SCHEMBL7920429

SCHEMBL7920429

CCOC(C(=O)OC)C(C)C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ABCB1 P08183 1/20 0.44
SMN1; SMN2 Q16637 2/20 0.43
CA14 Q9ULX7 3/20 0.38
CA12 O43570 2/20 0.38
MGAM O43451 1/20 0.37
GAA P10253 1/20 0.37
SI P14410 1/20 0.37
MGAM2 Q2M2H8 1/20 0.37
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
LMNA P02545 2/20 0.36
TSHR P16473 1/20 0.35
ALDH1A1 P00352 2/20 0.35
ZDHHC7 Q9NXF8 1/20 0.34
CA7 P43166 1/20 0.34
CA9 Q16790 1/20 0.34
HSD17B10 Q99714 2/20 0.33
MAPT P10636 1/20 0.33
MMP1 P03956 1/20 0.32
MMP2 P08253 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7922533 0.84 ALDH1A1 (0.42) MGAMGAASIMGAM2LMNA
SCHEMBL31410701 0.83 ABCB1 (0.35) ABCB1SMN1; SMN2MGAMGAASI
SCHEMBL12626100 0.79 ABCB1 (0.50) ABCB1SMN1; SMN2CA1CA2LMNA
SCHEMBL12928387 0.77 ABCB1 (0.47) ABCB1SMN1; SMN2CA14CA12MGAM
SCHEMBL196133 0.76
SCHEMBL9628984 0.76 MMP1 (0.48) LMNAMMP1MMP2MMP3MMP9
SCHEMBL14459543 0.76
SCHEMBL26940409 0.76 MMP1 (0.48) LMNAMMP1MMP2MMP3MMP9
SCHEMBL926431 0.76
SCHEMBL13500175 0.76 LMNA (0.40) MGAMGAASIMGAM2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0211667-B1 RADIATION-SENSITIVE RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-11 EP claimed
EP-0457367-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-11-21 EP claimed
EP-0211667-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-02-25 EP claimed
US-6270939-B1 STORAGE STABILITY AND SUITED FOR USE AS A RESIST FOR MAKING INTEGRATED CIRCUITS JSR CORPORATION (JP) 2001-08-07 US disclosed
US-6228554-B1 BLEND OF ALKALI SOLUBLE RESIN AND A 1,2-QUINONEDIAZIDE COMPOUND JSR CORPORATION (JP) 2001-05-08 US disclosed
US-6020104-A SOLVENT FOR BOTH ALKALI SOLUBLE RESIN AND PHOTOSENSITVE COMPOUND; STORAGE STABILITY JSR CORPORATION (JP) 2000-02-01 US disclosed
US-5925492-A STORAGE STABLE RESIN FOR PHOTORESISTS AND INTEGRATED CIRCUITS JSR CORPORATION (JP) 1999-07-20 US disclosed
US-5494784-A COATING WAFER WITH RADIATION SENSITIVE SOLUTION OF ALKALI SOLUBLE RESIN AND 1,2-QUINONEDIAZIDE COMPOUND IN OXYCARBOXYLIC ACID ESTER SOLVENT, PREBAKING, APPLYING RADIATION THROUGH MASK, DEVELOPING PATTERN JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-02-27 US disclosed
US-5405720-A A photoresists solution for integrated circuits comprising a novolak resin and photosensitive color materials JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-04-11 US disclosed
US-5238774-A Photoresists, integrated circuits JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-08-24 US disclosed
US-5215857-A Resists for making integrated circuits JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-06-01 US disclosed
EP-0211667-B1 RADIATION-SENSITIVE RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-11 EP disclosed
EP-0457367-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-11-21 EP disclosed
EP-0211667-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-02-25 EP disclosed