Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 5/20 | 0.72 |
| ▸ | TSHR | P16473 | 3/20 | 0.72 |
| ▸ | PIK3CA | P42336 | 1/20 | 0.72 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.56 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.50 |
| ▸ | HPGD | P15428 | 3/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.48 |
| ▸ | CD44 | P16070 | 1/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.43 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.43 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.42 |
| ▸ | CASP1 | P29466 | 1/20 | 0.42 |
| ▸ | CASP7 | P55210 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.42 |
| ▸ | DPP4 | P27487 | 1/20 | 0.39 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.39 |
| ▸ | PTPRC | P08575 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 2/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30839749 | 1.00 | CYP3A4 (0.72) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL3781456 | 0.92 | ALDH1A1 (0.65) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL22675646 | 0.90 | CYP3A4 (0.59) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL7939779 | 0.88 | CYP3A4 (0.56) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL30340373 | 0.86 | CYP3A4 (0.54) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL29779254 | 0.86 | ALDH1A1 (0.56) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL21616755 | 0.86 | CYP3A4 (0.54) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL20293728 | 0.86 | ALDH1A1 (0.56) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL3789724 | 0.86 | CD44 (0.60) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 | |
| SCHEMBL27548959 | 0.86 | CYP3A4 (0.54) | CYP3A4TSHRPIK3CAALDH1A1L3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 174 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260015454-A1 | HIGH PERFORMANCE, AMBIENT CURE POLYURETHANES COMPRISING POLYCAPROLACTONE POLYOLS | INGEVITY UK LTD (GB) | 2026-01-15 | — | — | US | claimed |
| EP-4594381-A1 | NOVEL POLYURETHANE OR POLYURETHANE-UREA COMPOSITION WITH ENHANCED LOW TEMPERATURE PERFORMANCE | Ingevity UK Ltd (GB) | 2025-08-06 | — | — | EP | claimed |
| US-20250243313-A1 | POLYCAPROLACTONE POLYOLS, ELASTOMERS, AND METHODS OF MAKING AND USING THE SAME | INGEVITY UK LTD (GB) | 2025-07-31 | — | — | US | claimed |
| WO-2025149744-A1 | POLYCAPROLACTONE POLYOLS, POLYURETHANE DISPERSIONS, AND METHODS OF MAKING AND USING THE SAME | INGEVITY UK LTD (GB) | 2025-07-17 | — | — | WO | claimed |
| US-20250230274-A1 | POLYCAPROLACTONE POLYOLS, POLYURETHANE DISPERSIONS, AND METHODS OF MAKING AND USING THE SAME | INGEVITY UK LTD (GB) | 2025-07-17 | — | — | US | claimed |
| CN-120092033-A | Novel polyurethane or polyurethane-urea compositions with enhanced low temperature properties | 英格维蒂英国有限公司 | 2025-06-03 | — | — | CN | claimed |
| CN-118307737-A | Degradable and recyclable polyether polyurethane and preparation method thereof | 华南理工大学 | 2024-07-09 | — | — | CN | claimed |
| CN-117343006-B | Preparation method of ARB-272572 | 河南科技大学 | 2024-07-09 | — | — | CN | claimed |
| US-20240110002-A1 | NOVEL POLYURETHANE OR POLYURETHANE-UREA COMPOSITION WITH ENHANCED LOW TEMPERATURE PERFORMANCE | INGEVITY UK LTD (GB) | 2024-04-04 | — | — | US | claimed |
| WO-2024068129-A1 | NOVEL POLYURETHANE OR POLYURETHANE-UREA COMPOSITION WITH ENHANCED LOW TEMPERATURE PERFORMANCE | INGEVITY UK LTD. (GB) | 2024-04-04 | — | — | WO | claimed |
| CN-117343006-A | Preparation method of ARB-272572 | 河南科技大学 | 2024-01-05 | — | — | CN | claimed |
| US-20230279184-A1 | COMPOSITION COMPRISING POLYIMIDE OR PRECURSOR THEREOF, CURED PRODUCT THEREOF, POLYIMIDE FILM COMPRISING CURED PRODUCT, LAMINATE PROVIDED WITH POLYIMIDE FILM, AND DEVICE PROVIDED WITH LAMINATE | LG CHEM, LTD. (KR) | 2023-09-07 | — | — | US | claimed |
| CN-115720585-A | Composition containing polyimide or precursor thereof, cured product thereof, polyimide film containing cured product, laminate provided with polyimide film, and apparatus provided with laminate | 株式会社LG化学 | 2023-02-28 | — | — | CN | claimed |
