SCHEMBL703240

SCHEMBL703240

CCCC(CCC)(O[SiH3])c1ccccc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 2/20 0.38
MAPK1 P28482 1/20 0.37
SCN1A P35498 3/20 0.36
SCN2A Q99250 3/20 0.36
SCN3A Q9NY46 3/20 0.36
SIGMAR1 Q99720 2/20 0.36
LMNA P02545 2/20 0.36
CYP1A2 P05177 2/20 0.36
CYP3A4 P08684 2/20 0.36
CYP2D6 P10635 2/20 0.36
CYP2C9 P11712 2/20 0.36
CYP2C19 P33261 2/20 0.36
TSHR P16473 1/20 0.36
NFKB1 P19838 1/20 0.36
MTOR P42345 1/20 0.36
RAB9A P51151 1/20 0.36
KDM4E B2RXH2 1/20 0.36
MEN1 O00255 1/20 0.36
NR1I2 O75469 1/20 0.36
CYP1A1 P04798 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482432 0.92 KCNN4 (0.35) KCNN4MAPK1SCN1ASCN2ASCN3A
SCHEMBL706928 0.88 KIF11 (0.38) KCNN4MAPK1SIGMAR1KMT2AKIF11
SCHEMBL7618073 0.87 CYP1A2 (0.40) SCN1ASCN2ASCN3ASIGMAR1LMNA
SCHEMBL3482436 0.83 KCNN4 (0.38) KCNN4MAPK1SCN1ASCN2ASCN3A
SCHEMBL704326 0.83 KCNN4 (0.40) KCNN4MAPK1SIGMAR1TSHRTAAR1
SCHEMBL3481596 0.81 KIF11 (0.36) KCNN4MAPK1SIGMAR1KMT2AKIF11
SCHEMBL27614347 0.78 KIF11 (0.35) KCNN4SIGMAR1KMT2AALDH1A1KIF11
SCHEMBL3481487 0.78 MAPK1 (0.40) KCNN4MAPK1SCN1ASCN2ASCN3A
SCHEMBL11418602 0.77 KCNN4 (0.33) KCNN4MAPK1SIGMAR1CYP2D6NPSR1
SCHEMBL28944305 0.77 SIGMAR1 (0.38) MAPK1SIGMAR1MEN1NR1I2KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN claimed
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN disclosed
EP-4056604-B1 METHOD FOR PRODUCING COPOLYMER OF 1,3,7-OCTATRIENE AND STYRENE KURARAY CO (JP) 2023-08-02 EP disclosed
EP-3564280-B1 COPOLYMER OF 1, 3, 7-OCTATRIENE AND STYRENE AND HYDRIDE THEREOF KURARAY CO (JP) 2023-07-26 EP disclosed
EP-4163311-A1 COPOLYMER OF 1,3,7-OCTATRIENE AND ISOPRENE, HYDRIDE THEREOF, AND METHOD FOR PRODUCING SAID COPOLYMER Kuraray Co., Ltd. (JP) 2023-04-12 EP disclosed
EP-4163312-A1 COPOLYMER OF 1,3,7-OCTATRIENE AND ISOPRENE, HYDRIDE THEREOF, AND METHOD FOR PRODUCING SAID COPOLYMER Kuraray Co., Ltd. (JP) 2023-04-12 EP disclosed
EP-3564274-B1 1, 3, 7-OCTATRIENE POLYMER, HYDRIDE THEREOF, AND METHOD FOR PRODUCING SAID POLYMER KURARAY CO (JP) 2022-12-28 EP disclosed
CN-115181223-A Low-gloss matte auxiliary agent, preparation method thereof and formed body 铨盛聚碳科技股份有限公司 2022-10-14 CN disclosed
EP-4056604-A1 METHOD FOR PRODUCING COPOLYMER OF 1,3,7-OCTATRIENE AND STYRENE Kuraray Co., Ltd. (JP) 2022-09-14 EP disclosed
US-11332567-B2 Copolymer of 1, 3, 7-octatriene and butadiene, hydride thereof, and method for producing said copolymer KURARAY CO., LTD. (JP) 2022-05-17 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-5439746-A Formed by coating or impregnating a reinforcement sheet and curing; mechanical strength; corrosion and heat resistance; electrical properties KABUSHIKI KAISHA TOSHIBA (JP) 1995-08-08 US disclosed