SCHEMBL1089508

SCHEMBL1089508

CC(C)(C)OC(=O)C(=[N+]=[N-])S(=O)(=O)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 3/20 0.41
CA12 O43570 2/20 0.37
CA1 P00915 2/20 0.37
CA14 Q9ULX7 2/20 0.37
CA7 P43166 1/20 0.37
ALDH1A1 P00352 5/20 0.36
TP53 P04637 2/20 0.36
HTT P42858 2/20 0.36
HSD17B10 Q99714 1/20 0.36
SMN1; SMN2 Q16637 3/20 0.36
LMNA P02545 3/20 0.36
MAPT P10636 2/20 0.36
NPC1 O15118 2/20 0.35
RAB9A P51151 2/20 0.35
RECQL P46063 1/20 0.35
S1PR2 O95136 1/20 0.35
PRNP P04156 1/20 0.35
XBP1 P17861 1/20 0.35
MAPK1 P28482 1/20 0.35
KMT2A Q03164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL383775 0.87 ALDH1A1 (0.41) CA12CA1CA14CA7ALDH1A1
SCHEMBL13118694 0.83 ALDH1A1 (0.45) HSD11B1ALDH1A1TP53HTTHSD17B10
SCHEMBL27587801 0.82 PSIP1 (0.43) CA12CA1CA14CA7SMN1; SMN2
SCHEMBL563505 0.80 HSD11B1 (0.47) HSD11B1ALDH1A1TP53HTTHSD17B10
SCHEMBL21595092 0.79 ALDH1A1 (0.52) HSD11B1CA12ALDH1A1TP53HTT
SCHEMBL3975777 0.77 SMN1; SMN2 (0.42) HSD11B1CA12CA1CA14CA7
SCHEMBL28953545 0.75 HSD11B1 (0.39) HSD11B1CA12CA1CA14CA7
SCHEMBL6884840 0.74 CA1 (0.43) HSD11B1CA12CA1CA14CA7
SCHEMBL9015170 0.72 ALDH1A1 (0.55) HSD11B1CA1ALDH1A1HTTLMNA
SCHEMBL546386 0.72 CES2 (0.45) HSD11B1CA1ALDH1A1TP53HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 196 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2326744-B1 METAL COMPOSITIONS AND METHODS OF MAKING SAME PRYOG LLC (US) 2022-06-01 EP claimed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
US-20250216790-A1 MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE GEMINATIO, INC., 2025-07-03 US disclosed
US-20250216782-A1 MASKING PROCESS USING SWITCHABLE POLYMER TOKYO ELECTRON LTD (JP) 2025-07-03 US disclosed
US-20250216783-A1 ANTI-SPACER MASKING PROCESS USING SECOND SWITCHABLE POLYMER TOKYO ELECTRON LTD (JP) 2025-07-03 US disclosed
US-20250218775-A1 MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE GEMINATIO, INC. 2025-07-03 US disclosed
US-20250216763-A1 ANTI-SPACER MASKING PROCESS USING RESIST LAYER WITH SOLUBILITY SHIFTING AGENT TOKYO ELECTRON LTD (JP) 2025-07-03 US disclosed
WO-2025128334-A1 POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-06-19 WO disclosed
WO-2025128332-A1 POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-06-19 WO disclosed
US-5770343-A Positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-06-23 US disclosed
US-5736296-A Positive resist composition comprising a mixture of two polyhydroxystyrenes having different acid cleavable groups and an acid generating compound TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-07 US disclosed
EP-0827970-A2 New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials Clariant AG (CH) 1998-03-11 EP disclosed
US-5670299-A COATING A PHOTORESISTS POLYMER ON A SUBSTRATE, DEVELOPMENT AND HEAT TREATMENT WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1997-09-23 US disclosed
EP-0679951-B1 Positive resist composition TOKYO OHKA KOGYO CO LTD (JP) 1997-01-15 EP disclosed
EP-0749044-A2 Positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1996-12-18 EP disclosed
EP-0749046-A1 Positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1996-12-18 EP disclosed
US-5468589-A Heat resistant, photosensitive patterns WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 1995-11-21 US disclosed
EP-0679951-A1 Positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1995-11-02 EP disclosed
EP-0520642-A1 Resist material and pattern formation process WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1992-12-30 EP disclosed