| CN-114044903-A | Hard polyimide foam and preparation method and application thereof | 四川大学 | 2022-02-15 | — | — | CN | claimed |
| CN-110591047-A | Degradable polyether polyurethane and preparation method thereof | 华南理工大学 | 2019-12-20 | — | — | CN | claimed |
| EP-0929841-A4 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | MKE QUANTUM COMPONENTS COLORAD (US) | 2001-04-18 | — | — | EP | claimed |
| US-5955244-A | Method for forming photoresist features having reentrant profiles using a basic agent | QUANTUM CORPORATION (US) | 1999-09-21 | — | — | US | claimed |
| EP-0929841-A1 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | Mke-Quantum Components Colorado LLC (US) | 1999-07-21 | — | — | EP | claimed |
| WO-1998008143-A1 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | MKE-QUANTUM COMPONENTS COLORADO LLC (US) | 1998-02-26 | — | — | WO | claimed |
| US-20260015454-A1 | HIGH PERFORMANCE, AMBIENT CURE POLYURETHANES COMPRISING POLYCAPROLACTONE POLYOLS | INGEVITY UK LTD (GB) | 2026-01-15 | — | — | US | disclosed |
| EP-4594381-A1 | NOVEL POLYURETHANE OR POLYURETHANE-UREA COMPOSITION WITH ENHANCED LOW TEMPERATURE PERFORMANCE | Ingevity UK Ltd (GB) | 2025-08-06 | — | — | EP | disclosed |
| US-20250243313-A1 | POLYCAPROLACTONE POLYOLS, ELASTOMERS, AND METHODS OF MAKING AND USING THE SAME | INGEVITY UK LTD (GB) | 2025-07-31 | — | — | US | disclosed |
| WO-2025149744-A1 | POLYCAPROLACTONE POLYOLS, POLYURETHANE DISPERSIONS, AND METHODS OF MAKING AND USING THE SAME | INGEVITY UK LTD (GB) | 2025-07-17 | — | — | WO | disclosed |
| US-20250230274-A1 | POLYCAPROLACTONE POLYOLS, POLYURETHANE DISPERSIONS, AND METHODS OF MAKING AND USING THE SAME | INGEVITY UK LTD (GB) | 2025-07-17 | — | — | US | disclosed |
| WO-2025136134-A1 | DIMETHYLBIPHENYL COVALENT PD-L1/PD-1 INTERACTION INHIBITOR COMPOUND, PHARMACEUTICAL COMPOSITION CONTAINING SAID INHIBITOR AND THE USE THEREOF | Uniwersytet Jagielloński (PL) | 2025-06-26 | — | — | WO | disclosed |
| CN-120092033-A | Novel polyurethane or polyurethane-urea compositions with enhanced low temperature properties | 英格维蒂英国有限公司 | 2025-06-03 | — | — | CN | disclosed |
| EP-3750887-B1 | BIARYL DERIVATIVES AND THEIR PHARMACEUTICAL APPLICATION FOR THE TREATMENT OF PD-1/PD-L1 SIGNAL PATHWAY-MEDIATED DISEASES | ABBISKO THERAPEUTICS CO LTD (CN) | 2025-05-28 | — | — | EP | disclosed |
| US-12261143-B2 | Method of manufacturing substrate layered body and layered body | MITSUI CHEMICALS, INC. (JP) | 2025-03-25 | — | — | US | disclosed |
| CN-119654696-A | Method for manufacturing substrate laminate and semiconductor device | 三井化学株式会社 | 2025-03-18 | — | — | CN | disclosed |
| CN-119497906-A | Method for producing substrate laminate and substrate laminate | 三井化学株式会社 | 2025-02-21 | — | — | CN | disclosed |
| WO-2025029075-A1 | NOVEL BIPHENYL DERIVATIVE AS PD-L1 INHIBITOR | (주)아이랩 | 2025-02-06 | — | — | WO | disclosed |
| WO-2025005084-A1 | SUBSTRATE LAMINATE | 三井化学株式会社 | 2025-01-02 | — | — | WO | disclosed |
| CN-115956098-B | Composition, laminate, and method for producing laminate | 三井化学株式会社 | 2024-11-26 | — | — | CN | disclosed |
| US-20240384132-A1 | COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBSTRATE LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-11-21 | — | — | US | disclosed |
| US-20240374595-A1 | SUBSTITUTED 1,1'-BIPHENYL COMPOUNDS, ANALOGUES THEREOF, AND METHODS USING SAME | ARBUTUS BIOPHARMA CORPORATION (CA) | 2024-11-14 | — | — | US | disclosed |
| US-20240371713-A1 | COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBSTRATE LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-11-07 | — | — | US | disclosed |
| WO-2024225232-A1 | SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME | 三井化学株式会社 | 2024-10-31 | — | — | WO | disclosed |
| CN-111978511-B | Epoxy resin, method for producing same, curable epoxy resin composition, cured product, prepreg, insulating sheet, and laminate | 日铁化学材料株式会社 | 2024-10-25 | — | — | CN | disclosed |
| US-12083118-B2 | Substituted 1,1′-biphenyl compounds, analogues thereof, and methods using same | ARBUTUS BIOPHARMA CORPORATION (CA) | 2024-09-10 | — | — | US | disclosed |
| CN-111448189-B | Biaryl derivative, preparation method and pharmaceutical application thereof | 上海和誉生物医药科技有限公司 | 2024-09-10 | — | — | CN | disclosed |
| CN-115720585-B | Composition containing polyimide or precursor thereof | 株式会社LG化学 | 2024-08-30 | — | — | CN | disclosed |
| WO-2024177074-A1 | METHOD FOR MANUFACTURING SUBSTRATE LAMINATE | 三井化学株式会社 | 2024-08-29 | — | — | WO | disclosed |
| WO-2024177149-A1 | SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME | 三井化学株式会社 | 2024-08-29 | — | — | WO | disclosed |
| WO-2024177116-A1 | PRODUCTION METHOD FOR SEMICONDUCTOR CHIP WITH RESIN LAYER AND PRODUCTION METHOD FOR SUBSTRATE LAMINATE | 三井化学株式会社 | 2024-08-29 | — | — | WO | disclosed |
| WO-2024172044-A1 | METHOD FOR MANUFACTURING SUBSTRATE LAYERED BODY, LAYERED BODY, AND SUBSTRATE LAYERED BODY | 三井化学株式会社 | 2024-08-22 | — | — | WO | disclosed |
| WO-2024166789-A1 | SEMICONDUCTOR STRUCTURE AND PRODUCTION METHOD FOR SAME | 三井化学株式会社 | 2024-08-15 | — | — | WO | disclosed |
| WO-2024162446-A1 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | 三井化学株式会社 | 2024-08-08 | — | — | WO | disclosed |
| CN-117343006-B | Preparation method of ARB-272572 | 河南科技大学 | 2024-07-09 | — | — | CN | disclosed |
| CN-117343006-B | Preparation method of ARB-272572 | 河南科技大学 | 2024-07-09 | — | — | CN | disclosed |
| CN-118307737-A | Degradable and recyclable polyether polyurethane and preparation method thereof | 华南理工大学 | 2024-07-09 | — | — | CN | disclosed |
| EP-4391025-A1 | COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBSTRATE LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-06-26 | — | — | EP | disclosed |
| EP-4391024-A1 | COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBSTRATE LAMINATE | MITSUI CHEMICALS, INC. (JP) | 2024-06-26 | — | — | EP | disclosed |
| CN-111936475-B | Immunomodulator, composition and preparation method thereof | 贝达药业股份有限公司 | 2024-05-10 | — | — | CN | disclosed |
| CN-117941037-A | Composition for forming film for semiconductor, laminate, and substrate laminate | 三井化学株式会社 | 2024-04-26 | — | — | CN | disclosed |
| US-11965109-B2 | Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device | MITSUI CHEMICALS, INC. (JP) | 2024-04-23 | — | — | US | disclosed |
| CN-115677665-B | Biphenyl-containing derivative and medical application thereof | 中国药科大学 | 2024-04-19 | — | — | CN | disclosed |
| CN-117897799-A | Composition for forming film for semiconductor, laminate, and substrate laminate | 三井化学株式会社 | 2024-04-16 | — | — | CN | disclosed |
| US-20240110002-A1 | NOVEL POLYURETHANE OR POLYURETHANE-UREA COMPOSITION WITH ENHANCED LOW TEMPERATURE PERFORMANCE | INGEVITY UK LTD (GB) | 2024-04-04 | — | — | US | disclosed |
| WO-2024068129-A1 | NOVEL POLYURETHANE OR POLYURETHANE-UREA COMPOSITION WITH ENHANCED LOW TEMPERATURE PERFORMANCE | INGEVITY UK LTD. (GB) | 2024-04-04 | — | — | WO | disclosed |
| CN-112898738-B | Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same | 日铁化学材料株式会社 | 2024-03-22 | — | — | CN | disclosed |
| WO-2024029390-A1 | METHOD FOR PRODUCING SUBSTRATE LAMINATE AND SEMICONDUCTOR DEVICE | 三井化学株式会社 | 2024-02-08 | — | — | WO | disclosed |
| WO-2024010007-A1 | SUBSTRATE LAYERED BODY MANUFACTURING METHOD AND SUBSTRATE LAYERED BODY | 三井化学株式会社 | 2024-01-11 | — | — | WO | disclosed |
| CN-117343006-A | Preparation method of ARB-272572 | 河南科技大学 | 2024-01-05 | — | — | CN | disclosed |
| CN-117343006-A | Preparation method of ARB-272572 | 河南科技大学 | 2024-01-05 | — | — | CN | disclosed |
| US-11859110-B2 | Substrate laminated body and method of manufacturing substrate laminated body | MITSUI CHEMICALS, INC. (JP) | 2024-01-02 | — | — | US | disclosed |
| CN-110520433-B | Phosphorus-containing phenol compound, phosphorus-containing epoxy resin, curable resin composition or epoxy resin composition, and cured product thereof | 日铁化学材料株式会社 | 2023-12-05 | — | — | CN | disclosed |
| CN-117070147-A | Composition for producing film for semiconductor device and method for producing same | 三井化学株式会社 | 2023-11-17 | — | — | CN | disclosed |
| US-20230331927-A1 | POLYMETALLOXANE-CONTAINING COMPOSITION, CURED BODY, MEMBER, ELECTRONIC COMPONENT, AND FIBER | TORAY INDUSTRIES, INC. (JP) | 2023-10-19 | — | — | US | disclosed |
| EP-3620459-B9 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-10-04 | — | — | EP | disclosed |
| EP-3616903-B1 | SUBSTRATE LAMINATED BODY AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATED BODY | MITSUI CHEMICALS INC (JP) | 2023-09-27 | — | — | EP | disclosed |
| WO-2023169373-A1 | HOLOSYMMETRIC BIPHENYL DERIVATIVE, AND PREPARATION METHOD THEREFOR AND USE THEREOF | 上海和誉生物医药科技有限公司 | 2023-09-14 | — | — | WO | disclosed |
| CN-108352320-B | Film composition for semiconductor, method for producing same, and semiconductor device | 三井化学株式会社 | 2023-09-08 | — | — | CN | disclosed |
| US-20230279184-A1 | COMPOSITION COMPRISING POLYIMIDE OR PRECURSOR THEREOF, CURED PRODUCT THEREOF, POLYIMIDE FILM COMPRISING CURED PRODUCT, LAMINATE PROVIDED WITH POLYIMIDE FILM, AND DEVICE PROVIDED WITH LAMINATE | LG CHEM, LTD. (KR) | 2023-09-07 | — | — | US | disclosed |
| US-20230275057-A1 | COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY | MITSUI CHEMICALS, INC. (JP) | 2023-08-31 | — | — | US | disclosed |
| CN-112585189-B | Epoxy resin composition, prepreg, laminated board, material for circuit board, cured product, and method for producing phosphorus-containing epoxy resin | 日铁化学材料株式会社 | 2023-08-01 | — | — | CN | disclosed |
| EP-4195264-A1 | COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY | Mitsui Chemicals, Inc. (JP) | 2023-06-14 | — | — | EP | disclosed |
| EP-3845578-B1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-06-07 | — | — | EP | disclosed |
| EP-3620459-B1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2023-05-24 | — | — | EP | disclosed |
| US-20230139268-A1 | FLEXIBLE TUBE FOR ENDOSCOPE, ENDOSCOPIC MEDICAL DEVICE, AND METHODS FOR PRODUCING THE SAME | FUJIFILM CORPORATION (JP) | 2023-05-04 | — | — | US | disclosed |
| CN-115956098-A | Composition, laminate, and method for producing laminate | 三井化学株式会社 | 2023-04-11 | — | — | CN | disclosed |
| CN-115942896-A | Flexible tube for endoscope, endoscopic medical instrument, and method for producing same | 富士胶片株式会社 | 2023-04-07 | — | — | CN | disclosed |
| WO-2023032924-A1 | COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBSTRATE LAMINATE | 三井化学株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032923-A1 | COMPOSITION FOR FORMING FILM FOR SEMICONDUCTOR, LAMINATE, AND SUBSTRATE LAMINATE | 三井化学株式会社 | 2023-03-09 | — | — | WO | disclosed |
| CN-115720585-A | Composition containing polyimide or precursor thereof, cured product thereof, polyimide film containing cured product, laminate provided with polyimide film, and apparatus provided with laminate | 株式会社LG化学 | 2023-02-28 | — | — | CN | disclosed |
| CN-108292604-B | Film composition for semiconductor, method for producing member for semiconductor, method for producing processing material for semiconductor, and semiconductor device | 三井化学株式会社 | 2023-02-21 | — | — | CN | disclosed |
| CN-115677665-A | Biphenyl-containing derivative and medical application thereof | 中国药科大学 | 2023-02-03 | — | — | CN | disclosed |
| US-20220402917-A1 | COMPOUND AS SMALL MOLECULE INHIBITOR PD-1/PD-L1 AND APPLICATION THEREOF | MEDSHINE DISCOVERY INC. (CN) | 2022-12-22 | — | — | US | disclosed |
| US-20220380342-A1 | BIPHENYL DERIVATIVES FOR BLOCKING PD-1/PD-L1 INTERACTION, PREPARATION METHOD THEREFOR AND USE THEREOF | ABBISKO THERAPEUTICS CO., LTD. (CN) | 2022-12-01 | — | — | US | disclosed |
| CN-115403742-A | Oxazolidone ring-containing epoxy resin, process for producing the same, epoxy resin composition and use thereof, and cured epoxy resin | 日铁化学材料株式会社 | 2022-11-29 | — | — | CN | disclosed |
| US-11487205-B2 | Semiconductor element intermediate, composition for forming metal-containing film, method of producing semiconductor element intermediate, and method of producing semiconductor element | MITSUI CHEMICALS, INC. (JP) | 2022-11-01 | — | — | US | disclosed |
| US-11459339-B2 | Biaryl derivative, preparation method thereof and pharmaceutical application thereof | ABBISKO THERAPEUTICS CO., LTD. (CN) | 2022-10-04 | — | — | US | disclosed |
| US-11421071-B2 | Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product | NIPPON STEEL CHEMICAL & MATERIALS CO., LTD. (JP) | 2022-08-23 | — | — | US | disclosed |
| EP-4043461-A1 | COMPOUND AS SMALL MOLECULE INHIBITOR PD-1/PD-L1 AND APPLICATION THEREOF | Medshine Discovery Inc. (CN) | 2022-08-17 | — | — | EP | disclosed |
| EP-4001274-A1 | BIPHENYL DERIVATIVES FOR BLOCKING PD-1/PD-L1 INTERACTION, PREPARATION METHOD THEREFOR AND USE THEREOF | Abbisko Therapeutics Co., Ltd. (CN) | 2022-05-25 | — | — | EP | disclosed |
| CN-110545997-B | Substrate laminate and method for manufacturing substrate laminate | 三井化学株式会社 | 2022-05-24 | — | — | CN | disclosed |
| CN-114518357-A | Method for rapidly screening pesticide residues on fruit surface | 石海红 | 2022-05-20 | — | — | CN | disclosed |
| WO-2022054839-A1 | COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY | 三井化学株式会社 | 2022-03-17 | — | — | WO | disclosed |
| CN-114044903-A | Hard polyimide foam and preparation method and application thereof | 四川大学 | 2022-02-15 | — | — | CN | disclosed |
| WO-2022004656-A1 | FLEXIBLE TUBE FOR ENDOSCOPE, ENDOSCOPE-TYPE MEDICAL DEVICE, AND METHODS FOR MANUFACTURING SAME | 富士フイルム株式会社 | 2022-01-06 | — | — | WO | disclosed |
| US-11209735-B2 | Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device | MITSUI CHEMICALS, INC. (JP) | 2021-12-28 | — | — | US | disclosed |
| US-20210391292-A1 | METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY | MITSUI CHEMICALS, INC. (JP) | 2021-12-16 | — | — | US | disclosed |
| CN-113493469-A | Compound capable of being used as immunomodulator, preparation method and application thereof | 成都倍特药业股份有限公司 | 2021-10-12 | — | — | CN | disclosed |
| US-20210253783-A1 | PHOSPHORUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2021-08-19 | — | — | US | disclosed |
| EP-3855477-A1 | SUBSTRATE LAYERED BODY MANUFACTURING METHOD AND LAYERED BODY | Mitsui Chemicals, Inc. (JP) | 2021-07-28 | — | — | EP | disclosed |
| EP-3845578-A1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2021-07-07 | — | — | EP | disclosed |
| US-20210191269-A1 | SEMICONDUCTOR ELEMENT INTERMEDIATE, COMPOSITION FOR FORMING METAL-CONTAINING FILM, METHOD OF PRODUCING SEMICONDUCTOR ELEMENT INTERMEDIATE, AND METHOD OF PRODUCING SEMICONDUCTOR ELEMENT | MITSUI CHEMICALS, INC. (JP) | 2021-06-24 | — | — | US | disclosed |
| CN-112898738-A | Epoxy resin composition, prepreg, laminate, printed wiring board, and cured product using same | 日铁化学材料株式会社 | 2021-06-04 | — | — | CN | disclosed |
| CN-112889131-A | Method for producing substrate laminate, and laminate | 三井化学株式会社 | 2021-06-01 | — | — | CN | disclosed |
| EP-2573595-B1 | LIGHT-SHIELDING FILM | TOYO BOSEKI (JP) | 2021-04-28 | — | — | EP | disclosed |
| CN-109293881-B | Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product | 日铁化学材料株式会社 | 2021-04-13 | — | — | CN | disclosed |
| WO-2021063404-A1 | COMPOUND AS SMALL MOLECULE INHIBITOR PD-1/PD-L1 AND APPLICATION THEREOF | 南京明德新药研发有限公司 | 2021-04-08 | — | — | WO | disclosed |
| CN-112585189-A | Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminate, material for circuit board, and cured product | 日铁化学材料株式会社 | 2021-03-30 | — | — | CN | disclosed |
| WO-2021047556-A1 | NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AND PREPARATION METHOD THEREFOR, PHARMACEUTICAL COMPOSITION COMPRISING SAME AND USE THEREOF | 上海长森药业有限公司 | 2021-03-18 | — | — | WO | disclosed |
| CN-109153884-B | Composition for forming metal-containing film, method for producing composition for forming metal-containing film, semiconductor device, and method for producing semiconductor device | 三井化学株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-108753101-B | Epoxy powder coating and application thereof | 江门市新会区新日旭电子材料有限公司 | 2021-02-26 | — | — | CN | disclosed |
| US-20210052585-A1 | SUBSTITUTED 1,1'-BIPHENYL COMPOUNDS, ANALOGUES THEREOF, AND METHODS USING SAME | ARBUTUS BIOPHARMA CORPORATION (CA) | 2021-02-25 | — | — | US | disclosed |
| US-20210052585-A1 | SUBSTITUTED 1,1'-BIPHENYL COMPOUNDS, ANALOGUES THEREOF, AND METHODS USING SAME | ARBUTUS BIOPHARMA CORPORATION (CA) | 2021-02-25 | — | — | US | disclosed |
| CN-108314774-B | Phosphorus-containing epoxy resin, composition containing the epoxy resin as essential component, and cured product | 日铁化学材料株式会社 | 2021-02-12 | — | — | CN | disclosed |
| US-20210040118-A1 | IMMUNOMODULATORS, COMPOSITIONS AND METHODS THEREOF | BETTA PHARMACEUTICALS CO., LTD (CN) | 2021-02-11 | — | — | US | disclosed |
| US-20210040118-A1 | IMMUNOMODULATORS, COMPOSITIONS AND METHODS THEREOF | BETTA PHARMACEUTICALS CO., LTD (CN) | 2021-02-11 | — | — | US | disclosed |
| US-20210032270-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | ABBISKO THERAPEUTICS CO., LTD. (CN) | 2021-02-04 | — | — | US | disclosed |
| US-20210032270-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | ABBISKO THERAPEUTICS CO., LTD. (CN) | 2021-02-04 | — | — | US | disclosed |
| EP-3750887-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | Abbisko Therapeutics Co., Ltd. (CN) | 2020-12-16 | — | — | EP | disclosed |
| EP-3750887-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | Abbisko Therapeutics Co., Ltd. (CN) | 2020-12-16 | — | — | EP | disclosed |
| CN-108587400-B | Bi-component insulating paint for magnetic ring | 江门市新会区新日旭电子材料有限公司 | 2020-12-08 | — | — | CN | disclosed |
| CN-111978511-A | Epoxy resin, method for producing same, curable epoxy resin composition, cured product, prepreg, insulating sheet, and laminate | 日铁化学材料株式会社 | 2020-11-24 | — | — | CN | disclosed |
| CN-111936475-A | Immunomodulator, composition and preparation method thereof | 贝达药业股份有限公司 | 2020-11-13 | — | — | CN | disclosed |
| US-20200347265-A1 | SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR PROCESSING MATERIAL, AND SEMICONDUCTOR DEVICE | MITSUI CHEMICALS, INC. (JP) | 2020-11-05 | — | — | US | disclosed |
| EP-3379564-B1 | FILM COMPOSITION FOR SEMICONDUCTOR, MANUFACTURING METHOD FOR FILM COMPOSITION FOR SEMICONDUCTOR, MANUFACTURING METHOD FOR SEMICONDUCTOR MEMBER, MANUFACTURING METHOD FOR PROCESS MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | MITSUI CHEMICALS INC (JP) | 2020-10-14 | — | — | EP | disclosed |
| EP-3379565-B1 | SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING PROCESSING MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | MITSUI CHEMICALS INC (JP) | 2020-10-14 | — | — | EP | disclosed |
| US-10759964-B2 | Semiconductor film composition, method of manufacturing semiconductor film composition, method of manufacturing semiconductor member, method of manufacturing semiconductor processing material, and semiconductor device | MITSUI CHEMICALS, INC. (JP) | 2020-09-01 | — | — | US | disclosed |
| US-10752805-B2 | Semiconductor film composition, method for manufacturing semiconductor film composition, method for manufacturing semiconductor member, method for manufacturing semiconductor processing material, and semiconductor device | MITSUI CHEMICALS, INC. (JP) | 2020-08-25 | — | — | US | disclosed |
| CN-111484600-A | Epoxy resin composition and cured product thereof, prepreg, insulating sheet, adhesive sheet, laminate, sealing material, and casting material | 日铁化学材料株式会社 | 2020-08-04 | — | — | CN | disclosed |
| CN-111448189-A | Biaryl derivative, preparation method and pharmaceutical application thereof | 上海和誉生物医药科技有限公司 | 2020-07-24 | — | — | CN | disclosed |
| CN-111433894-A | Semiconductor element intermediate, composition for forming metal-containing film, method for producing semiconductor element intermediate, and method for producing semiconductor element | 三井化学株式会社 | 2020-07-17 | — | — | CN | disclosed |
| CN-105968321-B | Oxazolidone ring-containing epoxy resin, method for producing same, epoxy resin composition, cured product thereof, and application thereof | 日铁化学材料株式会社 | 2020-05-05 | — | — | CN | disclosed |
| CN-106467653-B | Flame-retardant epoxy resin composition, prepreg, insulating sheet, adhesive sheet, laminate, sealing material, casting material, and cured product | 日铁化学材料株式会社 | 2020-05-05 | — | — | CN | disclosed |
| WO-2020085183-A1 | SUBSTRATE LAYERED BODY MANUFACTURING METHOD AND LAYERED BODY | 三井化学株式会社 | 2020-04-30 | — | — | WO | disclosed |
| EP-3620459-A1 | PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2020-03-11 | — | — | EP | disclosed |
| WO-2020045150-A1 | PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT | 日鉄ケミカル＆マテリアル株式会社 | 2020-03-05 | — | — | WO | disclosed |
| EP-3616903-A1 | SUBSTRATE LAMINATE AND METHOD FOR MANUFACTURING SUBSTRATE LAMINATE | Mitsui Chemicals, Inc. (JP) | 2020-03-04 | — | — | EP | disclosed |
| US-20200048515-A1 | SUBSTRATE LAMINATED BODY AND METHOD OF MANUFACTURING SUBSTRATE LAMINATED BODY | MITSUI CHEMICALS, INC. (JP) | 2020-02-13 | — | — | US | disclosed |
| CN-110591047-A | Degradable polyether polyurethane and preparation method thereof | 华南理工大学 | 2019-12-20 | — | — | CN | disclosed |
| CN-110545997-A | Substrate laminate and method for manufacturing substrate laminate | MITSUI CHEMICALS INC | 2019-12-06 | — | — | CN | disclosed |
| WO-2019192506-A1 | IMMUNOMODULATORS, COMPOSITIONS AND METHODS THEREOF | BETTA PHARMACEUTICALS CO., LTD (CN) | 2019-10-10 | — | — | WO | disclosed |
| WO-2019191624-A1 | SUBSTITUTED 1,1'-BIPHENYL COMPOUNDS, ANALOGUES THEREOF, AND METHODS USING SAME | ARBUTUS BIOPHARMA, INC. (US) | 2019-10-03 | — | — | WO | disclosed |
| WO-2019149183-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | 上海和誉生物医药科技有限公司 | 2019-08-08 | — | — | WO | disclosed |
| WO-2019149183-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | 上海和誉生物医药科技有限公司 | 2019-08-08 | — | — | WO | disclosed |
| US-20190187560-A1 | COMPOSITION FOR FORMING METAL-CONTAINING FILM, METHOD OF PRODUCING COMPOSITION FOR FORMING METAL-CONTAINING FILM, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE | MITSUI CHEMICALS, INC. (JP) | 2019-06-20 | — | — | US | disclosed |
| US-20180334588-A1 | SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING SEMICONDUCTOR PROCESSING MATERIAL, AND SEMICONDUCTOR DEVICE | MITSUI CHEMICALS, INC. (JP) | 2018-11-22 | — | — | US | disclosed |
| US-20180327547-A1 | SEMICONDUCTOR FILM COMPOSITION, METHOD OF MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD OF MANUFACTURING SEMICONDUCTOR MEMBER, METHOD OF MANUFACTURING SEMICONDUCTOR PROCESSING MATERIAL, AND SEMICONDUCTOR DEVICE | MITSUI CHEMICALS, INC. (JP) | 2018-11-15 | — | — | US | disclosed |
| EP-3379565-A1 | SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR FILM COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, METHOD FOR MANUFACTURING PROCESSING MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | Mitsui Chemicals, Inc. (JP) | 2018-09-26 | — | — | EP | disclosed |
| EP-3379564-A1 | FILM COMPOSITION FOR SEMICONDUCTOR, MANUFACTURING METHOD FOR FILM COMPOSITION FOR SEMICONDUCTOR, MANUFACTURING METHOD FOR SEMICONDUCTOR MEMBER, MANUFACTURING METHOD FOR PROCESS MATERIAL FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE | Mitsui Chemicals, Inc. (JP) | 2018-09-26 | — | — | EP | disclosed |
| US-9201176-B2 | Light-shielding film | TOYOBO CO., LTD. (JP) | 2015-12-01 | — | — | US | disclosed |
| EP-1909142-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER | TORAY INDUSTRIES (JP) | 2015-06-24 | — | — | EP | disclosed |
| EP-2573595-A1 | LIGHT-SHIELDING FILM | Toyobo Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130065039-A1 | LIGHT-SHIELDING FILM | TOYOBO CO., LTD. (JP) | 2013-03-14 | — | — | US | disclosed |
| US-8227041-B2 | Self-assembling block copolymer film | UNIVERSITY OF SHEFFIELD (GB) | 2012-07-24 | — | — | US | disclosed |
| US-7977028-B2 | Photosensitive resin composition and adhesion promoter | TORAY INDUSTRIES, INC. (JP) | 2011-07-12 | — | — | US | disclosed |
| US-20100087680-A1 | METHOD FOR PRODUCING BIARYL COMPOUND | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20090123867-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER | TORAY INDUSTRIES, INC. (JP) | 2009-05-14 | — | — | US | disclosed |
| US-20090041995-A1 | Self-Assembling Block Copolymer Film | UNIVERSITY OF SHEFFIELD (GB) | 2009-02-12 | — | — | US | disclosed |
| EP-1914221-A1 | PROCESS FOR PRODUCING BIARYL COMPOUND | Sumitomo Chemical Company, Limited (JP) | 2008-04-23 | — | — | EP | disclosed |
| EP-1909142-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER | TORAY INDUSTRIES, INC. (JP) | 2008-04-09 | — | — | EP | disclosed |
| EP-1866673-A1 | SELF-ASSEMBLING BLOCK COPOLYMER FILM | University of Sheffield (GB) | 2007-12-19 | — | — | EP | disclosed |
| WO-2006103462-A1 | SELF-ASSEMBLING BLOCK COPOLYMER FILM | UNIVERSITY OF SHEFFIELD (GB) | 2006-10-05 | — | — | WO | disclosed |
| EP-0940724-B1 | Use of a solution for developing a photosensitive polyimide precursor, and method of patterning | HITACHI CHEM DUPONT MICROSYS (JP) | 2004-08-04 | — | — | EP | disclosed |
| EP-0929841-A4 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | MKE QUANTUM COMPONENTS COLORAD (US) | 2001-04-18 | — | — | EP | disclosed |
| US-6146815-A | Developer for photosensitive polyimide precursor, and method of using it for patterning | HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. (US) | 2000-11-14 | — | — | US | disclosed |
| US-6051722-A | PRECURSOR FOR POLYIMIDE COPOLYMER; USABLE IN OPTICAL LONG-DISTANCE COMMUNICATION, SIGNAL PROCESSING, PHOTOELECTRIC HYBRID CIRCUITS AND OPTICAL COMPUTERS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-04-18 | — | — | US | disclosed |
| US-5955244-A | Method for forming photoresist features having reentrant profiles using a basic agent | QUANTUM CORPORATION (US) | 1999-09-21 | — | — | US | disclosed |
| EP-0940724-A2 | Developer for photosensitive polyimide precursor, and method of using it for patterning | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 1999-09-08 | — | — | EP | disclosed |
| EP-0929841-A1 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | Mke-Quantum Components Colorado LLC (US) | 1999-07-21 | — | — | EP | disclosed |
| WO-1998008143-A1 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | MKE-QUANTUM COMPONENTS COLORADO LLC (US) | 1998-02-26 | — | — | WO | disclosed |
| WO-1998008143-A1 | METHOD FOR FORMING PHOTORESIST FEATURES HAVING REENTRANT PROFILES USING A BASIC AGENT | MKE-QUANTUM COMPONENTS COLORADO LLC (US) | 1998-02-26 | — | — | WO | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (11 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12083118-B2 | Substituted 1,1′-biphenyl compounds, analogues thereof, and methods using same | HAVCR2, HMBS, BCL3 | CYP3A4 92/4885TSHR 3107/4885PIK3CA 1892/4885 |
| US-20210032270-A1 | BIARYL DERIVATIVE, PREPARATION METHOD THEREOF AND PHARMACEUTICAL APPLICATION THEREOF | PDCD1, PDCD1LG2, CD274 | CYP3A4 1135/4885TSHR 825/4885PIK3CA 1678/4885 |
| US-20090123867-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION PROMOTER | PCNA, TERB1, SMC2 | CYP3A4 4337/4885TSHR 4306/4885PIK3CA 2892/4885 |
| US-20240374595-A1 | SUBSTITUTED 1,1'-BIPHENYL COMPOUNDS, ANALOGUES THEREOF, AND METHODS USING SAME | HAVCR2, HMBS, CDV3 | CYP3A4 87/4885TSHR 3102/4885PIK3CA 2425/4885 |
| US-20220402917-A1 | COMPOUND AS SMALL MOLECULE INHIBITOR PD-1/PD-L1 AND APPLICATION THEREOF | CD274, PDCD1, PDCD1LG2 | CYP3A4 4390/4885TSHR 1591/4885PIK3CA 3237/4885 |
| US-20260015454-A1 | HIGH PERFORMANCE, AMBIENT CURE POLYURETHANES COMPRISING POLYCAPROLACTONE POLYOLS | PUF60, MORF4L1, C9 | CYP3A4 1622/4885TSHR 4502/4885PIK3CA 2165/4885 |
| US-20220380342-A1 | BIPHENYL DERIVATIVES FOR BLOCKING PD-1/PD-L1 INTERACTION, PREPARATION METHOD THEREFOR AND USE THEREOF | CD274, PDCD1, PDCD1LG2 | CYP3A4 260/4885TSHR 935/4885PIK3CA 1098/4885 |
| US-20100087680-A1 | METHOD FOR PRODUCING BIARYL COMPOUND | NISCH, BLVRB, BBOX1 | CYP3A4 177/4885TSHR 1688/4885PIK3CA 2327/4885 |
| US-11459339-B2 | Biaryl derivative, preparation method thereof and pharmaceutical application thereof | PDCD1, PDCD1LG2, CD274 | CYP3A4 1135/4885TSHR 825/4885PIK3CA 1678/4885 |
| US-20210052585-A1 | SUBSTITUTED 1,1'-BIPHENYL COMPOUNDS, ANALOGUES THEREOF, AND METHODS USING SAME | HAVCR2, HMBS, CDV3 | CYP3A4 87/4885TSHR 3115/4885PIK3CA 1981/4885 |
| US-20210040118-A1 | IMMUNOMODULATORS, COMPOSITIONS AND METHODS THEREOF | IL2, IL5, TSLP | CYP3A4 2133/4885TSHR 3204/4885PIK3CA 2827/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.