SCHEMBL703613

SCHEMBL703613

CC(C)O[SiH](CCCCc1ccccc1)OC(C)C

nearest known ligand 0.44

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
SIGMAR1 Q99720 12/20 0.44
L3MBTL1 Q9Y468 1/20 0.43
ALDH1A1 P00352 1/20 0.43
HPGD P15428 1/20 0.43
KMT2A Q03164 1/20 0.43
MAOA P21397 1/20 0.42
MAOB P27338 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705468 0.95 SIGMAR1 (0.42) SIGMAR1L3MBTL1ALDH1A1HPGDKMT2A
SCHEMBL704369 0.79 L3MBTL1 (0.47) SIGMAR1L3MBTL1KMT2AMAOAMAOB
SCHEMBL6325312 0.78 SIGMAR1 (0.48) SIGMAR1L3MBTL1MAOAMAOB
SCHEMBL19470849 0.78 SIGMAR1 (0.48) SIGMAR1L3MBTL1MAOAMAOB
SCHEMBL19470846 0.78 SIGMAR1 (0.48) SIGMAR1L3MBTL1MAOAMAOB
SCHEMBL19470840 0.78 SIGMAR1 (0.48) SIGMAR1L3MBTL1MAOAMAOB
SCHEMBL19470822 0.78 SIGMAR1 (0.48) SIGMAR1L3MBTL1MAOAMAOB
SCHEMBL3110910 0.78 SIGMAR1 (0.48) SIGMAR1L3MBTL1MAOAMAOB
SCHEMBL703456 0.76 L3MBTL1 (0.44) SIGMAR1L3MBTL1KMT2AMAOAMAOB
SCHEMBL2584081 0.75 SIGMAR1 (0.44) SIGMAR1L3MBTL1MAOAMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed