SCHEMBL134437

SCHEMBL134437

CCCC(=O)OCCC(C)(C)OC

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.42
ALDH1A1 P00352 4/20 0.41
ADRA2A P08913 1/20 0.36
ADRA1A P35348 1/20 0.36
DNM1 Q05193 1/20 0.36
MAPT P10636 1/20 0.35
BLM P54132 1/20 0.35
HTR2C P28335 1/20 0.35
TSHR P16473 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
NAAA Q02083 1/20 0.34
LMNA P02545 2/20 0.34
HSD17B10 Q99714 1/20 0.32
FFAR3 O14843 1/20 0.32
HDAC3 O15379 1/20 0.32
HDAC1 Q13547 1/20 0.32
HDAC2 Q92769 1/20 0.32
HDAC8 Q9BY41 1/20 0.32
MGLL Q99685 1/20 0.32
PRSS1 P07477 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28496017 0.89 DGKA (0.53) DGKAALDH1A1DNM1MAPTHTR2C
SCHEMBL28616620 0.86 DGKA (0.48) DGKAALDH1A1ADRA2AADRA1ADNM1
SCHEMBL29258497 0.86 DGKA (0.65) DGKAALDH1A1DNM1MAPTHTR2C
SCHEMBL136377 0.84 NAAA (0.45) DGKAALDH1A1ADRA2AADRA1ADNM1
SCHEMBL28138197 0.83 ADRA2A (0.39) DGKAALDH1A1ADRA2AADRA1AMAPT
SCHEMBL8340130 0.82 DGKA (0.47) DGKAALDH1A1ADRA2AADRA1ADNM1
SCHEMBL31618873 0.80 DGKA (0.52) DGKAALDH1A1DNM1MAPTHTR2C
SCHEMBL1645011 0.80 TDP1 (0.32) DGKAALDH1A1TSHRTDP1NAAA
SCHEMBL19333212 0.80 ADRA2A (0.34) ALDH1A1ADRA2AADRA1AMAPTBLM
SCHEMBL15161835 0.79 NAAA (0.35) DGKAALDH1A1ADRA2AADRA1ADNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 717 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8475998-B2 Compound synthesis method, microarray, acid-transfer composition, and biochip composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-07-02 US claimed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed
EP-0260994-B1 PROCESS FOR PRODUCING INTEGRATED CIRCUIT JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-07-15 EP claimed
EP-0260994-A2 Process for producing integrated circuit JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1988-03-23 EP claimed
WO-2026105630-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
WO-2026105628-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 日産化学株式会社 2026-05-21 WO disclosed
US-20260118765-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2026-04-30 US disclosed
US-20260118764-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2026-04-30 US disclosed
EP-4715465-A1 MULTILAYER BODY, METHOD FOR PRODUCING MULTILAYER BODY, AND PHOTOSENSITIVE SURFACE MODIFIER Nissan Chemical Corporation (JP) 2026-03-25 EP disclosed
US-12585188-B2 Composition for forming resist underlying film NISSAN CHEMICAL CORPORATION (JP) 2026-03-24 US disclosed
CN-121586750-A Composition for forming silicon-containing underlayer film for directional self-assembly 日产化学株式会社 2026-02-27 CN disclosed
EP-4692943-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION Nissan Chemical Corporation (JP) 2026-02-11 EP disclosed
EP-0554101-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-08-04 EP disclosed
EP-0523957-A1 Radiation-sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1993-01-20 EP disclosed
EP-0517923-A1 METHOD OF FORMING MINUTE RESIST PATTERN JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-12-16 EP disclosed
EP-0260994-B1 PROCESS FOR PRODUCING INTEGRATED CIRCUIT JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-07-15 EP disclosed
US-5110706-A Photoresists for highly reflective substrates JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-05-05 US disclosed
EP-0428398-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-05-22 EP disclosed
EP-0365318-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-04-25 EP disclosed
EP-0260994-A2 Process for producing integrated circuit JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1988-03-23 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260118765-A1 RESIST UNDERLAYER FILM FORMING COMPOSITION ASH2L, ASIC1, RPA1 DGKA 818/4885ALDH1A1 1704/4885ADRA2A 286/4885
US-20260118764-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND SILICON-CONTAINING RESIST UNDERLAYER FILM SRSF1, MACF1, SRPK1 DGKA 1511/4885ALDH1A1 3642/4885ADRA2A 4262/4885
US-12585188-B2 Composition for forming resist underlying film SRR, SMC1A, ASH2L DGKA 2205/4885ALDH1A1 1320/4885ADRA2A 1545/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.