Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALOX15 | P16050 | 1/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.48 |
| ▸ | PARP11 | Q9NR21 | 1/20 | 0.47 |
| ▸ | CALM1 | P0DP23 | 1/20 | 0.46 |
| ▸ | IDH1 | O75874 | 1/20 | 0.46 |
| ▸ | ELANE | P08246 | 2/20 | 0.43 |
| ▸ | HNF4A | P41235 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.41 |
| ▸ | PLA2G2A | P14555 | 3/20 | 0.40 |
| ▸ | PLA2G10 | O15496 | 2/20 | 0.40 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | SORT1 | Q99523 | 1/20 | 0.40 |
| ▸ | MPO | P05164 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL434869 | 0.92 | ALOX15 (0.50) | ALOX15TDP1PARP11IDH1ELANE | |
| SCHEMBL19927918 | 0.85 | ALDH1A1 (0.40) | ALOX15TDP1PARP11ELANEALDH1A1 | |
| SCHEMBL8034832 | 0.85 | MAOA (0.51) | ALOX15TDP1ALDH1A1 | |
| SCHEMBL13883791 | 0.84 | ALOX15 (0.39) | ALOX15TDP1PARP11IDH1ELANE | |
| SCHEMBL23625252 | 0.81 | TDP1 (0.40) | ALOX15TDP1PARP11ELANEALDH1A1 | |
| SCHEMBL14492052 | 0.81 | TDP1 (0.40) | ALOX15TDP1PARP11ELANEALDH1A1 | |
| SCHEMBL25992001 | 0.81 | ALDH1A1 (0.37) | ALOX15TDP1PARP11ELANEALDH1A1 | |
| SCHEMBL6762077 | 0.80 | MAPK1 (0.60) | TDP1PARP11CALM1IDH1ELANE | |
| SCHEMBL16265473 | 0.80 | LMNA (0.55) | PARP11CALM1IDH1ELANEHNF4A | |
| SCHEMBL9602115 | 0.80 | CA12 (0.39) | ALOX15TDP1HNF4AALDH1A1PLA2G2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20170363992-A1 | ENDLESS BELT, IMAGE FORMING APPARATUS, AND ENDLESS BELT UNIT | FUJI XEROX CO., LTD. (JP) | 2017-12-21 | — | — | US | disclosed |
| US-9781836-B2 | Thermosetting resin composition, method for forming protective film for flexible wiring board, and flexible wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-10-03 | — | — | US | disclosed |
| US-20150166924-A1 | COATING COMPOSITION CONTAINING POLYAMIDE-IMIDE RESIN | DOW CORNING TORAY CO., LTD. (JP) | 2015-06-18 | — | — | US | disclosed |
| US-20150062763-A1 | DISCHARGE GAP FILLING COMPOSITION AND ELECTROSTATIC DISCHARGE PROTECTOR | SHOWA DENKO K.K. (JP) | 2015-03-05 | — | — | US | disclosed |
| US-8888906-B2 | Heat-sensitive color-developing composition and heat-sensitive recording material comprising the composition | YAMAMOTO CHEMICALS, INC. (JP) | 2014-11-18 | — | — | US | disclosed |
| US-8888906-B2 | Heat-sensitive color-developing composition and heat-sensitive recording material comprising the composition | YAMAMOTO CHEMICALS, INC. (JP) | 2014-11-18 | — | — | US | disclosed |
| US-20130308233-A1 | DISCHARGE GAP-FILLING COMPOSITION AND ELECTROSTATIC DISCHARGE PROTECTOR | SHOWA DENKO K.K. (JP) | 2013-11-21 | — | — | US | disclosed |
| US-8519817-B2 | Discharge gap filling composition and electrostatic discharge protector | SHOWA DENKO K.K. (JP) | 2013-08-27 | — | — | US | disclosed |
| US-20130180430-A1 | HEAT-SENSITIVE COLOR-DEVELOPING COMPOSITION AND HEAT-SENSITIVE RECORDING MATERIAL COMPRISING THE COMPOSITION | YAMAMOTO CHEMICALS, INC. (JP) | 2013-07-18 | — | — | US | disclosed |
| US-20130180430-A1 | HEAT-SENSITIVE COLOR-DEVELOPING COMPOSITION AND HEAT-SENSITIVE RECORDING MATERIAL COMPRISING THE COMPOSITION | YAMAMOTO CHEMICALS, INC. (JP) | 2013-07-18 | — | — | US | disclosed |
| US-8350660-B2 | Resin composition for filling discharge gap and electrostatic discharge protector | SHOWA DENKO K.K. (JP) | 2013-01-08 | — | — | US | disclosed |
| US-20120217045-A1 | THERMOSETTING RESIN COMPOSITION, METHOD FOR FORMING PROTECTIVE FILM FOR FLEXIBLE WIRING BOARD, AND FLEXIBLE WIRING BOARD | RESONAC CORPORATION (JP) | 2012-08-30 | — | — | US | disclosed |
| US-20120099231-A1 | DISCHARGE GAP FILLING COMPOSITION AND ELECTROSTATIC DISCHARGE PROTECTOR | SHOWA DENKO K.K. (JP) | 2012-04-26 | — | — | US | disclosed |
| US-20120006583-A1 | DISCHARGE GAP FILLING COMPOSITION AND ELECTROSTATIC DISCHARGE PROTECTOR | SHOWA DENKO K.K. (JP) | 2012-01-12 | — | — | US | disclosed |
| US-20110228432-A1 | RESIN COMPOSITION FOR FILLING DISCHARGE GAP AND ELECTROSTATIC DISCHARGE PROTECTOR | SHOWA DENKO K.K. (JP) | 2011-09-22 | — | — | US | disclosed |
| US-7345135-B2 | Crosslinkable aromatic resin having protonic acid group, and ion conductive polymer membrane, binder and fuel cell using the resin | MITSUI CHEMICALS, INC. (JP) | 2008-03-18 | — | — | US | disclosed |