SCHEMBL765966

SCHEMBL765966

O=C(O)c1ccc(C(c2ccccc2)(c2ccc(C(=O)O)cc2)C(F)(F)F)cc1

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
SRD5A2 P31213 6/20 0.55
TSHR P16473 2/20 0.50
DAO P14920 1/20 0.50
NAPRT Q6XQN6 1/20 0.50
CES2 O00748 1/20 0.48
CES1 P23141 1/20 0.48
TP53 P04637 1/20 0.48
RXRA P19793 2/20 0.46
RXRB P28702 2/20 0.46
RXRG P48443 1/20 0.46
HPGD P15428 1/20 0.45
PTPN1 P18031 2/20 0.44
KIF11 P52732 1/20 0.44
TRPA1 O75762 1/20 0.44
EPHX2 P34913 1/20 0.44
CYP2C8 P10632 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10558699 1.00 SRD5A2 (0.55) SRD5A2TSHRDAONAPRTCES2
SCHEMBL11358313 0.94 SRD5A2 (0.61) SRD5A2TSHRCES2CES1TP53
SCHEMBL9719919 0.90 SRD5A2 (0.57) SRD5A2TSHRHPGDEPHX2
SCHEMBL9008980 0.90 SRD5A2 (0.58) SRD5A2TSHRDAONAPRTCES2
SCHEMBL9290961 0.84 SRD5A2 (0.55) SRD5A2TSHRDAONAPRTCES2
SCHEMBL694095 0.83 SRD5A2 (0.59) SRD5A2TSHRDAONAPRTCES2
SCHEMBL9009108 0.83 SRD5A2 (0.54) SRD5A2TSHRDAONAPRTCES2
SCHEMBL18275136 0.82 SRD5A2 (0.53) SRD5A2TSHRDAONAPRTCES2
SCHEMBL6546858 0.81 SRD5A2 (0.52) SRD5A2TSHRDAONAPRTCES2
SCHEMBL160204 0.80 TSHR (0.58) TSHRCES1PTPN1KIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4866155-A HEAT, RADIATION RESISTANCE; TRANSPARENCY HOECHST CELANESE CORPORATION (US) 1989-09-12 US claimed
EP-0323561-A2 Polyesters of bis (2-(4-hydroxyphenyl) hexafluoroisopropyl)- diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-07-12 EP claimed
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP claimed
US-11608316-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2023-03-21 US disclosed
US-11414382-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2022-08-16 US disclosed
US-20210002216-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2021-01-07 US disclosed
US-20200392079-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2020-12-17 US disclosed
US-20180370908-A1 NOVEL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPRISING SAID COMPOUND, AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID PHOTOPOLYMERIZATION INITIATOR TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2018-12-27 US disclosed
US-8778596-B2 Photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, and pattern forming method and article using the photosensitive resin composition DAI NIPPON PRINTING CO., LTD. (JP) 2014-07-15 US disclosed
US-8697332-B2 Base generator, photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, pattern forming method using the photosensitive resin composition and products comprising the same DAI NIPPON PRINTING CO., LTD. (JP) 2014-04-15 US disclosed
US-20130309607-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION DAI NIPPON PRINTING CO., LTD. (JP) 2013-11-21 US disclosed
US-4914180-A Polyamides prepared from 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoro propane HOECHST CELANESE CORPORATION (US) 1990-04-03 US disclosed
US-4866155-A HEAT, RADIATION RESISTANCE; TRANSPARENCY HOECHST CELANESE CORPORATION (US) 1989-09-12 US disclosed
EP-0323561-A2 Polyesters of bis (2-(4-hydroxyphenyl) hexafluoroisopropyl)- diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-07-12 EP disclosed
US-4845183-A MOLDING MATERIALS; FOR DIELECTRICS OR COATING SOLUTIONS; TOUGHNESS, FLEXIBILITY, TRANSPARENT HOECHST CELANESE CORPORATION (US) 1989-07-04 US disclosed
EP-0317944-A2 Polymers prepared from 4,4'-bis-(2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl) diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP disclosed
EP-0317940-A2 Polycarbonamides of bis (2-(4-carboxyphenyl)hexafluoroisopropyl) - diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-05-31 EP disclosed
EP-0317942-A2 Heat resistant polyamides and polybenzoxazoles from bis-[(aminohydroxyphenyl hexafluoro-isopropyl] diphenyl ethers HOECHST CELANESE CORPORATION (US) 1989-05-31 EP disclosed
US-4822868-A Polycarbonamide of bis(2-(4-carboxyphenyl)-hexafluoroisopropyl)diphenyl ether HOECHST CELANESE CORPORATION (US) 1989-04-18 US disclosed
EP-0264678-A1 Polyamides with hexafluoroisopropylidene groups, positively acting photosensitive compositions, and recording materials using them HOECHST CELANESE CORPORATION (US) 1988-04-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11414382-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator RAD51, RER1, REV1 SRD5A2 2421/4885TSHR 2333/4885DAO 1023/4885
US-20210002216-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator RAD51, RER1, REV1 SRD5A2 2421/4885TSHR 2333/4885DAO 1023/4885
US-11608316-B2 Compound, photopolymerization initiator containing said compound, and photosensitive resin composition containing said photopolymerization initiator RAD51, RER1, TAS1R1 SRD5A2 2336/4885TSHR 2101/4885DAO 1459/4885
US-20180370908-A1 NOVEL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPRISING SAID COMPOUND, AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID PHOTOPOLYMERIZATION INITIATOR RAD51, ASIC1, SUN2 SRD5A2 3321/4885TSHR 4379/4885DAO 1409/4885
US-20200392079-A1 Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator RAD51, RER1, TAS1R1 SRD5A2 2336/4885TSHR 2101/4885DAO 1459/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.