SCHEMBL197069

SCHEMBL197069

[CH2]OCC12CC3CC(CC(C3)C1)C2

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 2/20 0.47
CA1 P00915 2/20 0.47
CA2 P00918 2/20 0.47
CA9 Q16790 2/20 0.47
GRIN2D O15399 5/20 0.46
GRIN3B O60391 5/20 0.46
GRIN1 Q05586 5/20 0.46
GRIN2A Q12879 5/20 0.46
GRIN2B Q13224 5/20 0.46
GRIN2C Q14957 5/20 0.46
GRIN3A Q8TCU5 5/20 0.46
ALDH1A1 P00352 4/20 0.41
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
HSD17B10 Q99714 1/20 0.36
TSHR P16473 2/20 0.35
GBA2 Q9HCG7 1/20 0.34
KDM4E B2RXH2 1/20 0.33
EPHX2 P34913 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5095244 0.78 GRIN2D (0.50) CA12CA1CA2CA9GRIN2D
SCHEMBL17969022 0.75
SCHEMBL919840 0.75 CA12 (0.44) CA12CA1CA2CA9GRIN2D
SCHEMBL20612578 0.74 CA12 (0.47) CA12CA1CA2CA9GRIN2D
SCHEMBL1714716 0.74 GRIN2D (0.52) CA12CA1CA2CA9GRIN2D
SCHEMBL197070 0.74 GRIN2D (0.48) CA12CA1CA2CA9GRIN2D
SCHEMBL919449 0.73 CA12 (0.42) CA12CA1CA2CA9GRIN2D
SCHEMBL5547697 0.73 CA12 (0.42) CA12CA1CA2CA9GRIN2D
SCHEMBL855034 0.72 CA12 (0.45) CA12CA1CA2CA9GRIN2D
Hydrochloric Acid SCHEMBL1715743 0.72 GRIN2D (0.50) CA12CA1CA2CA9GRIN2D

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 163 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2955575-B1 RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND POLYPHENOL DERIVATIVE USED IN SAME MITSUBISHI GAS CHEMICAL CO (JP) 2020-07-29 EP claimed
CN-104281006-B Radiation-ray sensitive composition 三菱瓦斯化学株式会社 2019-01-22 CN claimed
CN-108008600-A Radiation-ray sensitive composition 三菱瓦斯化学株式会社 2018-05-08 CN claimed
US-9897913-B2 Radiation-sensitive composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-02-20 US claimed
CN-103102251-B Radiation-ray sensitive composition MITSUBISHI GAS CHEMICAL INC. (JP) 2016-01-20 CN claimed
US-20150030980-A1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2015-01-29 US claimed
CN-104281006-A Radiation-sensitive composition MITSUBISHI GAS CHEMICAL CO 2015-01-14 CN claimed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
EP-4219477-A1 CYANOTRIAZOLE COMPOUNDS Otsuka Pharmaceutical Co., Ltd. (JP) 2023-08-02 EP disclosed
US-20230185191-A1 COMPOUND, PRODUCTION METHOD THEREFOR, ACID GENERATOR, COMPOSITION, RESIST FILM, UNDERLAYER FILM, PATTERN FORMATION METHOD, AND OPTICAL COMPONENT MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-06-15 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
CN-115605458-A Compound and method for producing same, acid generator, composition, resist film, underlayer film, pattern formation method, and optical article 学校法人关西大学(JP) 2023-01-13 CN disclosed
US-20220144738-A1 COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD, AND METHOD FOR PURIFYING RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-05-12 US disclosed
US-20040224251-A1 Positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-11-11 US disclosed
US-20040191672-A1 Resist composition MITSUBISHI GAS CHEMICAL CO., LTD. (JP) 2004-09-30 US disclosed
WO-2004074928-A2 PHOTORESIST COMPOSITION FOR DEEP ULTRAVIOLET LITHOGRAPHY AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-09-02 WO disclosed
US-20040166433-A1 Photoresist composition for deep ultraviolet lithography AZ ELECTRONIC MATERIALS USA CORP. 2004-08-26 US disclosed
EP-1443362-A2 Resist composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2004-08-04 EP disclosed
US-20030236351-A1 Positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITIED (JP) 2003-12-25 US disclosed
US-20030194639-A1 Positive resist composition FORTINET, INC. 2003-10-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 CA12 2546/4885CA1 1120/4885CA2 3332/4885
US-20230185191-A1 COMPOUND, PRODUCTION METHOD THEREFOR, ACID GENERATOR, COMPOSITION, RESIST FILM, UNDERLAYER FILM, PATTERN FORMATION METHOD, AND OPTICAL COMPONENT SOAT2, SOAT1, FAR1 CA12 1227/4885CA1 635/4885CA2 1435/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R CA12 1606/4885CA1 161/4885CA2 1466/4885
US-20220144738-A1 COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD, CIRCUIT PATTERN FORMATION METHOD, AND METHOD FOR PURIFYING RESIN RER1, UNC119, FEM1B CA12 3746/4885CA1 1483/4885CA2 3516/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.