SCHEMBL760343

SCHEMBL760343

Cc1cc(O)c(C(c2ccccc2O)c2cc(C3CCCCC3)c(C)cc2O)cc1C1CCCCC1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 1/20 0.35
GABRB2 P47870 1/20 0.35
HDAC4 P56524 1/20 0.34
HDAC2 Q92769 1/20 0.34
HDAC8 Q9BY41 1/20 0.34
NUDT1 P36639 1/20 0.34
BACE1 P56817 1/20 0.34
HSP90AA1 P07900 1/20 0.34
ALOX15 P16050 2/20 0.33
ALDH1A1 P00352 1/20 0.33
TSHR P16473 1/20 0.33
KMT2A Q03164 5/20 0.32
MEN1 O00255 4/20 0.32
LMNA P02545 2/20 0.32
TDP1 Q9NUW8 1/20 0.32
MAPT P10636 3/20 0.32
NPSR1 Q6W5P4 1/20 0.32
IL1B P01584 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29484425 1.00 GABRA1 (0.35) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL29375612 0.89 NUDT1 (0.37) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL757158 0.89 NUDT1 (0.37) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL30127784 0.89 NUDT1 (0.37) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL9138946 0.86 TRPA1 (0.42) NUDT1BACE1HSP90AA1KMT2ALMNA
SCHEMBL9138960 0.82 GABRA1 (0.34) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL9135740 0.82 GABRA1 (0.34) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL7804680 0.82 PTGS2 (0.38) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL3272159 0.81 GABRA1 (0.46) GABRA1GABRB2HDAC4HDAC2HDAC8
SCHEMBL29372576 0.81 NUDT1 (0.34) NUDT1BACE1HSP90AA1PTGDR2PSMB5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 156 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240270891-A1 PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN DIC CORPORATION (JP) 2024-08-15 US disclosed
CN-118325004-A Phenolic hydroxyl group-containing resin, photosensitive resin composition, curable composition, and resist film DIC株式会社 2024-07-12 CN disclosed
CN-113348188-B Phenolic hydroxyl group-containing resin, photosensitive composition, resist film, curable composition, and cured product DIC株式会社 2024-05-10 CN disclosed
CN-117321109-A Phenolic hydroxyl group-containing resin DIC株式会社 2023-12-29 CN disclosed
CN-113227181-B Resist composition DIC株式会社 2023-07-18 CN disclosed
CN-116430671-A Photoresist composition and photoetching process 上海飞凯材料科技股份有限公司 2023-07-14 CN disclosed
CN-110959138-B Resist material DIC株式会社 2023-06-30 CN disclosed
CN-116209690-A Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin DIC株式会社 2023-06-02 CN disclosed
CN-116023607-A Phenolic hydroxyl group-containing resin DIC株式会社 2023-04-28 CN disclosed
CN-109062007-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5677102-A DISSOLVING AN ALKALI SOLUBLE RESIN AND A QUINONEDIAZIDE GROUP CONTAINING COMPOUND; HEATING TOKYO OHKA KOGYO CO., LTD. (JP) 1997-10-14 US disclosed
US-5604077-A MIXTURE OF ALKALI-SOLUBLE NOVOLAK AND A QUINONE DIAZIDE PHOTOSENSITIZER; HEAT RESISTANCE, RESOLUTION, ANTIFOULING AGENTS TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-18 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed
US-5478692-A Fine patterning for electronics TOKYO OHKA KOGYO CO., LTD. (JP) 1995-12-26 US disclosed
US-5434031-A Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive TOKYO OHKA KOGYO CO., LTD. (JP) 1995-07-18 US disclosed
US-5401605-A Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound TOKYO OHKA KOGYO CO., LTD. (JP) 1995-03-28 US disclosed