SCHEMBL14913063

SCHEMBL14913063

C=CCOc1ccc(N(CC=C)CC=C)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CA12 O43570 5/20 0.47
▸ CA1 P00915 5/20 0.47
▸ CA9 Q16790 5/20 0.47
▸ CA2 P00918 1/20 0.47
▸ CA7 P43166 1/20 0.47
▸ MAPT P10636 5/20 0.41
▸ SMN1; SMN2 Q16637 3/20 0.41
▸ NPC1 O15118 2/20 0.41
▸ RAB9A P51151 2/20 0.41
▸ POLB P06746 2/20 0.41
▸ TP53 P04637 1/20 0.41
▸ MEN1 O00255 1/20 0.40
▸ LMNA P02545 1/20 0.40
▸ KMT2A Q03164 1/20 0.40
▸ CYP2D6 P10635 1/20 0.40
▸ CHKA P35790 1/20 0.39
▸ ADRA2A P08913 1/20 0.39
▸ ADRA2B P18089 1/20 0.39
▸ ADRA2C P18825 1/20 0.39
▸ ALDH1A1 P00352 3/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
1,4-Diallyloxybenzene SCHEMBL302448 0.81 CA12 (0.63) CA12CA1CA9CA2CA7
SCHEMBL851567 0.81 CHKA (0.50) SMN1; SMN2CHKAALDH1A1MAPK1GAA
SCHEMBL15665706 0.80 CA12 (0.44) CA12CA1CA9CA2CA7
SCHEMBL5489672 0.78 TSHR (0.53) CA12CA1CA9CA2CA7
SCHEMBL16640993 0.75 CA12 (0.40) CA12CA1CA9CA2CA7
SCHEMBL8045814 0.75 TDP1 (0.51) MAPTSMN1; SMN2NPC1RAB9ATP53
SCHEMBL472165 0.74 CA12 (0.57) CA12CA1CA9CA2CA7
SCHEMBL3487338 0.74 CA12 (0.57) CA12CA1CA9CA2CA7
SCHEMBL9065504 0.74 CA12 (0.57) CA12CA1CA9CA2CA7
SCHEMBL7162904 0.74 CHKA (0.46) MAPTSMN1; SMN2CYP2D6CHKAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10428176-B2 Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition and cured product comprising same, use thereof, and method for preparing alkoxysilyl compound KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2019-10-01 — — US disclosed
US-20180155370-A1 THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-06-07 — — US disclosed
US-20180155370-A1 THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-06-07 — — US disclosed
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 — — US disclosed
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 — — US disclosed
US-9499505-B2 Process for the epoxidation of olefins CHANG CHUN PLASTICS CO., LTD. (TW) 2016-11-22 — — US disclosed
US-9499505-B2 Process for the epoxidation of olefins CHANG CHUN PLASTICS CO., LTD. (TW) 2016-11-22 — — US disclosed
US-20160177023-A1 CONTINUOUS PROCESS OF OLEFINIC EPOXIDATION BY SUPPORTED HETEROPOLY ACID CHANG CHUN PLASTICS CO., LTD. (TW) 2016-06-23 — — US disclosed
US-20160177023-A1 CONTINUOUS PROCESS OF OLEFINIC EPOXIDATION BY SUPPORTED HETEROPOLY ACID CHANG CHUN PLASTICS CO., LTD. (TW) 2016-06-23 — — US disclosed
US-20160083360-A1 PROCESS FOR THE EPOXIDATION OF OLEFINS CHANG CHUN PLASTICS CO., LTD. (TW) 2016-03-24 — — US disclosed
US-20160083360-A1 PROCESS FOR THE EPOXIDATION OF OLEFINS CHANG CHUN PLASTICS CO., LTD. (TW) 2016-03-24 — — US disclosed
US-20150105493-A1 EPOXY COMPOUND HAVING ALKOXY SILYL GROUP, COMPOSITION COMPRISING SAME, CURED PRODUCT, USE THEREOF AND METHOD FOR PREPARING EPOXY COMPOUND HAVING ALKOXY SILYL GROUP KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2015-04-16 — — US disclosed
US-20150105493-A1 EPOXY COMPOUND HAVING ALKOXY SILYL GROUP, COMPOSITION COMPRISING SAME, CURED PRODUCT, USE THEREOF AND METHOD FOR PREPARING EPOXY COMPOUND HAVING ALKOXY SILYL GROUP KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2015-04-16 — — US disclosed
US-8759553-B2 Method for producing epoxy compound SHOWA DENKO K.K. (JP) 2014-06-24 — — US disclosed
US-20130116455-A1 METHOD FOR PRODUCING EPOXY COMPOUND SHOWA DENKO K.K. (JP) 2013-05-09 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10428176-B2 Thermosetting alkoxysilyl compound having two or more alkoxysilyl groups, composition and cured product comprising same, use thereof, and method for preparing alkoxysilyl compound PIEZO1, FTO, ESD CA12 3027/4885CA1 1812/4885CA9 839/4885
US-20180155370-A1 THERMOSETTING ALKOXYSILYL COMPOUND HAVING TWO OR MORE ALKOXYSILYL GROUPS, COMPOSITION AND CURED PRODUCT COMPRISING SAME, USE THEREOF, AND METHOD FOR PREPARING ALKOXYSILYL COMPOUND PIEZO1, FTO, ESD CA12 3027/4885CA1 1812/4885CA9 839/4885
US-20160083360-A1 PROCESS FOR THE EPOXIDATION OF OLEFINS HSF1, HMOX1, HSPH1 CA12 4035/4885CA1 3432/4885CA9 4134/4885
US-20130116455-A1 METHOD FOR PRODUCING EPOXY COMPOUND DUOX2, EPHX2, AOX1 CA12 239/4885CA1 112/4885CA9 370/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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