SCHEMBL8589136

SCHEMBL8589136

C=CCC(CC(=O)OCC1CO1)C(=O)OCC1CO1

nearest known ligand 0.42

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
MGLL Q99685 4/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28646067 0.88 ALDH1A1 (0.41) ALDH1A1TP53CYP3A4MGLL
SCHEMBL729485 0.85 ALDH1A1 (0.46) ALDH1A1TP53CYP3A4MGLL
SCHEMBL27224373 0.81 ALDH1A1 (0.42) ALDH1A1TP53CYP3A4MGLL
SCHEMBL20760836 0.80 ALDH1A1 (0.45) ALDH1A1TP53CYP3A4MGLL
SCHEMBL8849390 0.79 ALDH1A1 (0.37) ALDH1A1TP53CYP3A4MGLL
SCHEMBL28835209 0.78 ALDH1A1 (0.42) ALDH1A1TP53CYP3A4
SCHEMBL8611429 0.78 MGLL (0.41) ALDH1A1TP53CYP3A4MGLL
SCHEMBL15268254 0.75 ALDH1A1 (0.46) ALDH1A1TP53CYP3A4MGLL
SCHEMBL7595988 0.75 ALDH1A1 (0.50) ALDH1A1TP53CYP3A4MGLL
SCHEMBL12697221 0.75 ALDH1A1 (0.46) ALDH1A1TP53CYP3A4MGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110430997-B Bonded composite of thermoplastic resin fiber-reinforced composite material and metal member, and method for producing same 株式会社钟化 2021-09-21 CN claimed
US-12595363-B2 Thermoplastic resin composition and method for producing same KANEKA CORPORATION (JP) 2026-04-07 US disclosed
CN-113767149-B Low dielectric resin composition, molded article, film, laminated film, and flexible printed wiring board 株式会社钟化 2025-02-11 CN disclosed
EP-3597408-B1 BONDED COMPOSITE OF THERMOPLASTIC-RESIN-BASED FIBER-REINFORCED COMPOSITE MATERIAL AND METAL MEMBER, AND METHOD FOR PRODUCING BONDED COMPOSITE KANEKA CORP (JP) 2024-09-18 EP disclosed
US-11993740-B2 Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring board KANEKA CORPORATION (JP) 2024-05-28 US disclosed
US-20220363892-A1 THERMOPLASTIC RESIN COMPOSITION AND METHOD FOR PRODUCING SAME KANEKA CORPORATION (JP) 2022-11-17 US disclosed
CN-111032751-B Polymer film, film-like laminate, and method for producing polymer film 琳得科株式会社 2022-10-28 CN disclosed
CN-115210323-A Thermoplastic resin composition and method for producing same 株式会社钟化 2022-10-18 CN disclosed
EP-4023726-A1 COATING RESIN COMPOSITION, AND MOLDED PRODUCT Techno-UMG Co., Ltd. (JP) 2022-07-06 EP disclosed
US-20220041932-A1 LOW DIELECTRIC RESIN COMPOSITION, MOLDED ARTICLE, FILM, MULTILAYER FILM AND FLEXIBLE PRINTED WIRING BOARD KANEKA CORPORATION (JP) 2022-02-10 US disclosed
CN-113993955-A Resin composition for coating and molded article 大科能宇菱通株式会社 2022-01-28 CN disclosed
CN-113767149-A Low dielectric resin composition, molded article, film, laminated film, and flexible printed wiring board 株式会社钟化 2021-12-07 CN disclosed
CN-110430997-B Bonded composite of thermoplastic resin fiber-reinforced composite material and metal member, and method for producing same 株式会社钟化 2021-09-21 CN disclosed
WO-2021039741-A1 COATING RESIN COMPOSITION, AND MOLDED PRODUCT テクノUMG株式会社 2021-03-04 WO disclosed
WO-2020218405-A1 LOW DIELECTRIC RESIN COMPOSITION, MOLDED ARTICLE, FILM, MULTILAYER FILM AND FLEXIBLE PRINTED WIRING BOARD 株式会社カネカ 2020-10-29 WO disclosed
CN-111032751-A Polymer film, film-like laminate, and method for producing polymer film 琳得科株式会社 2020-04-17 CN disclosed
CN-103748154-B fluoropolymer composition for multilayer assembly SOLVAY SPECIALTY POLYMERS ITALY S.P.A. (IT) 2015-11-25 CN disclosed
EP-0638749-B1 Improvements in or relating to pipes VICTAULIC PLC (GB) 1998-06-17 EP disclosed
EP-0638749-A1 Improvements in or relating to pipes VICTAULIC PLC (GB) 1995-02-15 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12595363-B2 Thermoplastic resin composition and method for producing same RARA, ASIC1, COL2A1 ALDH1A1 2101/4885TP53 2599/4885CYP3A4 4337/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.