SCHEMBL19822479

SCHEMBL19822479

CO[Si](CCCNC(=S)NCC(C)C)(OC)OC

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.38
GAA P10253 1/20 0.38
HTT P42858 1/20 0.38
SMN1; SMN2 Q16637 2/20 0.36
EPHX1 P07099 1/20 0.34
ALOX12 P18054 3/20 0.34
LMNA P02545 2/20 0.34
MAPT P10636 1/20 0.34
KDM1A O60341 5/20 0.33
KMT2A Q03164 2/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
MAOB P27338 2/20 0.33
MEN1 O00255 1/20 0.32
PABPC1 P11940 1/20 0.32
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32
KCNH2 Q12809 1/20 0.32
MMP1 P03956 1/20 0.32
MMP8 P22894 1/20 0.32
CYP2D6 P10635 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19827963 0.87 GAA (0.47) ALDH1A1GAALMNAMAPTKMT2A
SCHEMBL19822480 0.80 ALDH1A1 (0.50) ALDH1A1GAAKMT2AMEN1PABPC1
SCHEMBL19822469 0.80 MEN1 (0.47) ALDH1A1GAAHTTSMN1; SMN2ALOX12
SCHEMBL19822468 0.80 QPCT (0.44) ALDH1A1GAALMNAKMT2AMEN1
SCHEMBL4459433 0.78 LMNA (0.45) ALDH1A1GAALMNAKMT2AMEN1
SCHEMBL4466119 0.76 CA1 (0.43) ALDH1A1GAASMN1; SMN2LMNAKMT2A
SCHEMBL19822477 0.76 ALDH1A1 (0.38) ALDH1A1GAAHTTLMNAMAPT
SCHEMBL271862 0.76 HRH4 (0.37) ALDH1A1LMNACYP2C19
SCHEMBL19822464 0.75 SMN1; SMN2 (0.39) ALDH1A1GAASMN1; SMN2KMT2AMEN1
SCHEMBL19822470 0.75 KMT2A (0.44) ALDH1A1GAAALOX12LMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed