SCHEMBL1108684

SCHEMBL1108684

COc1ccc(Cc2ccc(Oc3ccc(Cc4ccc(OC)cc4)cc3C(=O)O)cc2)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.58
POLB P06746 1/20 0.58
CFD P00746 1/20 0.57
LTA4H P09960 1/20 0.49
USP2 O75604 1/20 0.48
TP53 P04637 1/20 0.48
SAE1 Q9UBE0 1/20 0.48
UBA2 Q9UBT2 1/20 0.48
KLKB1 P03952 1/20 0.46
CTSB P07858 1/20 0.46
MMP9 P14780 1/20 0.46
DNMT1 P26358 1/20 0.46
DNMT3B Q9UBC3 1/20 0.46
DNMT3L Q9UJW3 1/20 0.46
DNMT3A Q9Y6K1 1/20 0.46
KDM5A P29375 1/20 0.46
KDM5B Q9UGL1 1/20 0.46
SRD5A2 P31213 1/20 0.45
HNF4A P41235 1/20 0.45
ALDH1A1 P00352 3/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13539011 0.91 CFD (0.60) KDM4EPOLBCFDLTA4HUSP2
SCHEMBL27535651 0.87 CFD (0.56) KDM4EPOLBCFDLTA4HUSP2
SCHEMBL95195 0.87 KDM4E (0.54) KDM4EPOLBLTA4HSAE1UBA2
SCHEMBL10690364 0.85 HNF4A (0.59) KDM4EPOLBCFDKLKB1CTSB
SCHEMBL7549968 0.84 CFD (0.55) KDM4EPOLBCFDKLKB1CTSB
SCHEMBL6866159 0.82 CFD (0.70) KDM4ECFDKLKB1CTSBMMP9
SCHEMBL10024697 0.82 ALDH1A1 (0.55) KDM4EPOLBCFDLTA4HSAE1
SCHEMBL27896920 0.80 LTA4H (0.53) KDM4EPOLBCFDLTA4HUSP2
SCHEMBL14408666 0.78 CFD (0.59) KDM4ECFDKLKB1CTSBMMP9
SCHEMBL95380 0.78 HPGD (0.56) KDM4EPOLBSAE1UBA2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8153239-B2 Polycarbonate resin composition and heat ray shielding molded product MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2012-04-10 US disclosed
US-20090136730-A1 Polycarbonate Resin Composition and Heat Ray Shielding Molded Product MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-05-28 US disclosed