SCHEMBL952171

SCHEMBL952171

O=[N+]([O-])c1cccc([N+](=O)[O-])c1COS(=O)(=O)c1ccccc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.49
RAB9A P51151 4/20 0.43
MEN1 O00255 3/20 0.43
MAPT P10636 4/20 0.41
ALDH1A1 P00352 4/20 0.41
PKM P14618 1/20 0.41
PRMT5 O14744 1/20 0.41
WDR77 Q9BQA1 1/20 0.41
NPC1 O15118 2/20 0.40
RECQL P46063 1/20 0.40
KIF18A Q8NI77 1/20 0.39
TDP1 Q9NUW8 3/20 0.39
POLB P06746 1/20 0.39
S1PR4 O95977 1/20 0.39
S1PR1 P21453 1/20 0.39
MAPK1 P28482 1/20 0.39
GFER P55789 1/20 0.39
PAX8 Q06710 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7602645 0.89 PRMT5 (0.43) KMT2AMEN1ALDH1A1PRMT5WDR77
SCHEMBL59130 0.88 ALDH1A1 (0.47) KMT2ARAB9AMEN1MAPTALDH1A1
SCHEMBL7604077 0.85 SMN1; SMN2 (0.47) KMT2ARAB9AMEN1MAPTPKM
SCHEMBL244116 0.84 ALDH1A1 (0.49) KMT2ARAB9AMEN1ALDH1A1HTT
SCHEMBL3253710 0.84 PTGS2 (0.42) KMT2ARAB9AMEN1MAPTNPC1
SCHEMBL9550122 0.82 ALDH1A1 (0.46) KMT2AMAPTALDH1A1PKMTDP1
SCHEMBL9550116 0.81 ALDH1A1 (0.44) KMT2ARAB9AMEN1MAPTALDH1A1
SCHEMBL9550105 0.81 ALDH1A1 (0.44) KMT2AMAPTALDH1A1PKMTDP1
SCHEMBL5135093 0.81 HSD17B10 (0.49) KMT2AMEN1ALDH1A1PKMTDP1
SCHEMBL5135097 0.80 HTT (0.49) KMT2ARAB9AMEN1MAPTALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US claimed
EP-1612603-A2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2006-01-04 EP claimed
US-20050277055-A1 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2005-12-15 US claimed
WO-2023219047-A1 INSULATIVE ADHESIVE TAPE 東洋インキSCホールディングス株式会社 2023-11-16 WO disclosed
CN-111377818-A (meth) acrylate compound, polymer, resist material, and method for producing (meth) acrylate compound 捷恩智株式会社 2020-07-07 CN disclosed
EP-3190138-B1 HYPERBRANCHED POLYMER, PROCESS FOR PRODUCING SAME, AND COMPOSITION THE SCHOOL CORPORATION KANSAI UNIV (JP) 2019-10-16 EP disclosed
US-10303051-B2 Hyperbranched polymer, process for producing same, and composition THE SCHOOL CORPORATION KANSAI UNIVERSITY (JP) 2019-05-28 US disclosed
CN-109790405-A Form the composition of dielectric film 富士胶片电子材料美国有限公司 2019-05-21 CN disclosed
CN-109388023-A Photosensitive polymer combination, photosensitive resin coating, photosensitive dry film, lamilate and pattern forming method 信越化学工业株式会社 2019-02-26 CN disclosed
US-9862695-B2 Monomer having N-acyl carbamoyl group and lactone skeleton, and polymeric compound DAICEL CORPORATION (JP) 2018-01-09 US disclosed
US-20170283560-A1 HYPERBRANCHED POLYMER, PROCESS FOR PRODUCING SAME, AND COMPOSITION THE SCHOOL CORPORATION KANSAI UNIVERSITY (JP) 2017-10-05 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
US-6391520-B1 ADAMANTANE COMPOUND OR POLYMER AND PHOTOACID GENERATORS; ETCHING RESISTANCE; SOLUBILIZABLE BY IRRADIATION WITH LIGHT; MINUTE PATTERNS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-05-21 US disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
US-6274289-B1 Chemical resist thickness reduction process ADVANCED MICRO DEVICES, INC. 2001-08-14 US disclosed
EP-1055654-A1 PROCESS FOR THE PREPARATION OF ORGANIC COMPOUNDS WITH IMIDE CATALYSTS Daicel Chemical Industries, Ltd. (JP) 2000-11-29 EP disclosed
EP-1000924-A1 ACID-SENSITIVE COMPOUND AND RESIN COMPOSITION FOR PHOTORESIST Daichel Chemical Industries Ltd (JP) 2000-05-17 EP disclosed
EP-0999474-A1 COMPOUNDS FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2000-05-10 EP disclosed