SCHEMBL1685454

SCHEMBL1685454

CCNN(C1CCCCC1)C1CCCCC1

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ADH1A P07327 6/20 0.40
ADH1C P00326 4/20 0.40
ALDH1A1 P00352 1/20 0.32
EPHX1 P07099 1/20 0.32
SHBG P04278 1/20 0.32
HRH4 Q9H3N8 1/20 0.31
HRH3 Q9Y5N1 1/20 0.31
ADH1B P00325 1/20 0.31
FAAH O00519 1/20 0.31
PHGDH O43175 1/20 0.31
MGLL Q99685 1/20 0.31
CYP1A2 P05177 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1685459 0.83 ADH1A (0.41) ADH1AADH1CALDH1A1EPHX1SHBG
SCHEMBL27407804 0.78 ADH1A (0.39) ADH1AADH1CALDH1A1EPHX1SHBG
SCHEMBL10863722 0.76 ADH1A (0.42) ADH1AADH1CALDH1A1EPHX1SHBG
SCHEMBL27391484 0.75 ADH1A (0.35) ADH1AADH1CHRH4HRH3FAAH
SCHEMBL9622547 0.75 CTSK (0.35) ADH1AADH1CALDH1A1
SCHEMBL20774200 0.74 NAAA (0.46) EPHX1CYP1A2
SCHEMBL11796297 0.73 ADH1A (0.39) ADH1AADH1C
SCHEMBL28334919 0.71 ALDH1A1 (0.32) ALDH1A1EPHX1PHGDH
SCHEMBL14219531 0.70 ADH1A (0.39) ADH1AADH1CALDH1A1HRH4HRH3
SCHEMBL27407803 0.70 ADH1A (0.39) ADH1AADH1CEPHX1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4306566-B1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND ADHESIVE ADEKA CORP (JP) 2026-05-06 EP disclosed
US-12590178-B2 Curable resin composition and method for suppressing curing shrinkage of curable resin composition ADEKA CORPORATION (JP) 2026-03-31 US disclosed
EP-4306567-B1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE ADEKA CORP (JP) 2025-06-04 EP disclosed
US-12269917-B2 Curable resin composition ADEKA CORPORATION (JP) 2025-04-08 US disclosed
US-20250109324-A1 CURING AGENT FOR EPOXY RESIN, AND ADHESIVE SUNSTAR ENGINEERING INC. (JP) 2025-04-03 US disclosed
US-20250109240-A1 ONE-PACK TYPE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2025-04-03 US disclosed
WO-2025062839-A1 COMPOUND, EPOXY RESIN, CURABLE COMPOSITION, MATERIAL FOR RECYCLING, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING DECOMPOSITION PRODUCT, AND DECOMPOSITION METHOD 株式会社ADEKA 2025-03-27 WO disclosed
WO-2025047655-A1 BLOCK URETHANE MATERIAL, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND BLOCK URETHANE COMPOUND CONTAINED THEREIN 株式会社ADEKA 2025-03-06 WO disclosed
EP-4491653-A1 ONE-PACK TYPE EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2025-01-15 EP disclosed
US-20250002707-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE ADEKA CORPORATION (JP) 2025-01-02 US disclosed
EP-3950761-A1 CURABLE RESIN COMPOSITION ADEKA CORPORATION (JP) 2022-02-09 EP disclosed
CN-113544183-A Curable resin composition 株式会社艾迪科 2021-10-22 CN disclosed
WO-2021112104-A1 RESIN COMPOSITION 株式会社ADEKA 2021-06-10 WO disclosed
WO-2021112091-A1 RESIN COMPOSITION 株式会社ADEKA 2021-06-10 WO disclosed
WO-2021095534-A1 CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR DIC株式会社 2021-05-20 WO disclosed
WO-2021049390-A1 CURABLE RESIN COMPOSITION 株式会社ADEKA 2021-03-18 WO disclosed
WO-2020196819-A1 CURABLE RESIN COMPOSITION 株式会社ADEKA 2020-10-01 WO disclosed
CN-107001593-B Thermosetting resin composition 三键有限公司 2020-01-17 CN disclosed
US-8911586-B2 One liquid type cyanate-epoxy composite resin composition ADEKA CORPORATION (JP) 2014-12-16 US disclosed
US-20110095453-A1 ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION ADEKA CORPORATION (JP) 2011-04-28 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12590178-B2 Curable resin composition and method for suppressing curing shrinkage of curable resin composition SEM1, RER1, JMJD6 ADH1A 2936/4885ADH1C 2844/4885ALDH1A1 1138/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.