMP9 P14780 3/20 0.33
MMP8 P22894 3/20 0.33
MMP13 P45452 3/20 0.33
F2 P00734 3/20 0.31
PRSS1 P07477 3/20 0.31
PRSS2 P07478 3/20 0.31
PRSS3 P35030 3/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2383424 0.79 MGLL (0.30) CA2
SCHEMBL4835348 0.79 CA2 (0.38) CA2CA1MMP1MMP2MMP9
SCHEMBL215806 0.79 PARL (0.40) CA2CA1MMP1MMP2MMP9
SCHEMBL4837339 0.77 CA2 (0.41) CA2CA1MMP1MMP2MMP9
SCHEMBL503740 0.77 CA2 (0.39) CA2CA1MMP1MMP2MMP9
SCHEMBL29366293 0.77 KMT2A (0.49) CA2CA1F2
SCHEMBL1470558 0.77 KMT2A (0.49) CA2CA1F2
SCHEMBL27216403 0.76 CA2 (0.36) CA2CA1MMP1MMP2MMP9
SCHEMBL2904034 0.76 KMT2A (0.48) CA2CA1F2
SCHEMBL4835123 0.76 CA2 (0.34) CA2CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8241830-B2 Positive resist composition and a pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-08-14 US disclosed
US-20120076997-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2012-03-29 US disclosed
US-8124310-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-02-28 US disclosed
US-20120003590-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2012-01-05 US disclosed
US-7887988-B2 Acid generator; irradiating with actinic radiation FUJIFILM CORPORATION (JP) 2011-02-15 US disclosed
US-7799506-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2010-09-21 US disclosed
US-7691560-B2 Resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2010-04-06 US disclosed
US-7625690-B2 Acid generator; exposure to actinic radiation FUJIFILM CORPORATION (JP) 2009-12-01 US disclosed
EP-1835341-B1 Positive resist composition and pattern forming method using the same FUJIFILM CORP (JP) 2009-06-24 EP disclosed
US-20090087776-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-20080193878-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-08-14 US disclosed
US-7410747-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2008-08-12 US disclosed
US-20080096134-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-24 US disclosed
US-20080081289-A1 RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20080076062-A1 RESIST COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-7344821-B2 Positive resist composition for use with electron beam, EUV light or X ray, and pattern formation method using the same FUJIFILM CORPORATION (JP) 2008-03-18 US disclosed
US-20080050675-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-02-28 US disclosed
US-7332258-B2 Positive resist composition and process for forming pattern using the same FUJIFILM CORPORATION (JP) 2008-02-19 US disclosed
EP-1640409-B1 Positive resist composition and pattern forming method using the same FUJIFILM CORP (JP) 2008-02-13 EP disclosed
US-7326513-B2 Positive working resist composition FUJIFILM CORPORATION (JP) 2008-02-05 US disclosed