Succinic Acid

Succinic Acid

SCHEMBL899288

CCCC[P+](CCCC)(CCCC)CCCC.CCCC[P+](CCCC)(CCCC)CCCC.O=C([O-])CCC(=O)[O-]

nearest known ligand 0.61

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADRB1CDK4CDK6CHRM2CHRM3DPP4DRD2DRD3DRD4EGFRHRH1HTR1BHTR1DHTR1FHTR2AHTR2CHTR4SLC6A2SLC6A4

The experimentally established mechanism targets of Succinic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CA2 P00918 4/20 0.61
CA1 P00915 2/20 0.58
NFKB1 P19838 1/20 0.53
FFAR3 O14843 2/20 0.52
HDAC3 O15379 2/20 0.52
HDAC1 Q13547 2/20 0.52
HDAC2 Q92769 2/20 0.52
HDAC8 Q9BY41 2/20 0.52
GPR84 Q9NQS5 1/20 0.52
DNM1 Q05193 2/20 0.50
CES2 O00748 1/20 0.46
CES1 P23141 1/20 0.46
FABP3 P05413 2/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Butyric Acid SCHEMBL10765538 0.93 FFAR3 (0.64) CA2CA1NFKB1FFAR3HDAC3
SCHEMBL253165 0.91 CA1 (0.60) CA2CA1NFKB1GPR84DNM1
Hexanoate SCHEMBL28546350 0.91 CA1 (0.60) CA2CA1NFKB1GPR84DNM1
Succinic Acid SCHEMBL17839040 0.91 DNM1 (0.58) CA2CA1NFKB1GPR84DNM1
Succinic Acid SCHEMBL6285946 0.90 CA2 (0.52) CA2CA1NFKB1GPR84FABP3
Stearic Acid SCHEMBL9063410 0.89 FABP3 (0.60) CA2CA1NFKB1GPR84DNM1
Decanoic Acid SCHEMBL3323693 0.89 FABP3 (0.60) CA2CA1NFKB1GPR84DNM1
Palmitic Acid SCHEMBL15091868 0.89 FABP3 (0.60) CA2CA1NFKB1GPR84DNM1
Dodecanoate SCHEMBL230531 0.89 FABP3 (0.60) CA2CA1NFKB1GPR84DNM1
Myristic Acid SCHEMBL15091865 0.89 FABP3 (0.60) CA2CA1NFKB1GPR84DNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 236 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10246558-B2 Compositions comprising siloxane compounds and methods for using the same MILLIKEN & COMPANY (US) 2019-04-02 US claimed
EP-3458498-A1 COMPOSITIONS COMPRISING SILOXANE COMPOUNDS AND METHODS FOR USING THE SAME Milliken & Company (US) 2019-03-27 EP claimed
US-20170335065-A1 COMPOSITIONS COMPRISING SILOXANE COMPOUNDS AND METHODS FOR USING THE SAME MILLIKEN & COMPANY 2017-11-23 US claimed
WO-2017201035-A1 COMPOSITIONS COMPRISING SILOXANE COMPOUNDS AND METHODS FOR USING THE SAME MILLIKEN & COMPANY (US) 2017-11-23 WO claimed
WO-2008128209-A1 POLYFUNCTIONAL EPOXY OLIGOMERS DESIGNER MOLECULES, INC. (US) 2008-10-23 WO claimed
WO-1993004122-A1 POLYESTER COMPOSITIONS CONTAINING PHOSPHONIUM COMPOUNDS THE DOW CHEMICAL COMPANY (US) 1993-03-04 WO claimed
US-4725652-A TETRASUBSTITUTED ONIUM COMPOUNDS THE DOW CHEMICAL COMPANY (US) 1988-02-16 US claimed
EP-4720144-A1 OXAZOLIDONE FUNCTIONAL COMPOUNDS AND COATING COMPOSITIONS INCLUDING OXAZOLIDONE FUNCTIONAL COMPOUNDS PPG Industries Ohio Inc. (US) 2026-04-08 EP disclosed
WO-2024243267-A1 OXAZOLIDONE FUNCTIONAL COMPOUNDS AND COATING COMPOSITIONS INCLUDING OXAZOLIDONE FUNCTIONAL COMPOUNDS PPG INDUSTRIES OHIO, INC. (US) 2024-11-28 WO disclosed
CN-111978511-B Epoxy resin, method for producing same, curable epoxy resin composition, cured product, prepreg, insulating sheet, and laminate 日铁化学材料株式会社 2024-10-25 CN disclosed
CN-117693546-A Composition and method for producing transparent thermoplastic polycarbonate/polymethyl methacrylate molding compound 科思创德国股份有限公司 2024-03-12 CN disclosed
WO-2023194883-A1 COPOLYMERIZATION OF ORTHO-PHTHALDEHYDE WITH MONOMERS KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY (SA) 2023-10-12 WO disclosed
CN-115403742-A Oxazolidone ring-containing epoxy resin, process for producing the same, epoxy resin composition and use thereof, and cured epoxy resin 日铁化学材料株式会社 2022-11-29 CN disclosed
WO-1986002085-A1 CURABLE COMPOSITIONS CONTAINING A POLYEPOXIDE AND A HALOGENATED DIHYDRIC PHENOL AND IMPREGNATED SUBSTRATES AND LAMINATES PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1986-04-10 WO disclosed
EP-0065564-B1 METHOD FOR PREPARING HIGH MOLECULAR WEIGHT EPOXY RESINS CONTAINING HYDROLYZED GLYCIDYL GROUPS THE DOW CHEMICAL COMPANY (US) 1986-04-02 EP disclosed
WO-1986000627-A1 PARTIALLY ADVANCED EPOXY RESIN COMPOSITIONS AND PRODUCTS RESULTING FROM REACTING AND CURING SAID COMPOSITIONS THE DOW CHEMICAL COMPANY (US) 1986-01-30 WO disclosed
US-4322456-A BY IN SITU POLYMERIZATION OF LOW MOLECULAR WEIGHT RESIN AN A PHENOLIC HYDROXY COMPOUND THE DOW CHEMICAL COMPANY (US) 1982-03-30 US disclosed
US-4136103-A MICROSTRUCTURE, HEAT RESISTANCE, THIXOTROPY IN ORGANIC LIQUIDS EXXON RESEARCH & ENGINEERING CO. (US) 1979-01-23 US disclosed
US-4053493-A MICROSTRUCTURE, THERMAL STABILITY, THIXOTROPY EXXON RESEARCH & ENGINEERING CO. (US) 1977-10-11 US disclosed
US-3943164-A IMPROVE DYEABILITY OF OLEFIN POLYMERS PHILLIPS PETROLEUM COMPANY (US) 1976-03-09 US disclosed