SCHEMBL12680249

SCHEMBL12680249

Cn1c(-c2ccccc2)nc(-c2ccccc2)c1-n1c(-c2ccccc2)nc(-c2ccccc2)c1-c1ccccc1Cl

nearest known ligand 0.51

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 9/20 0.51
EGFR P00533 1/20 0.40
MAPT P10636 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
KMT2A Q03164 1/20 0.39
PTGS1 P23219 1/20 0.39
PTGS2 P35354 1/20 0.39
CYP2A6 P11509 1/20 0.39
CRHR1 P34998 1/20 0.36
FABP4 P15090 2/20 0.36
FABP5 Q01469 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL274962 0.87 HSD11B1 (0.58) HSD11B1MAPTSMN1; SMN2KMT2APTGS1
SCHEMBL822678 0.72 PTGER1 (0.56) FABP4FABP5
SCHEMBL8823116 0.72 HSD11B1 (0.54) HSD11B1KMT2ACYP2A6
SCHEMBL29732755 0.72 HSD11B1 (0.49) HSD11B1SMN1; SMN2PTGS1PTGS2CYP2A6
SCHEMBL63728 0.72 HSD11B1 (0.49) HSD11B1SMN1; SMN2PTGS1PTGS2CYP2A6
SCHEMBL8823133 0.71 HSD11B1 (0.52) HSD11B1KMT2APTGS1PTGS2CYP2A6
SCHEMBL11635736 0.71 HSD11B1 (0.47) HSD11B1SMN1; SMN2PTGS1PTGS2CYP2A6
SCHEMBL22507458 0.70 BCHE (0.47) HSD11B1SMN1; SMN2KMT2ACYP2A6
SCHEMBL28949240 0.70 LMNA (0.56) HSD11B1SMN1; SMN2KMT2APTGS1PTGS2
SCHEMBL11640258 0.70 HSD11B1 (0.46) HSD11B1MAPTSMN1; SMN2PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8822126-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate FUJIFILM CORPORATION (JP) 2014-09-02 US disclosed
US-8273520-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method of producing the same FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed