SCHEMBL19822484

SCHEMBL19822484

CO[Si](CCCNC(=S)NCC(C)=O)(OC)OC

nearest known ligand 0.37

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.37
GAA P10253 4/20 0.37
EPHX2 P34913 1/20 0.34
SMN1; SMN2 Q16637 2/20 0.33
NPC1 O15118 1/20 0.33
ALOX12 P18054 1/20 0.33
RAB9A P51151 1/20 0.33
KDM4E B2RXH2 3/20 0.32
HTT P42858 2/20 0.32
KDM4C Q9H3R0 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
KMT2A Q03164 3/20 0.31
MAPK1 P28482 1/20 0.31
HIF1A Q16665 1/20 0.31
MEN1 O00255 1/20 0.31
PABPC1 P11940 1/20 0.31
LMNA P02545 1/20 0.31
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19827963 0.86 GAA (0.47) ALDH1A1GAAKMT2AMEN1PABPC1
SCHEMBL12757074 0.79 PAOX (0.33) GAAKDM4EMAPK1HIF1ALMNA
SCHEMBL19822469 0.79 MEN1 (0.47) ALDH1A1GAASMN1; SMN2ALOX12HTT
SCHEMBL19822468 0.79 QPCT (0.44) ALDH1A1GAAKMT2AMEN1PABPC1
SCHEMBL19822480 0.79 ALDH1A1 (0.50) ALDH1A1GAAKMT2AMEN1PABPC1
SCHEMBL4459433 0.77 LMNA (0.45) ALDH1A1GAAKDM4EKMT2AMEN1
SCHEMBL960689 0.76 KDM4E (0.56) ALDH1A1SMN1; SMN2KDM4EL3MBTL1MAPK1
SCHEMBL9322077 0.75 TSHR (0.40) ALDH1A1GAASMN1; SMN2KDM4EKMT2A
SCHEMBL4466119 0.75 CA1 (0.43) ALDH1A1GAASMN1; SMN2KMT2ALMNA
SCHEMBL19822477 0.75 ALDH1A1 (0.38) ALDH1A1GAAHTTKMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed