Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOA | P21397 | 1/20 | 0.35 |
| ▸ | MAOB | P27338 | 1/20 | 0.35 |
| ▸ | TGM2 | P21980 | 1/20 | 0.34 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | NSD2 | O96028 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.32 |
| ▸ | FAAH | O00519 | 1/20 | 0.30 |
| ▸ | MGLL | Q99685 | 1/20 | 0.30 |
| ▸ | TEK | Q02763 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3675112 | 0.90 | DAO (0.41) | TGM2 | |
| SCHEMBL3791542 | 0.90 | CYP3A4 (0.46) | MAOAMAOBKMT2AL3MBTL1 | |
| SCHEMBL4804512 | 0.90 | ESR1 (0.46) | PTPN1 | |
| SCHEMBL94148 | 0.90 | MAOA (0.48) | MAOAMAOBPTPN1MEN1KMT2A | |
| Ammonia Solution, Strong SCHEMBL27962960 | 0.88 | MAOA (0.47) | MAOAMAOBPTPN1MEN1KMT2A | |
| Ethylene SCHEMBL28271283 | 0.86 | MAOA (0.46) | MAOAMAOBPTPN1MEN1KMT2A | |
| SCHEMBL3677950 | 0.86 | MEN1 (0.51) | MAOAMAOBMEN1NSD2KMT2A | |
| SCHEMBL18973135 | 0.86 | MAPT (0.40) | MAOAMAOB | |
| SCHEMBL1334773 | 0.85 | GSK3A (0.32) | — | |
| SCHEMBL4614546 | 0.84 | POLB (0.47) | MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 148 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113845775-B | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2022-06-21 | — | — | CN | claimed |
| CN-113845775-A | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2021-12-28 | — | — | CN | claimed |
| EP-0212808-B1 | Curable resins | TECHNOCHEMIE GMBH (DE) | 1993-11-24 | — | — | EP | claimed |
| EP-0230741-B1 | CURABLE RESINS | Technochemie GmbH - Verfahrenstechnik (DE) | 1993-08-11 | — | — | EP | claimed |
| EP-3438146-B1 | CYANIC ACID ESTER COMPOUND AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, CURED ARTICLE, PREPREG, SEALING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, ADHESIVE AGENT, METAL FOIL-CLAD LAMINATE PLATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2026-04-08 | — | — | EP | disclosed |
| US-20260078278-A1 | HIGH TEMPERATURE SURFACING FILM FOR COMPOSITE SUBSTRATES | CYTEC IND INC (US) | 2026-03-19 | — | — | US | disclosed |
| US-12568848-B2 | Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-12534559-B2 | Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2026-01-27 | — | — | US | disclosed |
| EP-3845575-B1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-12486371-B2 | Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2025-12-02 | — | — | US | disclosed |
| EP-3805293-B1 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2025-09-17 | — | — | EP | disclosed |
| US-20250270372-A1 | BISMALEIMIDE COMPOUND, RESIN COMPOSITION INCLUDING SAME, CURED OBJECT THEREFROM, SEMICONDUCTOR ELEMENT AND DRY FILM RESIST | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2025-08-28 | — | — | US | disclosed |
| US-9999126-B2 | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-06-12 | — | — | US | disclosed |
| EP-3312213-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2018-04-25 | — | — | EP | disclosed |
| US-20180099484-A1 | RESIN COMPOSITION, PREPREG, RESIN SHEET, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2018-04-12 | — | — | US | disclosed |
| EP-3252101-A1 | RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2017-12-06 | — | — | EP | disclosed |
| US-20170332487-A1 | RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2017-11-16 | — | — | US | disclosed |
| EP-0212808-B1 | Curable resins | TECHNOCHEMIE GMBH (DE) | 1993-11-24 | — | — | EP | disclosed |
| EP-0230741-B1 | CURABLE RESINS | Technochemie GmbH - Verfahrenstechnik (DE) | 1993-08-11 | — | — | EP | disclosed |
| EP-0275991-A2 | Thermoplastic resin composition | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1988-07-27 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260078278-A1 | HIGH TEMPERATURE SURFACING FILM FOR COMPOSITE SUBSTRATES | LRBA, ECPAS, PCBP1 | MAOA 2521/4885MAOB 3625/4885TGM2 3770/4885 |
| US-12534559-B2 | Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device | ARCN1, EIF2B1, MAT2B | MAOA 2697/4885MAOB 2665/4885TGM2 2402/4885 |
| US-12568848-B2 | Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device | TET1, TET3, GPX4 | MAOA 208/4885MAOB 406/4885TGM2 3143/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.