Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 1/20 | 0.61 |
| ▸ | TSHR | P16473 | 3/20 | 0.48 |
| ▸ | TP53 | P04637 | 1/20 | 0.48 |
| ▸ | CA1 | P00915 | 4/20 | 0.45 |
| ▸ | CA2 | P00918 | 4/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.45 |
| ▸ | SRD5A2 | P31213 | 2/20 | 0.43 |
| ▸ | CA12 | O43570 | 2/20 | 0.41 |
| ▸ | CA4 | P22748 | 2/20 | 0.41 |
| ▸ | CA6 | P23280 | 2/20 | 0.41 |
| ▸ | CA7 | P43166 | 2/20 | 0.41 |
| ▸ | CA9 | Q16790 | 2/20 | 0.41 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.41 |
| ▸ | CA3 | P07451 | 1/20 | 0.41 |
| ▸ | TYR | P14679 | 1/20 | 0.41 |
| ▸ | DRD1 | P21728 | 1/20 | 0.41 |
| ▸ | CA5A | P35218 | 1/20 | 0.41 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.41 |
| ▸ | TPMT | P51580 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28300032 | 0.82 | PARP10 (0.47) | HPGDTSHRCA1CA2ALDH1A1 | |
| SCHEMBL2786186 | 0.79 | HPGD (0.65) | HPGDTSHRTP53CA1CA2 | |
| SCHEMBL105892 | 0.76 | HPGD (0.74) | HPGDTSHRTP53CA1CA2 | |
| SCHEMBL3482898 | 0.76 | HPGD (1.00) | HPGDTSHRTP53CA1CA2 | |
| SCHEMBL3650942 | 0.76 | ALDH1A1 (0.43) | HPGDTSHRCA1CA2ALDH1A1 | |
| SCHEMBL1930618 | 0.74 | HPGD (0.71) | HPGDTSHRTP53CA1CA2 | |
| Terephthalic Acid SCHEMBL28093370 | 0.73 | HPGD (0.47) | HPGDTSHRTP53CA1CA2 | |
| SCHEMBL30910037 | 0.72 | HPGD (0.68) | HPGDTSHRTP53CA1CA2 | |
| Terephthalic Acid SCHEMBL9341327 | 0.72 | TSHR (0.92) | TSHRTP53CA1CA2ALDH1A1 | |
| SCHEMBL4882555 | 0.71 | HPGD (0.59) | HPGDTSHRTP53CA1CA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636485-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-4553100-A1 | POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-14 | — | — | EP | disclosed |
| CN-119955091-A | Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| US-20250147420-A1 | Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-05-08 | — | — | US | disclosed |
| US-20130309607-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-11-21 | — | — | US | disclosed |
| US-8476444-B2 | Base generator | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-07-02 | — | — | US | disclosed |
| US-20120183751-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120070781-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-03-22 | — | — | US | disclosed |
| US-20110086311-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2011-04-14 | — | — | US | disclosed |
| US-7282323-B2 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-20050244739-A1 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
| US-6376151-B1 | HYDROXYPOLYAMIDES | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-04-23 | — | — | US | disclosed |
| EP-1096316-A1 | POSITIVE RESIST COMPOSITION | Asahi Kasei Kabushiki Kaisha (JP) | 2001-05-02 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120070781-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | RER1, SUN2, REV1 | HPGD 861/4885TSHR 3908/4885TP53 3740/4885 |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | HPGD 3438/4885TSHR 3214/4885TP53 4561/4885 |
| US-20110086311-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | RER1, SUN2, LCP1 | HPGD 1208/4885TSHR 3959/4885TP53 3496/4885 |
| US-20120183751-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | RER1, SUN2, POLR1G | HPGD 1021/4885TSHR 4009/4885TP53 4028/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | HPGD 4313/4885TSHR 3402/4885TP53 2896/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.