SCHEMBL677901

SCHEMBL677901

C=C(C)C(=O)OC1(C)C2CC3CC(C2)CC1(O)C3

nearest known ligand 0.33

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
GLA P06280 1/20 0.32
SCN1A P35498 1/20 0.31
SCN2A Q99250 1/20 0.31
SCN3A Q9NY46 1/20 0.31
ALDH1A1 P00352 1/20 0.31
HSD11B1 P28845 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3182594 0.86 GLA (0.33) GLASCN1ASCN2ASCN3AALDH1A1
SCHEMBL3856231 0.84 GLA (0.32) GLASCN1ASCN2ASCN3AALDH1A1
SCHEMBL14358509 0.83 SCN1A (0.34) GLASCN1ASCN2ASCN3AALDH1A1
SCHEMBL1216334 0.81
SCHEMBL28766399 0.81 LMNA (0.33) ALDH1A1
SCHEMBL678397 0.79 HSD11B1 (0.32) ALDH1A1HSD11B1
SCHEMBL1219048 0.79 ALDH1A1 (0.33) SCN1ASCN2ASCN3AALDH1A1
SCHEMBL5004827 0.78 SCN1A (0.31) SCN1ASCN2ASCN3AHSD11B1
SCHEMBL5693012 0.78 SCN1A (0.31) SCN1ASCN2ASCN3AALDH1A1
SCHEMBL677988 0.78 ALDH1A1 (0.30) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9862695-B2 Monomer having N-acyl carbamoyl group and lactone skeleton, and polymeric compound DAICEL CORPORATION (JP) 2018-01-09 US disclosed
US-9598520-B2 Radiation-sensitive resin composition, polymer and method for forming a resist pattern JSR CORPORATION (JP) 2017-03-21 US disclosed
US-20160060374-A1 MONOMER HAVING N-ACYL CARBAMOYL GROUP AND LACTONE SKELETON, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2016-03-03 US disclosed
EP-2503392-B1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER AND RESIST PATTERN FORMATION METHOD JSR CORP (JP) 2015-04-15 EP disclosed
US-8815490-B2 Radiation-sensitive resin composition, polymer, and method for forming resist pattern JSR CORPORATION (JP) 2014-08-26 US disclosed
US-8753793-B2 Method for producing resin solution for photoresist, photoresist composition, and pattern-forming method DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2014-06-17 US disclosed
US-8637623-B2 Monomer having electron-withdrawing substituent and lactone skeleton, polymeric compound, and photoresist composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2014-01-28 US disclosed
US-8530134-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2013-09-10 US disclosed
US-8470510-B2 Polymer for lithographic purposes and method for producing same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2013-06-25 US disclosed
US-20120295197-A1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER AND METHOD FOR FORMING A RESIST PATTERN JSR CORPORATION (JP) 2012-11-22 US disclosed
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
US-6692889-B1 COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-02-17 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
EP-1354897-A1 POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR Daicel Chemical Industries, Ltd. (JP) 2003-10-22 EP disclosed
US-20030148210-A1 Polymer for photoresist and resin compositions therefor DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-08-07 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030148210-A1 Polymer for photoresist and resin compositions therefor LCP1, DOT1L, PRMT1 GLA 4056/4885SCN1A 3998/4885SCN2A 4535/4885
US-20160060374-A1 MONOMER HAVING N-ACYL CARBAMOYL GROUP AND LACTONE SKELETON, AND POLYMERIC COMPOUND CNKSR1, NMRAL1, CCNA1 GLA 1789/4885SCN1A 1723/4885SCN2A 1800/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.