Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3627315 | 0.79 | — | — | |
| SCHEMBL5052710 | 0.76 | — | — | |
| SCHEMBL7545319 | 0.70 | — | — | |
| SCHEMBL842341 | 0.68 | TDP1 (0.33) | — | |
| SCHEMBL2233576 | 0.66 | ESR1 (0.39) | ESR1ESR2 | |
| SCHEMBL211428 | 0.66 | ESR1 (0.39) | ESR1ESR2 | |
| SCHEMBL6471969 | 0.65 | ESR1 (0.32) | ESR1ESR2 | |
| SCHEMBL7565872 | 0.65 | ESR1 (0.38) | ESR1ESR2 | |
| SCHEMBL170177 | 0.64 | — | — | |
| SCHEMBL332855 | 0.63 | ESR1 (0.37) | ESR1ESR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023053760-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION | 旭化成ワッカーシリコーン株式会社 | 2023-04-06 | — | — | WO | disclosed |
| EP-2935494-B1 | HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING | DOW SILICONES CORP (US) | 2019-05-29 | — | — | EP | disclosed |
| US-9536799-B2 | Hot-melt type curable silicone composition for compression molding or laminating | DOW CORNING CORPORATION (US) | 2017-01-03 | — | — | US | disclosed |
| US-20160240753-A1 | Film-Like Thermosetting Silicone Sealing Material | DOW CORNING TORAY CO. LTD. (JP) | 2016-08-18 | — | — | US | disclosed |
| US-20150315427-A1 | HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING | DOW TORAY CO., LTD. (JP) | 2015-11-05 | — | — | US | disclosed |
| EP-2935494-A1 | HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING | Dow Corning Corporation (US) | 2015-10-28 | — | — | EP | disclosed |
| US-20150115311-A1 | Film-Like Thermosetting Silicone Sealing Material | DOW CORNING TORAY CO., LTD. (JP) | 2015-04-30 | — | — | US | disclosed |
| EP-2844700-A1 | FILM-LIKE THERMOSETTING SILICONE SEALING MATERIAL | Dow Corning Toray Co., Ltd. (JP) | 2015-03-11 | — | — | EP | disclosed |
| WO-2014100656-A1 | HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING | DOW CORNING CORPORATION (US) | 2014-06-26 | — | — | WO | disclosed |
| WO-2013165010-A1 | FILM-LIKE THERMOSETTING SILICONE SEALING MATERIAL | DOW CORNING TORAY CO., LTD. (JP) | 2013-11-07 | — | — | WO | disclosed |
| EP-1004631-A2 | Vibration-proof rubber composition | Dow Corning Toray Silicone Company, Ltd. (JP) | 2000-05-31 | — | — | EP | disclosed |
| EP-0596534-A2 | Curable organopolysiloxane composition with initial and durable adherence | Dow Corning Toray Silicone Co., Ltd. (JP) | 1994-05-11 | — | — | EP | disclosed |
| EP-0018737-A1 | Process for producing spherical carrier particles for olefin polymerisation catalyst, catalyst comprising such carrier particles, and use of such catalyst in olefin polymerisation | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1980-11-12 | — | — | EP | disclosed |