SCHEMBL6802558

SCHEMBL6802558

C=C(C)C(=O)OC(C(=O)C(=C)C)(C(=O)C(=C)C)C(CO)(CO)COC(=O)c1ccc(N)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.43
CYP1A2 P05177 3/20 0.43
CYP3A4 P08684 3/20 0.43
MAOA P21397 2/20 0.43
TSHR P16473 2/20 0.40
CYP2C9 P11712 1/20 0.40
CYP2C19 P33261 1/20 0.40
PDE4D Q08499 1/20 0.40
PHLPP2 Q6ZVD8 1/20 0.39
NPC1 O15118 2/20 0.39
RAB9A P51151 2/20 0.39
MAPT P10636 2/20 0.39
ALDH1A1 P00352 1/20 0.39
CYP2D6 P10635 2/20 0.38
HTR3A P46098 1/20 0.38
HRH3 Q9Y5N1 1/20 0.38
ADRB2 P07550 2/20 0.38
ADRB1 P08588 2/20 0.38
ADRB3 P13945 2/20 0.38
BLM P54132 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7728821 0.86 ADRB2 (0.41) LMNANPC1RAB9AALDH1A1ADRB2
SCHEMBL6806182 0.84 ADRB2 (0.42) LMNACYP1A2CYP3A4CYP2C9CYP2C19
Aminobenzoic Acid SCHEMBL6802563 0.84 HTT (0.40) LMNACYP1A2CYP3A4MAOATSHR
SCHEMBL7721993 0.82 ALDH1A1 (0.47) CYP3A4TSHRNPC1RAB9AALDH1A1
SCHEMBL7733535 0.82 NPC1 (0.32) NPC1POLBAPEX1HTTTDP1
SCHEMBL8578222 0.81
SCHEMBL8362147 0.79 CA12 (0.35) TSHRCYP2C19NPC1ALDH1A1GAA
SCHEMBL8362150 0.77 ALDH1A1 (0.44) TSHRCYP2C19NPC1ALDH1A1CYP2D6
SCHEMBL8578226 0.77
SCHEMBL8362090 0.74 ALDH1A1 (0.38) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5886136-A Pattern forming process NIPPON ZEON CO., LTD. (JP) 1999-03-23 US claimed
US-5777068-A Photosensitive polyimide resin composition NIPPON ZEON CO., LTD. (JP) 1998-07-07 US claimed
EP-0702270-A2 Photosensitive polyimide resin composition NIPPON ZEON CO., LTD. (JP) 1996-03-20 EP claimed
US-20140087136-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD ZEON CORPORATION (JP) 2014-03-27 US disclosed
US-6743851-B2 MIXTURE CONTAINING TETRAZOLE NIPPON ZEON CO., LTD. (JP) 2004-06-01 US disclosed
US-6734248-B2 CONTAINING A 1H-TETRAZOLE OR A 5,5'-BIS-1H-TETRAZOLE NIPPON ZEON CO., LTD. (JP) 2004-05-11 US disclosed
EP-0822229-B1 POLYIMIDE RESIN COMPOSITION NIPPON ZEON CO (JP) 2003-07-30 EP disclosed
US-6403289-B1 ALKALINE SOLUTION CONTAINING PHOTOPOLYMERIZABLE POLYAMIC ACID, BENZYLTRIALKYLAMMONIUM (OR PHOSPHONIUM) SALT OR BENZYLTRIARYLAMMONIUM (OR PHOSPHONIUM) SALT AND BASE; SEMICONDUCTORS NIPPON ZEON CO., LTD. (JP) 2002-06-11 US disclosed
US-20020035196-A1 Polyimide film TANAKA AKIRA (JP) 2002-03-21 US disclosed
US-20020032273-A1 Pattern forming process using polyimide resin composition TANAKA AKIRA (JP) 2002-03-14 US disclosed
US-6310135-B1 PHOTOSENSITIVE RESINS WITH TETRAZOLE COMPOUND NIPPON ZEON CO., LTD. (JP) 2001-10-30 US disclosed
US-6160081-A Photosensitive polyimide resin composition NIPPON ZEON CO., LTD. (JP) 2000-12-12 US disclosed
US-5886136-A Pattern forming process NIPPON ZEON CO., LTD. (JP) 1999-03-23 US disclosed
US-5777068-A Photosensitive polyimide resin composition NIPPON ZEON CO., LTD. (JP) 1998-07-07 US disclosed
EP-0822229-A1 POLYIMIDE RESIN COMPOSITION NIPPON ZEON CO., LTD. (JP) 1998-02-04 EP disclosed
EP-0702270-A2 Photosensitive polyimide resin composition NIPPON ZEON CO., LTD. (JP) 1996-03-20 EP disclosed