SCHEMBL823156

SCHEMBL823156

Cc1ccc(NC(=O)c2ccc(C)c(C)c2)cc1C

nearest known ligand 0.75

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 8/20 0.75
▸ NPC1 O15118 7/20 0.75
▸ KMT2A Q03164 5/20 0.75
▸ MEN1 O00255 3/20 0.68
▸ FKBP5 Q13451 1/20 0.66
▸ KCNQ3 O43525 1/20 0.65
▸ KCNQ2 O43526 1/20 0.65
▸ SMN1; SMN2 Q16637 5/20 0.63
▸ MAPT P10636 2/20 0.63
▸ TP53 P04637 2/20 0.62
▸ POLB P06746 2/20 0.61
▸ CYP1A2 P05177 1/20 0.58
▸ MLLT1 Q03111 1/20 0.57
▸ TDP1 Q9NUW8 1/20 0.57
▸ PKM P14618 1/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25815389 0.94 NPC1 (0.72) RAB9ANPC1KMT2AMEN1FKBP5
SCHEMBL13400967 0.93 RAB9A (0.67) RAB9ANPC1KMT2AMEN1FKBP5
SCHEMBL30153426 0.90 FKBP5 (0.63) RAB9ANPC1KMT2AMEN1FKBP5
SCHEMBL1949548 0.90 FKBP5 (0.63) RAB9ANPC1KMT2AMEN1FKBP5
SCHEMBL2917616 0.90 FKBP5 (0.73) RAB9ANPC1KMT2AMEN1FKBP5
SCHEMBL22580585 0.89 NPC1 (0.66) RAB9ANPC1KMT2AMEN1KCNQ3
SCHEMBL22580645 0.89 NPC1 (0.66) RAB9ANPC1KMT2AMEN1KCNQ3
SCHEMBL2622747 0.89 NPC1 (0.72) RAB9ANPC1KMT2AMEN1KCNQ3
SCHEMBL14350091 0.88 RAB9A (0.65) RAB9ANPC1KMT2AMEN1FKBP5
SCHEMBL12706788 0.88 TOP1 (0.72) RAB9ANPC1KMT2AMEN1FKBP5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11814483-B2 Separation membrane comprising coating layer, method of preparing same, and battery using same SAMSUNG SDI CO., LTD. (KR) 2023-11-14 — — US disclosed
US-11814483-B2 Separation membrane comprising coating layer, method of preparing same, and battery using same SAMSUNG SDI CO., LTD. (KR) 2023-11-14 — — US disclosed
US-11739183-B2 Poly(amide-imide) copolymer, method of manufacturing the same, poly(amide-imide) copolymer film, window for display device, and display device SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-08-29 — — US disclosed
US-20230231270-A1 Separator and Application Thereof MICROCOSM TECHNOLOGY CO., LTD. (TW) 2023-07-20 — — US disclosed
EP-4213290-A2 SEPARATOR AND APPLICATION THEREOF Microcosm Technology Co., Ltd. (TW) 2023-07-19 — — EP disclosed
US-20210036294-A1 SEPARATION MEMBRANE COMPRISING COATING LAYER, METHOD OF PREPARING SAME, AND BATTERY USING SAME SAMSUNG SDI CO LTD (KR) 2021-02-04 — — US disclosed
US-20200332063-A1 POLY(AMIDE-IMIDE) COPOLYMER, METHOD OF MANUFACTURING THE SAME, POLY(AMIDE-IMIDE) COPOLYMER FILM, WINDOW FOR DISPLAY DEVICE, AND DISPLAY DEVICE SAMSUNG ELECTRONICS CO LTD (KR) 2020-10-22 — — US disclosed
US-10438574-B2 Sound absorbing and insulating material and method for manufacturing the same HYUNDAI MOTOR COMPANY (KR) 2019-10-08 — — US disclosed
EP-3086316-B1 SOUND ABSORBING AND INSULATING MATERIAL AND METHOD FOR MANUFACTURING THE SAME HYUNDAI MOTOR CO LTD (KR) 2019-07-31 — — EP disclosed
US-9975997-B2 Compositions, composites prepared therefrom, and films and electronic devices including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-05-22 — — US disclosed
US-20100099804-A1 POLYMER COMPOUNDS AND A PREPARATION METHOD THEREOF INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) 2010-04-22 — — US disclosed
WO-2010001780-A1 HEAT-RESISTANT RESIN PRECURSOR AND PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME 旭化成イーマテリアルズ株式会社 (JP) 2010-01-07 — — WO disclosed
US-20090297850-A1 HOLLOW FIBER, DOPE COMPOSITION FOR FORMING HOLLOW FIBER, AND METHOD OF MAKING HOLLOW FIBER USING THE SAME IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) 2009-12-03 — — US disclosed
US-20090297850-A1 HOLLOW FIBER, DOPE COMPOSITION FOR FORMING HOLLOW FIBER, AND METHOD OF MAKING HOLLOW FIBER USING THE SAME IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) 2009-12-03 — — US disclosed
US-20090286078-A1 POLYIMIDES DOPE COMPOSITION, PREPARATION METHOD OF HOLLOW FIBER USING THE SAME AND HOLLOW FIBER PREPARED THEREFROM INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) 2009-11-19 — — US disclosed
US-20090286078-A1 POLYIMIDES DOPE COMPOSITION, PREPARATION METHOD OF HOLLOW FIBER USING THE SAME AND HOLLOW FIBER PREPARED THEREFROM INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) 2009-11-19 — — US disclosed
US-20090286904-A1 POLYAMIC ACIDS DOPE COMPOSITION, PREPARATION METHOD OF HOLLOW FIBER USING THE SAME AND HOLLOW FIBER PREPARED THEREFROM INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) 2009-11-19 — — US disclosed
US-20090286904-A1 POLYAMIC ACIDS DOPE COMPOSITION, PREPARATION METHOD OF HOLLOW FIBER USING THE SAME AND HOLLOW FIBER PREPARED THEREFROM INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITY (KR) 2009-11-19 — — US disclosed
US-20090282982-A1 HOLLOW FIBER, DOPE COMPOSITION FOR FORMING HOLLOW FIBER, AND METHOD OF PREPARING HOLLOW FIBER USING THE SAME IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) 2009-11-19 — — US disclosed
US-20090282982-A1 HOLLOW FIBER, DOPE COMPOSITION FOR FORMING HOLLOW FIBER, AND METHOD OF PREPARING HOLLOW FIBER USING THE SAME IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (KR) 2009-11-19 — — US disclosed
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