SCHEMBL1060902

SCHEMBL1060902

F[B-](F)(F)F.F[B-](F)(F)F.F[B-](F)(F)F.F[B-](F)(F)F.F[B-](F)(F)F.F[B-](F)(F)F.c1ccc([S+](c2ccccc2)c2ccccc2)cc1

nearest known ligand 0.39

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
ACHE P22303 1/20 0.32
CFTR P13569 1/20 0.31
GOPC Q9HD26 1/20 0.31
KIF11 P52732 1/20 0.31
TSHR P16473 2/20 0.30
ALOX15 P16050 1/20 0.30
NPC1 O15118 1/20 0.30
MAPK1 P28482 1/20 0.30
RAB9A P51151 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5906917 1.00 ALDH1A1 (0.39) ALDH1A1ACHECFTRGOPCKIF11
SCHEMBL342497 1.00 ALDH1A1 (0.39) ALDH1A1ACHECFTRGOPCKIF11
SCHEMBL4048970 0.97 ALDH1A1 (0.37) ALDH1A1ACHE
SCHEMBL3140033 0.87 NFE2L2 (0.39) ALDH1A1ACHETSHRALOX15NPC1
SCHEMBL3130517 0.87 NFE2L2 (0.39) ALDH1A1ACHETSHRALOX15NPC1
SCHEMBL6243220 0.87 ACHE (0.31) ALDH1A1ACHE
SCHEMBL47554 0.87 ALDH1A1 (0.40) ALDH1A1ACHETSHRALOX15MAPK1
SCHEMBL10801908 0.87 ALDH1A1 (0.40) ALDH1A1ACHETSHRALOX15MAPK1
SCHEMBL3144680 0.85 ACHE (0.43) ALDH1A1ACHETSHRNPC1RAB9A
SCHEMBL3132622 0.85 ACHE (0.43) ALDH1A1ACHETSHRNPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 173 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122080822-A Pressure-sensitive epoxy adhesive composition and preparation method and application thereof 2026-05-26 CN disclosed
US-20260117094-A1 CURABLE ELECTRICAL INSULATION TAPE TESA SE (DE) 2026-04-30 US disclosed
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD CANON KABUSHIKI KAISHA (JP) 2026-03-19 US disclosed
EP-4702071-A1 CATIONICALLY CURABLE ADHESIVE COMPOUND, IN PARTICULAR FOR ADHESIVELY BONDING METAL SUBSTRATES TESA SE (DE) 2026-03-04 EP disclosed
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD CANON KK (JP) 2026-02-12 US disclosed
US-20250282915-A1 METHOD FOR FORMING CURED FILM, METHOD FOR MANUFACTURING IMPRINT MOLD SUBSTRATE, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING RELIEF STRUCTURE, METHOD FOR FORMING PATTERN, METHOD FOR FORMING HARD MASK, METHOD FOR FORMING INSULATING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE DAI NIPPON PRINTING CO., LTD. (JP) 2025-09-11 US disclosed
US-12410345-B2 Polyvinyl aromate-polydiene-block copolymer-based adhesive compounds having improved thermal shear strength TESA SE (DE) 2025-09-09 US disclosed
EP-4594437-A1 CATIONICALLY CURABLE ADHESIVE WITH HOLDING-STRENGTH INDICATION TESA SE (DE) 2025-08-06 EP disclosed
EP-4578921-A1 CURABLE ELECTRICAL INSULATION TAPE TESA SE (DE) 2025-07-02 EP disclosed
EP-4555033-A1 UNCROSSLINKED POLYEPOXIDE AND ADHESIVE COMPOUND COMPRISING SAID POLYEPOXIDE TESA SE (DE) 2025-05-21 EP disclosed
EP-1923431-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-05-21 EP disclosed
US-20080076900-A1 Epoxy Resin Composition for Optical Semiconductor Encapsulation NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-03-27 US disclosed
US-20080035000-A1 Matte Agent for Infrared-Sensitive Planographic Printing Plate and Use Thereof EASTMAN KODAK COMPANY 2008-02-14 US disclosed
US-20070208098-A1 Composition Curable By Radical Photo Curing And Cationic Photo Curing In Combination KANEKA CORPORATION (JP) 2007-09-06 US disclosed
EP-1806620-A1 MATTE AGENT FOR INFRARED-SENSITIVE PLANOGRAPHIC PRINTING PLATE AND USE THEREOF Kodak Polychrome Graphics Japan Ltd. (JP) 2007-07-11 EP disclosed
EP-1795550-A1 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ENCAPSULATION Nippon Kayaku Kabushiki Kaisha (JP) 2007-06-13 EP disclosed
EP-1728826-A1 COMPOSITION CURABLE BY BOTH FREE-RADICAL PHOTOCURING AND CATIONIC PHOTOCURING KANEKA CORPORATION (JP) 2006-12-06 EP disclosed
US-20060228562-A1 Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating SUMITOMO BAKELITE COMPANY LIMITED (JP) 2006-10-12 US disclosed
US-4775445-A FORMING PHOTOSENSITIVE LAYER ON SUBSTRATE, IRRADIATION, REMOVAL, FILLING TO FORM LIQUID FLOW PATH WALL CANON KABUSHIKI KAISHA (JP) 1988-10-04 US disclosed
US-4657631-A SOLID LAYER PHOTORESIST OF A POSITIVE TYPE CANON KABUSHIKI KAISHA (JP) 1987-04-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD EEF1D, RHOA, YWHAH ALDH1A1 4238/4885ACHE 3107/4885CFTR 4766/4885
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD SMCHD1, PIM1, PIM2 ALDH1A1 4758/4885ACHE 2783/4885CFTR 4382/4885
US-20260117094-A1 CURABLE ELECTRICAL INSULATION TAPE EPCAM, ILK, ITGB3 ALDH1A1 295/4885ACHE 1476/4885CFTR 4126/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.