SCHEMBL704392

SCHEMBL704392

FCO[SiH2]c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL703521 0.75 LTA4H (0.37)
SCHEMBL17763359 0.75 MAPT (0.32)
SCHEMBL18297892 0.73 TSHR (0.50)
SCHEMBL23701037 0.71 ALDH1A1 (0.32)
SCHEMBL703559 0.71 LMNA (0.39)
SCHEMBL28105891 0.71 TAAR1 (0.46)
Ethyne SCHEMBL28268842 0.71 LTA4H (0.34)
SCHEMBL27162 0.70 MAPK1 (0.33)
SCHEMBL3298600 0.70 CA2 (0.41)
Butane SCHEMBL11070114 0.70 LTA4H (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107148453-B Photocurable composition 思美定株式会社 2021-08-17 CN disclosed
CN-107428891-B Curable composition 施敏打硬株式会社 2021-04-20 CN disclosed
CN-105392845-B Photocurable composition 思美定株式会社 2020-10-20 CN disclosed
EP-3081612-B1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO LTD (JP) 2018-11-14 EP disclosed
US-9718999-B2 Photocurable composition having adhesive properties CEMEDINE CO., LTD (JP) 2017-08-01 US disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
US-20160152783-A1 PHOTOCURABLE COMPOSITION CEMEDINE CO., LTD. (JP) 2016-06-02 US disclosed
EP-3023462-A1 PHOTOCURABLE COMPOSITION Cemedine Co., Ltd. (JP) 2016-05-25 EP disclosed
US-8124690-B2 Moisture curable polymer having SiF group, and curable composition containing the same KANEKA CORPORATION (JP) 2012-02-28 US disclosed
US-20090275702-A1 MOISTURE CURABLE POLYMER HAVING SiF GROUP, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-11-05 US disclosed
EP-2062929-A1 MOISTURE-CURABLE POLYMER HAVING SiF GROUP AND CURABLE COMPOSITION CONTAINING THE SAME Kaneka Corporation (JP) 2009-05-27 EP disclosed