SCHEMBL2530090

SCHEMBL2530090

Oc1ccccc1C(c1cccc(O)c1C1CCCCC1)c1cccc(O)c1C1CCCCC1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HDAC4 P56524 1/20 0.39
▸ HDAC2 Q92769 1/20 0.39
▸ HDAC8 Q9BY41 1/20 0.39
▸ GABRA1 P14867 1/20 0.37
▸ GABRB2 P47870 1/20 0.37
▸ TSHR P16473 1/20 0.34
▸ ALDH1A1 P00352 2/20 0.34
▸ HPGD P15428 2/20 0.34
▸ ALOX15 P16050 1/20 0.34
▸ KDM4E B2RXH2 1/20 0.34
▸ NPC1 O15118 1/20 0.34
▸ LMNA P02545 1/20 0.34
▸ HTT P42858 1/20 0.34
▸ RAB9A P51151 1/20 0.34
▸ KMT2A Q03164 3/20 0.33
▸ MEN1 O00255 2/20 0.33
▸ CHRNB2 P17787 1/20 0.33
▸ CHRNA4 P43681 1/20 0.33
▸ L3MBTL1 Q9Y468 1/20 0.33
▸ PPIA P62937 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9244494 0.95 HDAC4 (0.42) HDAC4HDAC2HDAC8GABRA1GABRB2
SCHEMBL29558450 0.83 GABRA1 (0.36) HDAC4HDAC2HDAC8GABRA1GABRB2
SCHEMBL28717708 0.83 GABRA1 (0.36) HDAC4HDAC2HDAC8GABRA1GABRB2
SCHEMBL29484423 0.81 PTPN5 (0.39) HDAC4HDAC2HDAC8GABRA1GABRB2
SCHEMBL2514437 0.81 PTPN5 (0.39) HDAC4HDAC2HDAC8GABRA1GABRB2
SCHEMBL6004412 0.80 HDAC4 (0.50) HDAC4HDAC2HDAC8ALDH1A1HPGD
SCHEMBL7531576 0.80 HDAC4 (0.50) HDAC4HDAC2HDAC8ALDH1A1HPGD
SCHEMBL5275279 0.79 HDAC4 (0.38) HDAC4HDAC2HDAC8GABRA1GABRB2
SCHEMBL3169205 0.78 HDAC4 (0.52) HDAC4HDAC2HDAC8ALDH1A1HPGD
SCHEMBL7721762 0.78 HDAC4 (0.37) HDAC4HDAC2HDAC8GABRA1GABRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2022239597-A1 RESIN CONTAINING PHENOLIC HYDROXYL GROUP DIC株式会社 2022-11-17 — — WO disclosed
US-11254778-B2 Novolak resins and resist materials DIC CORPORATION (JP) 2022-02-22 — — US disclosed
EP-2639636-B1 POSITIVE-TYPE PHOTORESIST COMPOSITION DAINIPPON INK & CHEMICALS (JP) 2021-05-19 — — EP disclosed
US-10577449-B2 Phenolic-hydroxyl-group-containing novolac resin and resist film DIC CORPORATION (JP) 2020-03-03 — — US disclosed
US-10466590-B2 Naphthol-type calixarene compound and method for producing the same, photosensitive composition, resist material, and coating DIC CORPORATION (JP) 2019-11-05 — — US disclosed
US-10414850-B2 Resin containing phenolic hydroxyl groups, and resist film DIC CORPORATION (JP) 2019-09-17 — — US disclosed
US-20190169348-A1 NOVOLAK RESINS AND RESIST MATERIALS DIC CORPORATION (JP) 2019-06-06 — — US disclosed
US-10266471-B2 Phenolic hydroxyl-containing compound, composition containing the same, and cured film of the composition DIC CORPORATION (JP) 2019-04-23 — — US disclosed
US-20190077901-A1 NOVOLAC-TYPE PHENOLIC HYDROXY GROUP-CONTAINING RESIN, AND RESIST FILM DIC CORPORATION (JP) 2019-03-14 — — US disclosed
US-10179828-B2 Curable composition for permanent resist films, and permanent resist film DIC CORPORATION (JP) 2019-01-15 — — US disclosed
US-8623585-B2 Positive-type photoresist composition DIC CORPORATION (JP) 2014-01-07 — — US disclosed
EP-2653922-A1 POSITIVE PHOTORESIST COMPOSITION, COATING FILM THEREOF, AND NOVOLAC PHENOL RESIN DIC Corporation (JP) 2013-10-23 — — EP disclosed
US-20130244174-A1 POSITIVE-TYPE PHOTORESIST COMPOSITION DIC CORPORATION (JP) 2013-09-19 — — US disclosed
EP-2639636-A1 POSITIVE-TYPE PHOTORESIST COMPOSITION DIC Corporation (JP) 2013-09-18 — — EP disclosed
EP-2639637-A1 POSITIVE-TYPE PHOTORESIST COMPOSITION DIC Corporation (JP) 2013-09-18 — — EP disclosed
US-20130224655-A1 POSITIVE-TYPE PHOTORESIST COMPOSITION DIC CORPORATION (JP) 2013-08-29 — — US disclosed
US-8034529-B2 Photosensitive resin composition and photosensitive element HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-10-11 — — US disclosed
US-20090214979-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-08-27 — — US disclosed
US-6641972-B2 Mixture of alakli solubile phenolic resin, another resin and quinonediazido compound TOKYO OHKA KOGYO CO., LTD. (JP) 2003-11-04 — — US disclosed
US-20030059706-A1 Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same TOKYO OHKA KOGYO CO., LTD. 2003-03-27 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10466590-B2 Naphthol-type calixarene compound and method for producing the same, photosensitive composition, resist material, and coating CSNK1A1L, NCKAP1L, CALR HDAC4 2357/4885HDAC2 521/4885HDAC8 823/4885
US-10577449-B2 Phenolic-hydroxyl-group-containing novolac resin and resist film HACL2, ASH2L, HEATR1 HDAC4 1375/4885HDAC2 1661/4885HDAC8 1679/4885
US-10266471-B2 Phenolic hydroxyl-containing compound, composition containing the same, and cured film of the composition CALU, ARL1, AHR HDAC4 1434/4885HDAC2 1030/4885HDAC8 864/4885
US-10179828-B2 Curable composition for permanent resist films, and permanent resist film ASH2L, DNMT3L, H1-0 HDAC4 892/4885HDAC2 387/4885HDAC8 1208/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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