SCHEMBL8405084

SCHEMBL8405084

CCCc1ccccc1OC(=O)c1ccc([N+](=O)[O-])cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPSR1 Q6W5P4 1/20 0.49
ALOX5 P09917 4/20 0.47
KMT2A Q03164 3/20 0.47
PKM P14618 1/20 0.47
TYMS P04818 1/20 0.46
KCNJ1 P48048 1/20 0.46
KCNH2 Q12809 1/20 0.46
ALDH1A1 P00352 2/20 0.46
MAPT P10636 2/20 0.46
PTGES O14684 1/20 0.45
ATM Q13315 1/20 0.45
L3MBTL1 Q9Y468 1/20 0.45
MEN1 O00255 2/20 0.45
ABCG2 Q9UNQ0 1/20 0.45
BCL9 O00512 1/20 0.45
CTNNB1 P35222 1/20 0.45
CES2 O00748 1/20 0.44
CES1 P23141 1/20 0.44
POLB P06746 1/20 0.44
APLNR P35414 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8405085 0.85 ALOX5 (0.48) ALOX5KMT2AALDH1A1MAPTPTGES
SCHEMBL3760693 0.83 NPSR1 (0.58) NPSR1KMT2AMAPTL3MBTL1MEN1
SCHEMBL8405141 0.81 NPSR1 (0.53) NPSR1KMT2AKCNH2ALDH1A1MAPT
SCHEMBL10722849 0.80 BCL9 (0.52) ALOX5KMT2APKMALDH1A1MAPT
SCHEMBL10723403 0.79 BCL9 (0.51) KMT2APKMALDH1A1MAPTMEN1
SCHEMBL2462368 0.78 KMT2A (0.63) ALOX5KMT2APKMKCNJ1KCNH2
SCHEMBL10955718 0.78 KMT2A (0.63) ALOX5KMT2APKMKCNJ1KCNH2
SCHEMBL4631646 0.78 NPSR1 (0.53) NPSR1KMT2APKMALDH1A1MAPT
SCHEMBL10727724 0.78 ALDH1A1 (0.52) KMT2APKMALDH1A1MAPTMEN1
SCHEMBL10724292 0.78 ALDH1A1 (0.52) KMT2APKMALDH1A1MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0567993-B1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI CHEMICAL IND (JP) 1999-07-14 EP disclosed
US-5397419-A Dissolving in solvent, coating or impregnation to form prepreg, heating, pressurization; heat resistant paints, electronics KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
EP-0567993-A1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1993-11-03 EP disclosed