SCHEMBL337274

SCHEMBL337274

CC(C)C1CCC(C)(c2ccccc2)C(c2ccccc2)C1

nearest known ligand 0.40

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
KDM1A O60341 11/20 0.40
MAOB P27338 11/20 0.40
MAOA P21397 10/20 0.40
OPRL1 P41146 4/20 0.39
RORC P51449 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8675186 0.92 OPRL1 (0.35) KDM1AMAOBMAOAOPRL1RORC
SCHEMBL4333830 0.82 ESR2 (0.42)
SCHEMBL24322076 0.80 SLC6A4 (0.38) KDM1AMAOBMAOAOPRL1
SCHEMBL5244042 0.79 OPRL1 (0.39) KDM1AMAOBMAOAOPRL1
SCHEMBL17847283 0.77 DPP4 (0.37) KDM1AMAOBMAOAOPRL1
SCHEMBL8196759 0.76 GAA (0.35)
SCHEMBL11880210 0.76 OPRL1 (0.37) KDM1AMAOBMAOAOPRL1
SCHEMBL4753778 0.76 OPRL1 (0.35) KDM1AMAOBMAOAOPRL1
SCHEMBL8973167 0.76 ALDH1A1 (0.35) KDM1AMAOBMAOA
SCHEMBL1248050 0.73 KDM1A (0.44) KDM1AMAOBMAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 170 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0144178-A1 Cyanoacrylate adhesive composition having sustained toughness MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1985-06-12 EP claimed
CN-122094826-A Method for producing laminate and method for separating CO2 2026-05-26 CN disclosed
CN-122094772-A Method for producing laminated film, and method for separating CO2 2026-05-26 CN disclosed
US-12637638-B2 Rinsing solution, method of treating substrate, and method of manufacturing semiconductor device TOKYO OHKA KOGYO CO., LTD. (JP) 2026-05-26 US disclosed
US-12595564-B2 Method of forming surface treatment film TOKYO OHKA KOGYO CO., LTD. (JP) 2026-04-07 US disclosed
US-12575346-B2 Method for treating surface of substrate, method for region-selectively producing film on surface of substrate, and surface treatment agent TOKYO OHKA KOGYO CO., LTD. (JP) 2026-03-10 US disclosed
US-12570860-B2 Two-component treatment agent, treatment method for making metal surface antibacterial and antibacterial treatment agent TOKYO OHKA KOGYO CO., LTD. (JP) 2026-03-10 US disclosed
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD CENTRAL GLASS CO LTD (JP) 2026-01-15 US disclosed
US-20250343040-A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD CENTRAL GLASS CO LTD (JP) 2025-11-06 US disclosed
US-20250210375-A1 SURFACE TREATMENT COMPOSITION AND METHOD FOR PRODUCING WAFER CENTRAL GLASS COMPANY, LIMITED (JP) 2025-06-26 US disclosed
US-20140109941-A1 RETENTION DEVICE AND RETENTION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2014-04-24 US disclosed
US-20120083561-A1 ADHESIVE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2012-04-05 US disclosed
US-20120031443-A1 CLEANING DEVICE, CLEANING METHOD, AND COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2012-02-09 US disclosed
US-8097397-B2 Material for formation of protective film, method for formation of photoresist pattern, and solution for washing/removal of protective film TOKYO OHKA KOGYO CO., LTD. (JP) 2012-01-17 US disclosed
US-8058220-B2 Cleaning liquid for lithography and a cleaning method using it for photoexposure devices TOKYO OHKA KOGYO CO., LTD. (JP) 2011-11-15 US disclosed
US-20110195190-A1 SURFACE TREATMENT LIQUID, SURFACE TREATMENT METHOD, HYDROPHOBILIZATION METHOD, AND HYDROPHOBILIZED SUBSTRATE TOKYO OHKA KOGYO CO., LTD (JP) 2011-08-11 US disclosed
US-20110061678-A1 Cleaning liquid for lithography and a cleaning method using it for photoexposure devices TOKYO OHKA KOGYO CO., LTD. (JP) 2011-03-17 US disclosed
US-20100086879-A1 MATERIAL FOR FORMATION OF PROTECTIVE FILM, METHOD FOR FORMATION OF PHOTORESIST PATTERN, AND SOLUTION FOR WASHING/REMOVAL OF PROTECTIVE FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-08 US disclosed
US-20100086799-A1 Removal method, adhesive agent for substrate, and laminate including substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-08 US disclosed
EP-1962327-A1 WASHING LIQUID FOR PHOTOLITHOGRAPHY, AND METHOD FOR WASHING EXPOSURE DEVICE USING THE SAME TOKYO OHKA KOGYO CO., LTD. (JP) 2008-08-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12637638-B2 Rinsing solution, method of treating substrate, and method of manufacturing semiconductor device DSTN, CFL1, TLN1 KDM1A 339/4885MAOB 988/4885MAOA 1193/4885
US-12570860-B2 Two-component treatment agent, treatment method for making metal surface antibacterial and antibacterial treatment agent SARS1, ACE2, EIF2AK2 KDM1A 1944/4885MAOB 214/4885MAOA 381/4885
US-12595564-B2 Method of forming surface treatment film TWF2, IKZF3, HAO2 KDM1A 1029/4885MAOB 1421/4885MAOA 847/4885
US-20260018421-A1 SUBSTRATE PROCESSING METHOD, AND SUBSTRATE MANUFACTURING METHOD ESPL1, SMS, SGMS1 KDM1A 667/4885MAOB 945/4885MAOA 377/4885
US-12575346-B2 Method for treating surface of substrate, method for region-selectively producing film on surface of substrate, and surface treatment agent SI, SIK1, BAK1 KDM1A 474/4885MAOB 2680/4885MAOA 2280/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.