SCHEMBL1597063

SCHEMBL1597063

Oc1c(F)cc(C(c2cc(F)c(O)c(F)c2)C(c2cc(F)c(O)c(F)c2)c2cc(F)c(O)c(F)c2)cc1F

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.48
CYP2C9 P11712 1/20 0.48
ALOX15 P16050 1/20 0.48
ALOX12 P18054 1/20 0.48
CYP2C19 P33261 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
HIF1A Q16665 1/20 0.48
HSD17B10 Q99714 1/20 0.48
ADRB2 P07550 1/20 0.39
ADRB1 P08588 1/20 0.39
ADRB3 P13945 1/20 0.39
ERN1 O75460 1/20 0.39
CES2 O00748 1/20 0.37
CES1 P23141 1/20 0.37
ESR1 P03372 1/20 0.35
ESR2 Q92731 1/20 0.35
VRK1 Q99986 2/20 0.33
RPS6KA3 P51812 1/20 0.32
SHBG P04278 1/20 0.32
MEP1B Q16820 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9788951 0.86 ESR1 (0.41) CYP1A2CYP2C9ALOX15ALOX12CYP2C19
SCHEMBL1594695 0.83 CYP1A2 (0.39) CYP1A2CYP2C9ALOX15ALOX12CYP2C19
SCHEMBL4471799 0.82 ADRB2 (0.39) ADRB2ADRB1ADRB3ERN1CES2
SCHEMBL3279640 0.80 ADRB2 (0.38) ADRB2ADRB1ADRB3ERN1CES2
SCHEMBL99223 0.78 GABRA1 (0.54) CYP1A2ALOX12HIF1AADRB2ADRB1
SCHEMBL7916578 0.78 ADRB2 (0.46) CYP2C9CYP2C19ADRB2ADRB1ADRB3
SCHEMBL1596154 0.76 SHBG (0.37) CYP2C9CYP2C19ADRB2ADRB1ADRB3
SCHEMBL8147974 0.76 ADRB2 (0.40) CYP2C9CYP2C19ADRB2ADRB1ADRB3
SCHEMBL8145693 0.76 ADRB2 (0.40) ADRB2ADRB1ADRB3ERN1ESR1
SCHEMBL516135 0.71 ERN1 (0.39) ERN1CES2CES1ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187843-B2 Liquid compression molding or encapsulant compositions HENKEL AG & CO. KGAA (DE) 2025-01-07 US disclosed
US-20240301129-A1 LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY HENKEL AG & CO KGAA (DE) 2024-09-12 US disclosed
WO-2023091578-A1 LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY HENKEL AG & CO. KGAA (DE) 2023-05-25 WO disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210163674-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-03 US disclosed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US disclosed
EP-3298061-B1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) 2020-09-09 EP disclosed
US-20180142058-A1 A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering HUNTSMAN INTERNATIONAL LLC (US) 2018-05-24 US disclosed
CN-107636039-A Curing agent and the method for preparing insulation system for electronic engineering for thermosetting epoxy resin 亨斯迈先进材料许可(瑞士)有限公司 2018-01-26 CN disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-0949286-B1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO (JP) 2005-03-02 EP disclosed
US-20040106764-A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition SUZUKI HIROSHI (JP) 2004-06-03 US disclosed
US-6727325-B1 HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY NIPPON SODA CO. LTD. (JP) 2004-04-27 US disclosed
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound NIPPON SODA CO., LTD. (JP) 2002-12-19 US disclosed
EP-1241230-A1 MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND NIPPON SODA CO., LTD. (JP) 2002-09-18 EP disclosed
US-6147169-A LOW TEMPERATURE CURING MIXTURE OF REACTIVE BASE RESIN AND A CLATHRATE COMPRISING A TETRAKISPHENOL HOSTING A CURING AGENT OR CURING CATALYST; STORAGE STABILITY, CORROSION RESISTANCE, ADHESION KANSAI PAINT CO., LTD. (JP) 2000-11-14 US disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed
EP-0589044-B1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO (JP) 1996-10-23 EP disclosed
US-5364977-A Chemical stabilization and powder processing NIPPON SODA CO., LTD. (JP) 1994-11-15 US disclosed
EP-0589044-A1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO., LTD. (JP) 1994-03-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound PIEZO1, PARN, PARG CYP1A2 3704/4885CYP2C9 4374/4885ALOX15 2840/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.