SCHEMBL676658

SCHEMBL676658

CNc1ccc(Sc2ccc(NC(=O)c3cccc(C(=O)Nc4ccc(O)c(NC(=O)c5cccc(C(C)=O)c5)c4)c3)cc2)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 8/20 0.49
POLB P06746 2/20 0.49
MEN1 O00255 7/20 0.44
PABPC1 P11940 1/20 0.44
DUSP3 P51452 1/20 0.44
PTPN5 P54829 1/20 0.44
PTPN11 Q06124 1/20 0.44
EIF4H Q15056 1/20 0.44
CTDSP1 Q9GZU7 1/20 0.44
ADRB2 P07550 1/20 0.44
GAA P10253 1/20 0.44
MAPT P10636 1/20 0.44
KCNMA1 Q12791 2/20 0.44
HDAC1 Q13547 1/20 0.44
TP53 P04637 2/20 0.43
NPC1 O15118 3/20 0.43
RAB9A P51151 3/20 0.43
ALDH1A1 P00352 2/20 0.43
HSP90AA1 P07900 1/20 0.42
HSP90AB1 P08238 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1108314 0.88 KCNMA1 (0.52) KMT2APOLBMEN1PABPC1DUSP3
SCHEMBL1108328 0.86 AR (0.53) KMT2APOLBMEN1HDAC1NPC1
SCHEMBL676656 0.86 AR (0.53) KMT2APOLBMEN1HDAC1NPC1
SCHEMBL677407 0.84 PGR (0.54) KMT2APOLBMEN1HDAC1NPC1
SCHEMBL677398 0.83 KMT2A (0.48) KMT2APOLBMEN1PABPC1DUSP3
SCHEMBL676672 0.82 KMT2A (0.46) KMT2APOLBMEN1PABPC1DUSP3
SCHEMBL677387 0.81 KMT2A (0.48) KMT2APOLBMEN1PABPC1DUSP3
SCHEMBL677388 0.80 AR (0.47) KMT2APOLBMEN1HDAC1TP53
SCHEMBL677382 0.78 MAPT (0.45) KMT2APOLBMEN1PABPC1DUSP3
SCHEMBL677399 0.78 KDR (0.44) KMT2APOLBMEN1HDAC1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7906213-B2 Epoxy resin curable composition for prepreg ADEKA CORPORATION (JP) 2011-03-15 US disclosed
US-20090030147-A1 Epoxy Resin Curable Composition For Prepreg ADEKA CORPORATION (JP) 2009-01-29 US disclosed