Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | LTA4H | P09960 | 2/20 | 0.34 |
| ▸ | HPGD | P15428 | 2/20 | 0.34 |
| ▸ | TOP2A | P11388 | 1/20 | 0.32 |
| ▸ | GAA | P10253 | 2/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19809337 | 0.94 | LMNA (0.34) | LMNAMEN1KMT2AALDH1A1LTA4H | |
| SCHEMBL1902441 | 0.90 | LMNA (0.34) | LMNAMEN1KMT2AALDH1A1LTA4H | |
| SCHEMBL707479 | 0.89 | ESR1 (0.33) | — | |
| SCHEMBL706387 | 0.88 | LTA4H (0.44) | ALDH1A1LTA4HTLR8FGFR1 | |
| SCHEMBL702079 | 0.88 | LMNA (0.37) | LMNAMEN1KMT2AALDH1A1LTA4H | |
| SCHEMBL705446 | 0.88 | LMNA (0.37) | LMNAMEN1KMT2AALDH1A1LTA4H | |
| SCHEMBL19809285 | 0.86 | LTA4H (0.44) | LMNAALDH1A1LTA4HTP53TLR8 | |
| SCHEMBL702244 | 0.86 | LMNA (0.36) | LMNAMEN1KMT2AALDH1A1LTA4H | |
| SCHEMBL4082632 | 0.84 | LMNA (0.35) | LMNAMEN1KMT2AALDH1A1LTA4H | |
| SCHEMBL706699 | 0.84 | LTA4H (0.36) | LMNAMEN1KMT2AALDH1A1LTA4H |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| CN-117310849-A | Optical laminate | 住友化学株式会社 | 2023-12-29 | — | — | CN | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| EP-3318606-A1 | SILICON-CONTAINING RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-05-09 | — | — | EP | disclosed |
| EP-3275940-A1 | ENERGY-SENSITIVE RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-01-31 | — | — | EP | disclosed |
| US-20170306095-A1 | SEALING MATERIAL COMPOSITION FOR LED | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-7604866-B2 | Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2009-10-20 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060269724-A1 | Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2006-11-30 | — | — | US | disclosed |
| US-20040077757-A1 | Coating composition for use in producing an insulating thin film | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-04-22 | — | — | US | disclosed |