SCHEMBL1050085

SCHEMBL1050085

COCCCCOC(=O)CS

nearest known ligand 0.48

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.48
HSD17B10 Q99714 1/20 0.48
ALDH1A1 P00352 3/20 0.45
NAAA Q02083 1/20 0.43
RAD52 P43351 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
FAAH O00519 1/20 0.36
HTR2C P28335 1/20 0.35
DGKA P23743 1/20 0.34
CA2 P00918 1/20 0.33
HTT P42858 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
RECQL P46063 1/20 0.32
EPHX1 P07099 1/20 0.32
ADRA2A P08913 1/20 0.32
ADRA1A P35348 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9420608 0.98 ALDH1A1 (0.48) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL9420634 0.98 ALDH1A1 (0.48) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL9420849 0.98 ALDH1A1 (0.48) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL5175741 0.95 TSHR (0.48) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL7937882 0.89 TSHR (0.39) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL60931 0.88 NAAA (0.46) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL24860480 0.86 ALDH1A1 (0.42) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL2586859 0.86
SCHEMBL11585668 0.85 NAAA (0.50) TSHRHSD17B10ALDH1A1NAAARAD52
SCHEMBL97045 0.85 NAAA (0.50) TSHRHSD17B10ALDH1A1NAAARAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 238 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111108441-B Composition for forming resist underlayer film 日产化学株式会社 2023-11-07 CN claimed
US-11635692-B2 Resist underlying film forming composition NISSAN CHEMICAL CORPORATION (JP) 2023-04-25 US claimed
US-6242149-B1 LIGHT SENSITIVE ELEMENTS CURED WITH RADIATION, RADICAL POLYMERIZATION, PHOTOPOLYMERIZATION, ENCAPSULATION BROTHER KOGYO KABUSHIKI KAISHA (JP) 2001-06-05 US claimed
US-4520166-A BLEND WITH METHYL METHACRYLATE POLYMER MITSUBISHI RAYON COMPANY, LTD. (JP) 1985-05-28 US claimed
EP-3985076-B1 ADHESIVE AGENT AND ADHESION METHOD RESONAC CORP (JP) 2026-04-29 EP disclosed
US-20260092133-A1 RESIN COMPOSITION FOR DAMPING MATERIAL NIPPON CATALYTIC CHEM IND (JP) 2026-04-02 US disclosed
US-12545781-B2 Resin composition for molding, and molded body artiece Co., Ltd. (JP) 2026-02-10 US disclosed
US-20260028459-A1 SURFACTANT COMPOSITION, COMPOSITION FOR EMULSION POLYMERIZATION, METHOD OF PRODUCING POLYMER EMULSION, AND POLYMER EMULSION ADEKA CORPORATION (JP) 2026-01-29 US disclosed
EP-4685199-A1 SURFACTANT COMPOSITION, COMPOSITION FOR EMULSION POLYMERIZATION, METHOD OF PRODUCING POLYMER EMULSION, AND POLYMER EMULSION ADEKA CORPORATION (JP) 2026-01-28 EP disclosed
US-12486392-B2 Chlorinated vinyl chloride resin SEKISUI CHEMICAL CO., LTD. (JP) 2025-12-02 US disclosed
US-12428542-B2 Chlorinated vinyl chloride resin composition and chlorinated vinyl chloride resin molded body SEKISUI CHEMICAL CO., LTD. (JP) 2025-09-30 US disclosed
EP-4588970-A1 RESIN COMPOSITION FOR DAMPING MATERIAL Nippon Shokubai Co., Ltd. (JP) 2025-07-23 EP disclosed
US-5795709-A Particulate photographic polymer FUJI PHOTO FILM CO., LTD. (JP) 1998-08-18 US disclosed
US-5756260-A POLYAMIC ACID ESTER, PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE SUMITOMO BAKELITE COMPANY LIMITED (JP) 1998-05-26 US disclosed
EP-0637776-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING RELIEF PATTERN THEREFROM SUMITOMO BAKELITE CO (JP) 1997-11-26 EP disclosed
EP-0637776-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING RELIEF PATTERN THEREFROM SUMITOMO BAKELITE COMPANY LIMITED (JP) 1995-02-08 EP disclosed
US-5354800-A Emulsion polymerization of addition monomers with hydrophilic and hydrophobic chain transfer agent TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 1994-10-11 US disclosed
EP-0565891-A1 Copolymer latex, production and use thereof TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 1993-10-20 EP disclosed
US-4803026-A CAST POLYMERIZATION OF METHYL METHACRYLATE SYRUP BLEND CONTAINING AN INHIBITOR, CROSSLINKING AGENT AND CHAIN TRANSFER AGENT MITSUBISHI RAYON COMPANY, LTD. (JP) 1989-02-07 US disclosed
US-4520166-A BLEND WITH METHYL METHACRYLATE POLYMER MITSUBISHI RAYON COMPANY, LTD. (JP) 1985-05-28 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260092133-A1 RESIN COMPOSITION FOR DAMPING MATERIAL EXOSC9, EXOSC5, EXOSC4 TSHR 4159/4885HSD17B10 3720/4885ALDH1A1 798/4885
US-12545781-B2 Resin composition for molding, and molded body SULT1A1, TST, TRMT1 TSHR 2163/4885HSD17B10 696/4885ALDH1A1 331/4885
US-20260028459-A1 SURFACTANT COMPOSITION, COMPOSITION FOR EMULSION POLYMERIZATION, METHOD OF PRODUCING POLYMER EMULSION, AND POLYMER EMULSION SGMS1, PHOSPHO1, SGMS2 TSHR 3376/4885HSD17B10 3423/4885ALDH1A1 3541/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.