SCHEMBL9109022

SCHEMBL9109022

C=C(C)C(=O)OCC/C(=C/C(=O)O)C(=O)O.C=C(C)C(=O)OCCc1cccc(C(=O)O)c1C(=O)O

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.34
APEX1 P27695 1/20 0.34
HTT P42858 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
FOLH1 Q04609 2/20 0.34
BID P55957 6/20 0.32
MCL1 Q07820 6/20 0.32
BCL2L1 Q07817 5/20 0.32
BAK1 Q16611 5/20 0.32
KAT8 Q9H7Z6 2/20 0.32
PPARG P37231 2/20 0.32
PPARA Q07869 2/20 0.32
SAE1 Q9UBE0 2/20 0.32
EP300 Q09472 1/20 0.32
KAT2A Q92830 1/20 0.32
KAT2B Q92831 1/20 0.32
KAT5 Q92993 1/20 0.32
THRB P10828 1/20 0.32
MMP2 P08253 2/20 0.31
F7 P08709 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9109026 1.00 POLB (0.34) POLBAPEX1HTTTDP1FOLH1
SCHEMBL36344 0.87 POLB (0.43) POLBAPEX1HTTTDP1FOLH1
Itaconate SCHEMBL2638844 0.81 HTT (0.37) POLBAPEX1HTTTDP1FOLH1
SCHEMBL5442445 0.80 POLB (0.47) POLBAPEX1HTTTDP1FOLH1
SCHEMBL5441216 0.79 POLB (0.49) POLBAPEX1HTTTDP1FOLH1
SCHEMBL4946808 0.78 THRB (0.44) POLBAPEX1HTTTDP1THRB
SCHEMBL297292 0.78 THRB (0.44) POLBAPEX1HTTTDP1THRB
SCHEMBL94668 0.78 THRB (0.44) POLBAPEX1HTTTDP1THRB
SCHEMBL6323141 0.78 FOLH1 (0.58) POLBAPEX1HTTTDP1FOLH1
SCHEMBL28623616 0.76 THRB (0.43) POLBAPEX1HTTTDP1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3702387-B1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-10 EP disclosed
US-11142629-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2021-10-12 US disclosed
US-10890845-B2 Chemically amplified positive-type photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2021-01-12 US disclosed
EP-3702387-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-09-02 EP disclosed
US-10599036-B2 Chemically amplified positive-type photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-03-24 US disclosed
US-20190300674-A1 HYDROGEN BARRIER AGENT, HYDROGEN BARRIER FILM FORMING COMPOSITION, HYDROGEN BARRIER FILM, METHOD FOR PRODUCING HYDROGEN BARRIER FILM, AND ELECTRONIC ELEMENT TOKYO OHKA KOGYO CO., LTD. (JP) 2019-10-03 US disclosed
US-10261415-B2 Chemically amplified positive-type photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2019-04-16 US disclosed
US-20180259853-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD FOR MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2018-09-13 US disclosed
US-10023540-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-17 US disclosed
US-9981914-B2 2018-05-29 US disclosed
US-20170285476-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2017-10-05 US disclosed
US-9557651-B2 Chemically amplified positive-type photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2017-01-31 US disclosed
US-9448478-B2 Chemically amplified positive-type photosensitive resin composition for thick-film application TOKYO OHKA KOGYO CO., LTD. (JP) 2016-09-20 US disclosed
US-9244354-B2 Method for producing thick film photoresist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-01-26 US disclosed
US-20150268553-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-24 US disclosed
US-20150268557-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION FOR THICK-FILM APPLICATION TOKYO OHKA KOGYO CO., LTD. (JP) 2015-09-24 US disclosed
US-9091916-B2 Positive-type photoresist composition, photoresist laminate, method for producing photoresist pattern, and method for producing connecting terminal TOKYO OHKA KOGYO CO., LTD. (JP) 2015-07-28 US disclosed
US-20130230801-A1 POSITIVE-TYPE PHOTORESIST COMPOSITION, PHOTORESIST LAMINATE, METHOD FOR PRODUCING PHOTORESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL TOKYO OHKA KOGYO CO., LTD. (JP) 2013-09-05 US disclosed
US-20130171572-A1 METHOD FOR PRODUCING THICK FILM PHOTORESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2013-07-04 US disclosed
US-20120141940-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, AND METHOD FOR PRODUCING THICK FILM RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2012-06-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10023540-B2 Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element SLC9A2, SLC9A1, NHERF1 POLB 2120/4885APEX1 365/4885HTT 311/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.