SCHEMBL714784

SCHEMBL714784

CC(C)O[SiH2]c1cccc(C(C)(C)C)c1C(C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.35
GABRA1 P14867 1/20 0.32
GABRB2 P47870 1/20 0.32
ALDH1A1 P00352 1/20 0.31
TSHR P16473 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL703371 0.84 ALDH1A1 (0.38) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL27923916 0.80 CA2 (0.39) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL704701 0.73 CA2 (0.37) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL2961097 0.72 ALDH1A1 (0.32) ALDH1A1
SCHEMBL17138311 0.72 CA2 (0.41) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL27173778 0.72 CA2 (0.41) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL17138319 0.72 CA2 (0.41) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL1639607 0.71
SCHEMBL304569 0.70 CA2 (0.57) CA2GABRA1GABRB2ALDH1A1TSHR
SCHEMBL713415 0.67 TRPA1 (0.35) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed