SCHEMBL2103963

SCHEMBL2103963

CCN[Si](CC)(c1ccccc1)N(C)C

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
KCNN4 O15554 1/20 0.32
ALDH1A1 P00352 2/20 0.31
TSHR P16473 1/20 0.31
TP53 P04637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2100450 0.85 ALDH1A1 (0.32) KCNN4ALDH1A1
SCHEMBL2103858 0.82 HTT (0.33) ALDH1A1TSHR
SCHEMBL2103088 0.75 KCNN4 (0.34) KCNN4ALDH1A1TSHRTP53
SCHEMBL2101901 0.75 KCNN4 (0.34) KCNN4ALDH1A1TSHRTP53
SCHEMBL2101654 0.75 KCNN4 (0.34) KCNN4ALDH1A1TSHRTP53
SCHEMBL2270811 0.73 KCNN4 (0.38) KCNN4ALDH1A1TSHRTP53
SCHEMBL2102166 0.73 KCNN4 (0.34) KCNN4
SCHEMBL2103257 0.72 KCNN4 (0.32) KCNN4ALDH1A1TSHRTP53
SCHEMBL2103024 0.71 SIGMAR1 (0.36) KCNN4ALDH1A1TSHR
SCHEMBL2099561 0.70 KCNN4 (0.37) KCNN4ALDH1A1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed