SCHEMBL19822465

SCHEMBL19822465

CO[Si](CCCNC(=S)Nc1ccncc1)(OC)OC

nearest known ligand 0.52

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
▸ QPCT Q16769 5/20 0.52
▸ MAOB P27338 1/20 0.52
▸ LMNA P02545 4/20 0.48
▸ ALDH1A1 P00352 3/20 0.48
▸ KMT2A Q03164 3/20 0.48
▸ SMN1; SMN2 Q16637 3/20 0.48
▸ MEN1 O00255 2/20 0.48
▸ PABPC1 P11940 1/20 0.48
▸ GAA P10253 2/20 0.46
▸ QPCTL Q9NXS2 1/20 0.46
▸ HTT P42858 1/20 0.46
▸ CA9 Q16790 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19822481 0.87 ALDH1A1 (0.59) QPCTMAOBLMNAALDH1A1KMT2A
SCHEMBL19822466 0.83 BCL6 (0.59) ALDH1A1KMT2AMEN1PABPC1GAA
SCHEMBL7966915 0.82 CA9 (0.54) QPCTLMNAALDH1A1KMT2ASMN1; SMN2
SCHEMBL17030472 0.82 KEAP1 (0.54) QPCTLMNAALDH1A1KMT2ASMN1; SMN2
SCHEMBL7900117 0.79 LMNA (0.59) QPCTLMNAALDH1A1KMT2ASMN1; SMN2
SCHEMBL8918785 0.79 QPCT (0.58) QPCTMAOBLMNAALDH1A1KMT2A
SCHEMBL19822472 0.77 NPC1 (0.54) QPCTLMNAALDH1A1KMT2ASMN1; SMN2
SCHEMBL19827963 0.77 GAA (0.47) LMNAALDH1A1KMT2AMEN1PABPC1
SCHEMBL19822471 0.76 POLB (0.69) QPCTLMNAALDH1A1KMT2ASMN1; SMN2
SCHEMBL19822476 0.76 ALDH1A1 (0.51) QPCTLMNAALDH1A1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 — — US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 — — US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 — — US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 — — US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 — — US disclosed
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