Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TEK | Q02763 | 11/20 | 0.70 |
| ▸ | MAPK14 | Q16539 | 5/20 | 0.62 |
| ▸ | MAPK13 | O15264 | 2/20 | 0.62 |
| ▸ | MAPK12 | P53778 | 2/20 | 0.62 |
| ▸ | MAPK11 | Q15759 | 2/20 | 0.62 |
| ▸ | RAF1 | P04049 | 1/20 | 0.62 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.51 |
| ▸ | TP53 | P04637 | 1/20 | 0.50 |
| ▸ | MAPT | P10636 | 1/20 | 0.50 |
| ▸ | FABP4 | P15090 | 1/20 | 0.48 |
| ▸ | GCGR | P47871 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29363034 | 1.00 | TEK (0.70) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| Imidazole SCHEMBL5052057 | 0.89 | TEK (0.64) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL30290596 | 0.87 | MAPK13 (0.62) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL3454813 | 0.86 | MAPK14 (0.71) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL3194058 | 0.84 | TEK (0.73) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL11212515 | 0.84 | MAPK13 (0.76) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL7795648 | 0.83 | MAPK14 (0.67) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL29464077 | 0.83 | MAPK14 (0.69) | TEKMAPK14MAPK13MAPK12MAPK11 | |
| SCHEMBL28004199 | 0.82 | TEK (0.64) | TEKTP53MAPT | |
| SCHEMBL15452429 | 0.81 | MAPK14 (0.72) | TEKMAPK14MAPK13MAPK12MAPK11 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 176 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024179502-A1 | METHOD FOR INSULATING AND PROTECTING SLURRY, POLYIMIDE FILM, AND POWER BATTERY PACK COLD PLATE, AND POWER BATTERY PACK COLD PLATE HAVING INSULATING AND PROTECTIVE FILM | 比亚迪股份有限公司 | 2024-09-06 | — | — | WO | claimed |
| EP-0324481-B1 | STORAGE STABLE PHOTOPOLYMERIZABLE COMPOSITION FOR REFRACTIVE INDEX IMAGING | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1993-05-05 | — | — | EP | claimed |
| WO-2026100708-A1 | PHOTOSENSITIVE RESIN LAMINATE, PHOTOSENSITIVE ELEMENT, AND PATTERN FORMING METHOD | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12616240-B2 | Double-layer seamless capsule containing water-soluble composition | FUJI CAPSULE CO. LTD. (JP) | 2026-05-05 | — | — | US | disclosed |
| EP-4692936-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4692935-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4685561-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-01-28 | — | — | EP | disclosed |
| EP-4679172-A1 | METHOD FOR PRODUCING PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4675350-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-01-07 | — | — | EP | disclosed |
| US-20250390018-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT BOARD | RESONAC CORP (JP) | 2025-12-25 | — | — | US | disclosed |
| US-20250362600-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | RESONAC CORP (JP) | 2025-11-27 | — | — | US | disclosed |
| US-20010019806-A1 | Azomethine dye precursor, image-forming material, and image-forming method | FUJIFILM CORPORATION (JP) | 2001-09-06 | — | — | US | disclosed |
| US-5972562-A | Visible radiation-curable solder resist compositions, and method for forming solder resist patterns | FUJITSU LIMITED (JP) | 1999-10-26 | — | — | US | disclosed |
| EP-0398713-B1 | Photosensitive resin composition and laminate using the same | HITACHI CHEMICAL CO LTD (JP) | 1994-07-20 | — | — | EP | disclosed |
| EP-0398713-A2 | Photosensitive resin composition and laminate using the same | Hitachi Chemical Co., Ltd. (JP) | 1990-11-22 | — | — | EP | disclosed |
| US-4760150-A | 2,4,5-triphenylimidazole derivatives | HODOGAYA CHEMICAL CO., LTD. (JP) | 1988-07-26 | — | — | US | disclosed |
| EP-0247363-A1 | Triphenylimidazole compounds | HODOGAYA CHEMICAL CO., LTD. (JP) | 1987-12-02 | — | — | EP | disclosed |
| US-4369247-A | Process of producing relief structures using polyamide ester resins | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1983-01-18 | — | — | US | disclosed |
| US-4126466-A | Composite, mask-forming, photohardenable elements | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1978-11-21 | — | — | US | disclosed |
| US-4072527-A | Oxygen barrier layers for photopolymerizable elements | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1978-02-07 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250390018-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT BOARD | TPRKB, KDM4E, ILK | TEK 3080/4885MAPK14 1782/4885MAPK13 1220/4885 |
| US-12616240-B2 | Double-layer seamless capsule containing water-soluble composition | TNF, TAS2R13, TAS2R40 | TEK 3117/4885MAPK14 3796/4885MAPK13 2731/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.