SCHEMBL15965113

SCHEMBL15965113

C[N+](C)(C)c1ccc([SiH3])cc1

nearest known ligand 0.48

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
APOBEC3A P31941 1/20 0.48
APOBEC3G Q9HC16 1/20 0.48
ACHE P22303 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2489383 0.83 APOBEC3A (0.62) APOBEC3AAPOBEC3GACHE
Iodide SCHEMBL6373433 0.79 APOBEC3A (0.69) APOBEC3AAPOBEC3GACHE
Hydrochloric Acid SCHEMBL6368015 0.79 APOBEC3A (0.59) APOBEC3AAPOBEC3GACHE
SCHEMBL13567373 0.73 APOBEC3A (0.53) APOBEC3AAPOBEC3GACHE
SCHEMBL841700 0.71 ACHE (0.53) APOBEC3AAPOBEC3GACHE
SCHEMBL8050267 0.71 TSHR (0.46) APOBEC3AAPOBEC3GACHE
SCHEMBL7162015 0.69 APOBEC3A (0.48) APOBEC3AAPOBEC3GACHE
Hydrochloric Acid SCHEMBL1508422 0.69 ACHE (0.50) APOBEC3AAPOBEC3GACHE
SCHEMBL16673349 0.69 APOBEC3A (0.48) APOBEC3AAPOBEC3GACHE
SCHEMBL5853872 0.69 LMNA (0.50) APOBEC3AAPOBEC3GACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-27 US disclosed
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-19 US disclosed
US-20230305405-A1 COMPOSITION FOR FORMING SILICON-CONTAINING METAL HARD MASK AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-28 US disclosed
US-20230244149-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-03 US disclosed
US-9315670-B2 Composition for forming resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-19 US disclosed
US-20140235796-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-08-21 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS RPS4X, SIK3, MLX APOBEC3A 3970/4885APOBEC3G 3055/4885ACHE 4187/4885
US-11914295-B2 Thermosetting iodine- and silicon-containing material, composition containing the material for forming resist underlayer film for EUV lithography, and patterning process RPS4X, SIK3, MLX APOBEC3A 3970/4885APOBEC3G 3055/4885ACHE 4187/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.