SCHEMBL7190294

SCHEMBL7190294

COc1cc2c(c(S(=O)(=O)O)c1OC)C(=O)c1ccccc1C2=O.c1ccc([I+]c2ccccc2)cc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 3/20 0.46
NPC1 O15118 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
MAPT P10636 6/20 0.45
ALDH1A1 P00352 4/20 0.45
THRB P10828 2/20 0.45
LCK P06239 1/20 0.45
GLA P06280 1/20 0.45
LIMK1 P53667 1/20 0.45
LIMK2 P53671 1/20 0.45
MEN1 O00255 5/20 0.42
KMT2A Q03164 5/20 0.42
KDM4E B2RXH2 1/20 0.42
USP2 O75604 1/20 0.42
DUSP3 P51452 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
CRHBP P24387 1/20 0.40
CRHR2 Q13324 1/20 0.40
POLB P06746 2/20 0.40
GAA P10253 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5847592 0.91 RAB9A (0.54) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
Biphenyl SCHEMBL7190290 0.88 RAB9A (0.48) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
SCHEMBL5178783 0.75 ALDH1A1 (0.40) NPC1SMN1; SMN2MAPTALDH1A1KDM4E
SCHEMBL13517957 0.74 EPHX2 (0.43) MAPTALDH1A1MEN1KMT2AKDM4E
SCHEMBL23198991 0.74 EPHX2 (0.65) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
SCHEMBL9822621 0.71 PGAM1 (0.43) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
SCHEMBL18601894 0.71 RAB9A (0.62) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
Anthraquinone SCHEMBL1405501 0.71 MEN1 (0.52) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
SCHEMBL23198954 0.70 NPC1 (0.57) RAB9ANPC1SMN1; SMN2MAPTALDH1A1
SCHEMBL13239418 0.70 MAPT (0.53) RAB9ANPC1SMN1; SMN2MAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6605353-B2 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming KANEKA CORPORATION (JP) 2003-08-12 US disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed