SCHEMBL8405085

SCHEMBL8405085

CCCc1ccc([N+](=O)[O-])cc1OC(=O)c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALOX5 P09917 6/20 0.48
MDM2 Q00987 1/20 0.46
CES2 O00748 2/20 0.44
PTGES O14684 1/20 0.43
ALDH1A1 P00352 3/20 0.43
LMNA P02545 2/20 0.43
MAPT P10636 1/20 0.43
HPGD P15428 1/20 0.43
ATM Q13315 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ELANE P08246 1/20 0.43
EPHX1 P07099 1/20 0.42
CES1 P23141 1/20 0.42
MEN1 O00255 1/20 0.42
ALOX12 P18054 1/20 0.42
KMT2A Q03164 1/20 0.42
SYK P43405 1/20 0.42
VCP P55072 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8405084 0.85 NPSR1 (0.49) ALOX5CES2PTGESALDH1A1MAPT
SCHEMBL11751170 0.81 ALOX5 (0.57) ALOX5MDM2CES2PTGESALDH1A1
SCHEMBL8405147 0.79 KMT2A (0.43) ALDH1A1LMNAMAPTTDP1MEN1
SCHEMBL3760693 0.78 NPSR1 (0.58) LMNAMAPTTDP1MEN1KMT2A
SCHEMBL27730499 0.78 MDM2 (0.54) ALOX5MDM2CES2PTGESALDH1A1
SCHEMBL9156978 0.77 ALOX5 (0.50) ALOX5MDM2CES2PTGESALDH1A1
SCHEMBL11760950 0.76 CES2 (0.55) ALOX5MDM2CES2PTGESALDH1A1
SCHEMBL28487709 0.76 CES2 (0.55) ALOX5MDM2CES2PTGESALDH1A1
SCHEMBL20299855 0.75 BCL9 (0.44) ALOX5ALDH1A1LMNAMAPTHPGD
SCHEMBL4697147 0.75 HGFAC (0.67) ALOX5MDM2CES2PTGESALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0567993-B1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI CHEMICAL IND (JP) 1999-07-14 EP disclosed
US-5397419-A Dissolving in solvent, coating or impregnation to form prepreg, heating, pressurization; heat resistant paints, electronics KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
EP-0567993-A1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1993-11-03 EP disclosed