SCHEMBL19822464

SCHEMBL19822464

CCOCNC(=S)NCCC[Si](OC)(OC)OC

nearest known ligand 0.39

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 3/20 0.39
RAB9A P51151 1/20 0.39
ALDH1A1 P00352 1/20 0.37
GAA P10253 1/20 0.37
HPGD P15428 2/20 0.36
MEN1 O00255 1/20 0.34
PABPC1 P11940 1/20 0.34
KMT2A Q03164 1/20 0.34
HRH4 Q9H3N8 3/20 0.33
HRH2 P25021 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19827963 0.86 GAA (0.47) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19822468 0.82 QPCT (0.44) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19822469 0.82 MEN1 (0.47) SMN1; SMN2ALDH1A1GAAMEN1PABPC1
SCHEMBL19822480 0.82 ALDH1A1 (0.50) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL4459433 0.77 LMNA (0.45) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL19822477 0.75 ALDH1A1 (0.38) ALDH1A1GAAMEN1PABPC1KMT2A
SCHEMBL4466119 0.75 CA1 (0.43) SMN1; SMN2ALDH1A1GAAKMT2A
SCHEMBL19822479 0.75 ALDH1A1 (0.38) SMN1; SMN2RAB9AALDH1A1GAAMEN1
SCHEMBL9385391 0.74 ALDH1A1 (0.39) SMN1; SMN2RAB9AALDH1A1GAAHPGD
SCHEMBL19822470 0.73 KMT2A (0.44) ALDH1A1GAAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed